Abstract: A coating apparatus includes: a nozzle having a nozzle front end configured to spray a coating solution and a head configured to store the coating solution; a movement axis configured to cause the nozzle to move back and forth in a straight line; a rotating connection member configured to connect the movement axis with the nozzle and allow the nozzle to rotate; a stage disposed under the movement axis; and a cleaning means disposed at an end of the movement axis, and having a nozzle front end insertion unit in a concave shape of the nozzle front end and a base fixing the insertion unit, wherein the nozzle is fixed in a normal direction of a surface of the stage by the movement axis, moves back and forth in an extension direction of the movement axis, and rotates with respect to the movement axis.

Abstract: A coating apparatus includes: a nozzle having a nozzle front end configured to spray a coating solution and a head configured to store the coating solution; a movement axis configured to cause the nozzle to move back and forth in a straight line; a rotating connection member configured to connect the movement axis with the nozzle and allow the nozzle to rotate; a stage disposed under the movement axis; and a cleaning means disposed at an end of the movement axis, and having a nozzle front end insertion unit in a concave shape of the nozzle front end and a base fixing the insertion unit, wherein the nozzle is fixed in a normal direction of a surface of the stage by the movement axis, moves back and forth in an extension direction of the movement axis, and rotates with respect to the movement axis.

Abstract: A coating apparatus includes: a nozzle having a nozzle front end configured to spray a coating solution and a head configured to store the coating solution; a movement axis configured to cause the nozzle to move back and forth in a straight line; a rotating connection member configured to connect the movement axis with the nozzle and allow the nozzle to rotate; a stage disposed under the movement axis; and a cleaning means disposed at an end of the movement axis, and having a nozzle front end insertion unit in a concave shape of the nozzle front end and a base fixing the insertion unit, wherein the nozzle is fixed in a normal direction of a surface of the stage by the movement axis, moves back and forth in an extension direction of the movement axis, and rotates with respect to the movement axis.

Abstract: Provided are a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method. Particularly, there are provided a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method that are adapted to improve process efficiency and etch uniformity at the back surface of a substrate.

Abstract: Provided are a plasma processing apparatus and method. The plasma processing apparatus includes a chamber, an upper electrode, a lower electrode, a substrate support, and a movement member. The upper electrode is disposed at an inner upper portion of the chamber. The lower electrode faces the upper electrode at an inner lower portion of the chamber to support a substrate such that a bevel of the substrate is exposed in a substrate level etching process. The substrate support is disposed between the upper electrode and the lower electrode to support the substrate such that a central region of a bottom surface of the substrate is exposed in a substrate backside etching process. The movement member is configured to move the substrate support to separate the substrate from the substrate support in the substrate backside etching process.

Abstract: A coating apparatus includes: a nozzle having a nozzle front end configured to spray a coating solution and a head configured to store the coating solution; a movement axis configured to cause the nozzle to move back and forth in a straight line; a rotating connection member configured to connect the movement axis with the nozzle and allow the nozzle to rotate; a stage disposed under the movement axis; and a cleaning means disposed at an end of the movement axis, and having a nozzle front end insertion unit in a concave shape of the nozzle front end and a base fixing the insertion unit, wherein the nozzle is fixed in a normal direction of a surface of the stage by the movement axis, moves back and forth in an extension direction of the movement axis, and rotates with respect to the movement axis.

Abstract: Provided are a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method. Particularly, there are provided a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method that are adapted to improve process efficiency and etch uniformity at the back surface of a substrate.

Abstract: Provided are a plasma processing apparatus and method. The plasma processing apparatus includes a chamber, an upper electrode, a lower electrode, a substrate support, and a movement member. The upper electrode is disposed at an inner upper portion of the chamber. The lower electrode faces the upper electrode at an inner lower portion of the chamber to support a substrate such that a bevel of the substrate is exposed in a substrate level etching process. The substrate support is disposed between the upper electrode and the lower electrode to support the substrate such that a central region of a bottom surface of the substrate is exposed in a substrate backside etching process. The movement member is configured to move the substrate support to separate the substrate from the substrate support in the substrate backside etching process.