Patents by Inventor Hyuck Mo LEE

Hyuck Mo LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS AND METHOD FOR CONSTRUCTING LIBRARY FOR DERIVING MATERIAL COMPOSITION
    Publication number: 20210166791
    Abstract: An apparatus for constructing a library for deriving a material composition using empirical result, which enables acceleration of research on the material-properties relationship. By applying the empirical results of the material composition, missing data of the material compositions can be statistically calculated by using supervised non-linear imputation techniques. The completed composition information of the materials is passed as an input of machine learning material-properties relationship prediction.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 3, 2021
    Inventors: Seung Bum HONG, Eun Ae CHO, Jong Min YUK, Hye Ryung BYON, Yong Soo YANG, Pyuck Pa CHOI, Jong Hwa SHIN, Hyuck Mo LEE, CHI HAO LIOW, Seong Woo CHO, Gun PARK, Yong Ju LEE, Yoon Su SHIM, Moo Ny NA, Ho Sun JUN, Ki Hoon BANG, Myung Joon KIM, Chae Hwa JEONG, Seung Gu KIM, Chung Ik OH, Hong Jun KIM, Jae Gyu KIM, Ji Min OH, Ji Won YEOM, Seong Mun EOM, Hyoung Kyu KIM, Young Joon HAN, Dae Hee LEE, Ho Jun LEE, Jae Woon KIM, Jae Wook SHIN, Hyeon Muk KANG, Jae Yeol PARK, Han Beom JEONG, Jae Sang LEE, Joon Ha CHANG, Yo Han KIM, Su Jung KIM, Hyun Jeong OH, Arthur Baucour, Jae Wook HAN, Kyu Seon JANG, Hye Sung JO, Bo Ryung YOO, Hyeon Jin PARK, Min Gwan CHO, Jun Hyung PARK, Yea Eun KIM, Seok Hwan MIN, Jung Woo CHOI, Young Tae PARK, Doo Sun HONG
  • Lead free solder bumps
    Patent number: 9156111
    Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: October 13, 2015
    Assignees: MK ELECTRON CO., LTD., HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, KOREA ELECTRONICS TECHNOLOGY INSTITUTE
    Inventors: Sung Jae Hong, Keun Soo Kim, Chang Woo Lee, Jung Hwan Bang, Yong Ho Ko, Hyuck Mo Lee, Jae Won Chang, Ja Hyun Koo, Jeong Tak Moon, Young Woo Lee, Won Sik Hong, Hui Joong Kim, Jae Hong Lee
  • LEAD-FREE SOLDER, SOLDER PASTE AND SEMICONDUCTOR DEVICE
    Publication number: 20150151386
    Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 4, 2015
    Applicants: MK ELECTRON CO., LTD., HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION, KOREA ELECTRONICS TECHNOLOGY INSTITUTE, KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung Jae HONG, Keun Soo KIM, Chang Woo LEE, Jung Hwan BANG, Yong Ho KO, Hyuck Mo LEE, Jae Won CHANG, Ja Hyun KOO, Jeong Tak MOON, Young Woo LEE, Won Sik HONG, Hui Joong KIM, Jae Hong LEE
  • Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles
    Patent number: 8496873
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: July 30, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES
    Publication number: 20120272790
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Application
    Filed: June 13, 2012
    Publication date: November 1, 2012
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES
    Publication number: 20100031848
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Application
    Filed: May 8, 2009
    Publication date: February 11, 2010
    Inventors: Kwi-Jong LEE, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION
    Publication number: 20090212422
    Abstract: An improvement of joint reliability between Sn-yAg (0?y?4.0) solder and Ni—P under-bump metallic layers is achieved by cobalt (Co) addition. A solder joint with improved joint reliability is formed between a solder part of an electronic packaging and an under-bump metallic (UBM) layer, which has a specific structure comprising Sn-yAg-xCo (0.02?x?0.1, 0?y?4.0) alloy solder containing cobalt (Co) ingredient bonded to a Ni—P UBM. Also, a solder joint with a joint structure comprising Sn-yAg-xCo (0.02?x?0.1, 0?y?4.0) alloy solder with addition of Co ingredient and Ni—P UBM is formed, which is inserted between a PCB substrate and a silicon chip to join the same.
    Type: Application
    Filed: July 30, 2008
    Publication date: August 27, 2009
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyuck Mo LEE, Moon Gi CHO, Dong Hoon KIM