Abstract: A light emitting apparatus is disclosed. The light emitting apparatus includes a light-transmissive substrate having a top surface and a bottom surface, at least one semiconductor light emitting device disposed on the top surface of the light-transmissive substrate, a reflective part disposed over the semiconductor light emitting device to reflect light from the semiconductor light emitting device toward the light-transmissive substrate, and a first wavelength converter disposed between the light-transmissive substrate and the reflective part.

Abstract: A light emitting device is disclosed. The light emitting device includes: a light emitting diode emitting light having a peak wavelength in the range of 415 nm to 435 nm; and a wavelength conversion unit disposed on the light emitting diode, wherein the wavelength conversion unit includes cyan phosphors emitting light having a peak wavelength in a cyan light wavelength band and red phosphors emitting light having a peak wavelength in a red light wavelength band, and a ratio of an output of light having a wavelength in the range of 435 nm to 465 nm to a total output of light emitted from the light emitting device is approximately equal to or less than 3%.

Abstract: A backlight unit including a backlight module and a backlight control module. The backlight module includes a printed circuit board including blocks arranged in an M×N matrix, in which M and N are natural numbers of 2 or greater, and M blocks are arranged in a horizontal direction and N blocks are arranged in a vertical direction, and at least one light emitting device disposed on each of the blocks. The backlight control module is configured to perform a dimming control of the M×N blocks such that the at least one light emitting device in one block can be controlled independently from other light emitting devices disposed in the remaining blocks that are disposed in the horizontal direction and in the vertical direction with respect to the one block.

Abstract: A backlight unit including a backlight module and a backlight control module. The backlight module includes a printed circuit board including blocks, and light emitting diode (LED) chips disposed on the blocks, and the backlight control module is configured to perform a dimming control of the LED chips. Each of the LED chips includes light emitting cells spaced apart from each other, each of the light emitting cells including a lower semiconductor layer, an upper semiconductor layer, and an active layer therebewteen, in which the lower semiconductor layers are partially exposed, connection structures electrically connecting the light emitting cells to each other, and an insulation layer disposed between the light emitting cells and the connection structures, the insulation layer covering a portion of the exposed lower semiconductor layers and having a width wider than the connection structures.

Abstract: A direct type backlight unit disposed under a liquid crystal panel includes a backlight module including a printed circuit board including blocks arranged in an M×N matrix, in which M and N are natural numbers of 2 or greater, light emitting devices disposed on the printed circuit board such that at least one light emitting device is disposed in each block, each of the light emitting devices including light emitting cells disposed on a single substrate, and optical members disposed on the light emitting devices, each of the optical members being configured to change a light beam distribution of a corresponding light emitting device, and a backlight control module configured to control dimming levels of the light emitting devices and to independently control the light emitting devices disposed in different blocks.

Abstract: A display device includes a display panel and a backlight unit configured to provide light towards the display panel. The backlight unit includes a backlight module including multi junction technology (MJT) light emitting diodes (LEDs) disposed on blocks disposed on a printed circuit board, an operating power generator configured to generate a DC voltage based on an input voltage, and an operation controller configured to independently control an operation of each of the blocks, the operation controller disposed in an IC of drive circuits. Each of the blocks includes at least one of the MJT LEDs, a single anode, and a single cathode. Each of the MJT LEDs includes at least two light emitting cells disposed in a single LED chip, and anodes of the blocks are connected to the operating power generator, and cathodes of the blocks are directly connected to the IC of drive circuits.

Abstract: The present invention relates to an LED lamp. In the LED lamp, light may be emitted in lateral and rear directions as well as in a front direction to obtain light distribution characteristics similar to those of an incandescent lamp, and heat generated when the LED emits light may be effectively dissipated.

Abstract: An indirect lighting apparatus includes a light-emitting device, a reflector disposed above the light-emitting device, and a wavelength conversion layer disposed on a surface of the reflector facing the light-emitting device and spaced apart from the light-emitting device. The wavelength conversion layer includes phosphors configured to change the wavelength of light emitted from the light-emitting device. The reflector is configured to reflect light emitted from the wavelength conversion layer, back towards the wavelength conversion layer.

Abstract: A light emitting diode (LED) package includes a package body having a recessed portion, a first lead electrode and a second lead electrode spaced apart from each other, and a light emitting device arranged in the recessed portion and electrically connected to the first lead electrode and the second lead electrode. The LED package is configured to be driven by an alternating current (AC) and by a voltage higher than that for driving one light emitting diode.

Abstract: A light emitting module includes a wafer having first and second surfaces, a light emitting diode chip disposed on the first surface of the wafer, a power supply device for supplying power to the light emitting diode chip, a photoelectric conversion device for converting sunlight into electricity and providing it to the power supply device, and first and second insulation films disposed on a first surface of the power supply device that faces the wafer, and an opposing second surface of the power supply device, respectively.

Abstract: Heteronuclear radioisotope nanoparticle of core-shell structure and a preparation method thereof are provided. The Heteronuclear radioisotope nanoparticle of core-shell structure comprising core of two different radioisotopes selected from a group consisting of 198Au, 63Ni, 110mAg, 64Cu, 60Co, 192Ir and 103Pd, and a shell comprising SiO2 surrounding the core. The Heteronuclear radioisotope nanoparticle of core-shell can be used as a tracer for the purpose of detecting variation of volume ratio or for the evaluation of the behavior characteristic of a water resource, based on information about phase ratio in the flow of multiphase fluid existing in a process which is operated under extreme condition such as high temperature and/or high pressure conditions.

Abstract: A method of fabricating a light-emitting device, the method including forming a first resin comprising a phosphor inside a cavity of a package body on which a light-emitting diode chip is mounted, measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor, and correcting the color coordinates by forming a second resin on the first resin. The first resin is not fully cured before measuring and correcting the color coordinates.

Abstract: A light-emitting device includes a substrate including a first electrode and a second electrode, a light-emitting diode (LED) chip electrically connected to the first and the second electrodes, and a phosphor sheet disposed on an upper surface of the LED chip, a first transparent part disposed under the phosphor sheet, and a second transparent part disposed between the phosphor sheet and the LED chip. The first transparent part contacts the second transparent part.

Abstract: Exemplary embodiments of the present invention provide a light emitting device enabling correction of color coordinates into a desired target bin, and a method of fabricating the same. The method includes forming a first resin containing phosphors inside a cavity of a package body on which a light emitting diode chip is mounted, measuring color coordinates of light emitted by combination of the light emitting diode chip and the first resin, and correcting the color coordinates by forming a second resin on the first resin.

Abstract: A light emitting device is disclosed. The light emitting device includes: a light emitting diode emitting light having a peak wavelength in the range of 415 nm to 435 nm; and a wavelength conversion unit disposed on the light emitting diode, wherein the wavelength conversion unit includes cyan phosphors emitting light having a peak wavelength in a cyan light wavelength band and red phosphors emitting light having a peak wavelength in a red light wavelength band, and a ratio of an output of light having a wavelength in the range of 435 nm to 465 nm to a total output of light emitted from the light emitting device is approximately equal to or less than 3%.

Abstract: The present invention relates to a light-emitting diode package having a plurality of inner leads, a plurality of outer leads extending from the inner leads, a slug electrically connected to at least one of the inner leads, the slug having a thermally conductive material, a light-emitting chip arranged on the slug, and a housing supporting the light-emitting diode package.

Abstract: Methods, systems, and devices are disclosed for implementing and fabricating electrochemical solar cells including dye-sensitized and perovskite-sensitized solar cells. In one aspect, a dye-sensitized solar cell device includes a cathode including a metal mesh structure that is optically transmissive and electrically conductive, an anode including a metal base layer that is optically opaque and electrically conductive, one or more layers of a semiconductive oxide coupled to the anode, the one or more layers of the semiconductive oxide including nanostructures having a photosensitive dye material coating, in which the anode generates photoelectric energy based on absorption of light by the photosensitive dye material, and an electrolyte of a substantially transparent substance and formed between the cathode and the one or more layers of a semiconductive oxide.

Abstract: The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.

Abstract: Disclosed herein is a light emitting device including: a substrate; a light emitting diode (LED) chip disposed on the substrate; and a phosphor sheet disposed on an upper portion of the LED chip and including alignment members formed on a lower surface thereof. The alignment members contact the LED chip, such that the phosphor sheet is aligned with the LED chip.

Abstract: A portable terminal is provided. The portable terminal includes a mounting member configured to be capable of being attached to/detached from a housing of the portable terminal, a connection member configured to extend from the mounting member and to selectively enclose at least a part of the housing, and a cover element connected to an end of the connection member to open/close a display device installed on the front surface of the housing. The portable terminal provided with the protection cover has an advantage in that the increase of the thickness of the terminal can be minimized because the protection cover may be disposed on a side surface or an edge of the rear surface of the housing by the mounting member.