Abstract: An electronic device is provided. The electronic device includes a plurality of antennas and a communication circuit configured to electrically connect with at least one of the plurality of antennas, wherein the communication circuit is configured to obtain information of a level of a transmit power and transmit a signal based on a designated antenna among the plurality of antennas if the level of the transmit power is less than a level, determine an antenna for signal transmission among the plurality of antennas if the level of the transmit power is greater than or equal to the level, and perform an antenna switching operation of selecting the determined antenna.

Abstract: A semiconductor package includes a first semiconductor chip stacked on a package substrate in which a first surface of the first semiconductor chip faces the package substrate and a second surface that is opposite to the first surface, a second semiconductor chip stacked on the first semiconductor chip that includes a third surface facing the first semiconductor chip and a fourth surface that is opposite to the third surface, and an integral adhesive structure that substantially continuously fills a first space between the package substrate and the first semiconductor chip and a second space between the first and second semiconductor chips. The integral adhesive structure includes an extension protruding from outer sidewalls of the first and second semiconductor chips. The extension has one continuously convex sidewall between a level of the first surface and a level of the fourth surface.

Abstract: A semiconductor package includes a first semiconductor chip stacked on a package substrate in which a first surface of the first semiconductor chip faces the package substrate and a second surface that is opposite to the first surface, a second semiconductor chip stacked on the first semiconductor chip that includes a third surface facing the first semiconductor chip and a fourth surface that is opposite to the third surface, and an integral adhesive structure that substantially continuously fills a first space between the package substrate and the first semiconductor chip and a second space between the first and second semiconductor chips. The integral adhesive structure includes an extension protruding from outer sidewalls of the first and second semiconductor chips. The extension has one continuously convex sidewall between a level of the first surface and a level of the fourth surface.

Abstract: A method and apparatus are provided for controlling multiple processors in order to reduce current consumption in electronic device. An electronic device includes an application processor (AP) configured to control a plurality of functions; a communication processor (CP) electronically connected to the AP; and a sensor module or a communication module electronically connected to the CP. When the AP enters a sleep state, the CP is configured to control at least one function among the plurality of functions based on information collected from the sensor module or the communication module according to a discontinuous reception (DRX) operating period.

Abstract: An electronic device, a gateway device, and signal transmission and reception methods thereof are provided. The electronic device includes a communication unit and a control unit. The communication unit is configured to transmit and to receive a signal to and from another communication entity. The control unit is configured to determine whether to activate a wireless local area network (WLAN), and to transmit information about activation or deactivation of the WLAN to a packet data network so as to maintain a created channel and authentication for data transmission and reception.

Abstract: Methods and systems for providing an elegant and efficient multi-protocol eventing layer are disclosed. The multi-protocol eventing layer includes a converged container capable of handling multiple types of protocols to manage events while using an open source database. Accordingly, the multi-protocol eventing layer efficiently provides real-time or near real-time eventing to a plurality of devices for scalability and performance enhancement.

Abstract: Packet loss at a standby server during failover results when the primary fails. There is currently always some amount of packet traffic that is inbound to the primary that is lost during the failover interval. With existing solutions, this packet loss during failover is inevitable. The problem is that when this information is lost, the standby has the state of the last commit, so the standby will have the state information that is old and representative of system state accurately only to the system state at the time of the last commit. One solution is a method in which all inbound data packets targeted to be delivered to a primary software application, such as a virtualized software application, running in a primary virtual machine, are continuously monitored and copied by a Network Replication Device for simultaneous delivery to a backup image of the software application running on a standby system.

Abstract: Packet loss at a standby server during failover results when the primary fails. There is currently always some amount of packet traffic that is inbound to the primary that is lost during the failover interval. With existing solutions, this packet loss during failover is inevitable. The problem is that when this information is lost, the standby has the state of the last commit, so the standby will have the state information that is old and representative of system state accurately only to the system state at the time of the last commit. One solution is a method in which all inbound data packets targeted to be delivered to a primary software application, such as a virtualized software application, running in a primary virtual machine, are continuously monitored and copied by a Network Replication Device for simultaneous delivery to a backup image of the software application running on a standby system.