Patents by Inventor Hyu-ha Lee

Hyu-ha Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110284936
    Abstract: A semiconductor device and a method of fabricating a semiconductor device. The semiconductor device includes an interlayer insulation layer pattern, a metal wire pattern exposed by a passage formed by a via hole formed in the interlayer insulation layer pattern to input and output an electrical signal, and a plated layer pattern directly contacting the metal wire pattern and filling the via hole. The method includes forming an interlayer insulation layer having a metal wire pattern to input and output an electrical signal formed therein, forming a via hole to define a passage that extends through the interlayer insulation layer until at least a part of the metal wire pattern is exposed, and forming a plated layer pattern to fill the via hole and to directly contact the metal wire pattern by using the metal wire pattern exposed through the via hole as a seed metal layer.
    Type: Application
    Filed: May 16, 2011
    Publication date: November 24, 2011
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Ju-il CHOI, Jae-hyun Phee, Hyu-ha Lee, Ho-jin Lee, Son-kwan Hwang