Patents by Inventor Hysong-seob Kim

Hysong-seob Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including multiple chips and separate groups of leads
    Patent number: 8723333
    Abstract: Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: May 13, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chul Park, Hysong-seob Kim, Kun-dae Yeom, Gwang-man Lim
  • Semiconductor Package Including Multiple Chips And Separate Groups of Leads
    Publication number: 20120217656
    Abstract: Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.
    Type: Application
    Filed: May 7, 2012
    Publication date: August 30, 2012
    Inventors: Chul Park, Hysong-seob Kim, Kun-dae Yeom, Gwang-man Lim
  • Semiconductor package including multiple chips and separate groups of leads
    Patent number: 8193626
    Abstract: Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: June 5, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chul Park, Hysong-seob Kim, Kun-dae Yeom, Gwang-man Lim
  • SEMICONDUCTOR PACKAGE
    Publication number: 20100117217
    Abstract: Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.
    Type: Application
    Filed: December 3, 2009
    Publication date: May 13, 2010
    Inventors: Chul Park, Hysong-seob Kim, Kun-dae Yeom, Gwang-man Lim