Abstract: A positive electrode active material particle includes a core that contains lithium cobalt oxide represented by the following Chemical Formula LiaCo(1-x)MxO2-yAy and a shell that is coated on the surface of the core and contains composite metal oxide of a metal with an oxidation number of +2 and a metal with an oxidation number of +3. In particular, M is at least one selected from the group consisting of Ti, Mg, Zn, Si, Al, Zr, V, Mn, Nb and Ni. A is oxygen-substitutional halogen and 1.00?a?1.05, 0?x?0.05, and 0?y?0.001.

Abstract: A positive electrode for a lithium secondary battery includes a positive electrode collector, a first positive electrode active material layer formed on the positive electrode collector and includes a first positive electrode active material, and a second positive electrode active material layer formed on the first positive electrode active material layer and includes a second positive electrode active material. The first positive electrode active material and the second positive electrode active material include a lithium nickel-cobalt-based oxide in which an amount of nickel among total metallic components excluding lithium is 80 atm % or more, the first positive electrode active material has a molar ratio of nickel to cobalt of 18 or more, and the second positive electrode active material has a molar ratio of nickel to cobalt of less than 18.

Abstract: A positive electrode active material for a lithium secondary battery comprising lithium transition metal oxide particles having a core-shell structure which includes a core portion and a shell portion disposed on a surface of the core portion. Wherein, the average crystallite size of the core portion is smaller than an average crystallite size of the shell portion and an amount of nickel among total transition metals included in the core portion and the shell portion is 80 atm % or more. A positive electrode active material, which suppresses decomposition of an electrolyte solution and occurrence of micro cracks of the positive electrode active material during charge and discharge by forming an average crystallite size of a core portion of the high-nickel positive electrode active material smaller than an average crystallite size of a shell portion, and a method of preparing the same.

Abstract: An apparatus for constructing a library for deriving a material composition using empirical result, which enables acceleration of research on the material-properties relationship. By applying the empirical results of the material composition, missing data of the material compositions can be statistically calculated by using supervised non-linear imputation techniques. The completed composition information of the materials is passed as an input of machine learning material-properties relationship prediction.

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.

Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.

Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.

Abstract: An improvement of joint reliability between Sn-yAg (0?y?4.0) solder and Ni—P under-bump metallic layers is achieved by cobalt (Co) addition. A solder joint with improved joint reliability is formed between a solder part of an electronic packaging and an under-bump metallic (UBM) layer, which has a specific structure comprising Sn-yAg-xCo (0.02?x?0.1, 0?y?4.0) alloy solder containing cobalt (Co) ingredient bonded to a Ni—P UBM. Also, a solder joint with a joint structure comprising Sn-yAg-xCo (0.02?x?0.1, 0?y?4.0) alloy solder with addition of Co ingredient and Ni—P UBM is formed, which is inserted between a PCB substrate and a silicon chip to join the same.