Abstract: A method of making a semiconductor device that includes forming a vertical access transistor including forming bit lines in a first direction on a substrate, forming a polysilicon pillar as a sacrificial pillar over each bit line of the bit lines, forming a gate oxide on side surfaces of the polysilicon pillar, forming a word line, in a second direction, on the polysilicon pillar with the gate oxide interposed between the word line and the polysilicon pillar, the second direction being not substantially parallel to the first direction, after forming the word line, removing the polysilicon pillar so as to leave a vertical void in place of the polysilicon pillar, filling the vertical void with an oxide semiconductor that serves as a channel for the vertical access transistor; and forming a cell capacitor over the channel of the vertical access transistor.

Abstract: Fin field effect transistors (FinFETs) having various different thicknesses of gate oxides and related apparatuses, methods, and computing systems are disclosed. An apparatus includes first FinFETs, second FinFETs, and third FinFETs. The first FinFETs include a first gate oxide material, a second gate oxide material, and a third gate oxide material. The second FinFETs include the second gate oxide material and the third gate oxide material. The third FinFETs include the third gate oxide material. A method includes forming the first gate oxide material on first fins, second fins, and third fins; removing the first gate oxide material from the second fins and the third fins; forming a second gate oxide material over the first fins, the second fins, and the third fins; and removing the second gate oxide material from the third fins.

Abstract: A recessed access device comprises a conductive gate in a trench in semiconductor material. A gate insulator extends along sidewalls and around a bottom of the conductive gate between the conductive gate and the semiconductor material. A pair of source/drain regions are in upper portions of the semiconductor material on opposing lateral sides of the trench. A channel region in the semiconductor material below the pair of source/drain regions extends along sidewalls and around a bottom of the trench. The gate insulator comprises a low-k material and a high-k material. The low-k material is characterized by its dielectric constant k being no greater than 4.0. The high-k material is both (a) and (b), where: (a): characterized by its dielectric constant k being greater than 4.0; and (b): comprising SixMyO, where “M” is one or more of Al, metal(s) from Group 2, Group 3, Group 4, Group 5, and the lanthanide series of the periodic table; “x” is 0.999 to 0.6; and “y” is 0.001 to 0.

Abstract: One illustrative IC product disclosed herein includes first and second final gate structures and an insulating gate separation structure positioned between the first and second final gate structures. In one embodiment, the insulating gate separation structure has a stepped bottom surface with a substantially horizontally oriented bottom central surface that is surrounded by a substantially horizontally oriented recessed surface, wherein the substantially horizontally oriented bottom central surface is positioned a first level above the substrate and the substantially horizontally oriented recessed surface is positioned at a second level above the substrate, wherein the second level is greater than the first level.

Abstract: One illustrative IC product disclosed herein includes first and second final gate structures and an insulating gate separation structure positioned between the first and second final gate structures. In one embodiment, the insulating gate separation structure has a stepped bottom surface with a substantially horizontally oriented bottom central surface that is surrounded by a substantially horizontally oriented recessed surface, wherein the substantially horizontally oriented bottom central surface is positioned a first level above the substrate and the substantially horizontally oriented recessed surface is positioned at a second level above the substrate, wherein the second level is greater than the first level.

Abstract: One illustrative method disclosed herein includes, among other things, forming a sacrificial gate structure above a semiconductor substrate, the sacrificial gate structure comprising a sacrificial gate insulation layer and a sacrificial gate electrode material, performing a first gate-cut etching process to thereby form an opening in the sacrificial gate electrode material and forming an internal sidewall spacer in the opening. In this example, the method also includes, after forming the internal sidewall spacer, performing a second gate-cut etching process through the opening, the second gate-cut etching process being adapted to remove the sacrificial gate electrode material, performing an oxidizing anneal process and forming an insulating material in at least the opening.

Abstract: One illustrative method disclosed herein includes, among other things, forming a sacrificial gate structure above a semiconductor substrate, the sacrificial gate structure comprising a sacrificial gate insulation layer and a sacrificial gate electrode material, performing a first gate-cut etching process to thereby form an opening in the sacrificial gate electrode material and forming an internal sidewall spacer in the opening. In this example, the method also includes, after forming the internal sidewall spacer, performing a second gate-cut etching process through the opening, the second gate-cut etching process being adapted to remove the sacrificial gate electrode material, performing an oxidizing anneal process and forming an insulating material in at least the opening.

Abstract: A mask read-only memory (ROM) includes parallel doping lines of a second conductivity type formed in a substrate of a first conductivity type, a first insulation film formed on the doping lines and the substrate, conductive pads fainted on the first insulation film, a second insulation film formed on the first insulation film and the conductive pads, parallel wires formed on the second insulation film extending perpendicular to the doping lines, contact plugs formed in the first insulation film that connect the doping lines to the conductive pads, and vias formed in the second insulation film that connect the conductive pads to the wires, wherein crossings of the doping lines and the wires define memory cells, contact plugs and vias are formed in memory cells of a first type, and at least one of the contact plug and via are missing from memory cells of a second type.

Abstract: A mask read-only memory (ROM) includes parallel doping lines of a second conductivity type formed in a substrate of a first conductivity type, a first insulation film formed on the doping lines and the substrate, conductive pads fainted on the first insulation film, a second insulation film formed on the first insulation film and the conductive pads, parallel wires formed on the second insulation film extending perpendicular to the doping lines, contact plugs formed in the first insulation film that connect the doping lines to the conductive pads, and vias formed in the second insulation film that connect the conductive pads to the wires, wherein crossings of the doping lines and the wires define memory cells, contact plugs and vias are formed in memory cells of a first type, and at least one of the contact plug and via are missing from memory cells of a second type.