Patents by Inventor Hyuk Hwi NA

Hyuk Hwi NA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11605959
    Abstract: Provided is a battery control system-in-package including a package substrate, a wireless charger integrated circuit (IC) module mounted on the package substrate, a wired charger IC module mounted on the package substrate, a battery protection IC module mounted on the package substrate, and a single mold provided on the package substrate to encapsulate the wireless charger IC module, the wired charger IC module, and the battery protection IC module.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: March 14, 2023
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Ja Guen Gu, Chi Sun Song, Seong Beom Park, Sun Ho Kim
  • Publication number: 20220396016
    Abstract: Provided is a stack molding machine including an upper mold having formed therein a first runner and a first gate serving as a path of a resin material, a first intermediate plate provided under and combined with the upper mold, and having formed therein a first molding connected to the first gate to mold at least a portion on a first substrate placed under the first intermediate plate, a dummy plate provided under and spaced a certain distance apart from the first intermediate plate, a second intermediate plate provided under the dummy plate, and having formed therein a second molding connected to a second gate to mold at least a portion under a second substrate placed under the dummy plate, and a lower mold having formed therein a second runner and the second gate serving as a path of the resin material, and combined with the second intermediate plate.
    Type: Application
    Filed: April 26, 2022
    Publication date: December 15, 2022
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Sang Hoon AHN, Jae Ku PARK, Eun Bin LEE, Sang Dae KIM, Dong Jin JANG
  • Publication number: 20220322537
    Abstract: Provided is a method of fabricating a battery protection circuit package, the method including preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) including at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon, mounting the complex package substrate on a lead frame including at least one metal tab for connection to a battery cell, and encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal.
    Type: Application
    Filed: February 24, 2021
    Publication date: October 6, 2022
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Sang Hoon AHN, Hyun Seok LEE
  • Patent number: 11452213
    Abstract: Provided is a method of fabricating a battery protection circuit package, the method including preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) including at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon, mounting the complex package substrate on a lead frame including at least one metal tab for connection to a battery cell, and encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: September 20, 2022
    Assignee: ITM SEMICONDUCTOR CO., LTD
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Sang Hoon Ahn, Hyun Seok Lee
  • Patent number: 11375623
    Abstract: A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: June 28, 2022
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee
  • Publication number: 20220117306
    Abstract: Provided are a dual-heating tobacco heater and heating method capable of achieving optimal heating efficiency by initially rapidly heating a tobacco container such as a tobacco stick through direct heating and then maintaining the temperature and reducing power consumption through induction heating, and a heated tobacco product. The dual-heating tobacco heater may include a heating element having a shape corresponding to at least a part of a tobacco container to heat the tobacco container, a first heater being in thermal contact with the heating element to heat the heating element through resistive heating, a second heater spaced apart from the heating element by a certain distance to heat the heating element through induction heating, and an insulating member provided between the first and second heaters.
    Type: Application
    Filed: July 30, 2021
    Publication date: April 21, 2022
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Sang Seob LIM, Chi Sun SONG, Seong Beom PARK
  • Publication number: 20210368869
    Abstract: A control circuit module package of an electronic cigarette according to an aspect of the present invention includes a package substrate, a plurality of control circuit elements mounted on the package substrate for controlling operations of the electronic cigarette and controlling charging of a battery inside the electronic cigarette, and a molding part that integrally encapsulates the plurality of control circuit elements.
    Type: Application
    Filed: May 21, 2021
    Publication date: December 2, 2021
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Ja Guen GU, Chi Sun SONG, Seong Beom PARK, Sun Ho KIM
  • Publication number: 20210368631
    Abstract: Provided is a method of fabricating a battery protection circuit package, the method including preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) including at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon, mounting the complex package substrate on a lead frame including at least one metal tab for connection to a battery cell, and encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal.
    Type: Application
    Filed: February 24, 2021
    Publication date: November 25, 2021
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Sang Hoon AHN, Hyun Seok LEE
  • Publication number: 20210257283
    Abstract: Provided is a notebook battery protection circuit package including a package substrate, a fuel gauge integrated circuit (FGIC) module mounted on the package substrate, a protection integrated circuit (IC) module mounted on the package substrate, a charge/discharge transistor module mounted on the package substrate, and a mold provided on the package substrate to encapsulate the FGIC module, the protection IC module, and the charge/discharge transistor module into one.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 19, 2021
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Ja Guen GU, Chi Sun SONG, Seong Hwan JEONG, Hyeon Soo CHOI
  • Publication number: 20210257846
    Abstract: Provided is a battery control system-in-package including a package substrate, a wireless charger integrated circuit (IC) module mounted on the package substrate, a wired charger IC module mounted on the package substrate, a battery protection IC module mounted on the package substrate, and a single mold provided on the package substrate to encapsulate the wireless charger IC module, the wired charger IC module, and the battery protection IC module.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Ja Guen GU, Chi Sun SONG, Seong Beom PARK, Sun Ho KIM
  • Patent number: 10900855
    Abstract: Provided is a pressure sensor apparatus including a lead frame, a pressure sensing element mounted on the lead frame to measure a relative pressure between a first part and a second part, and a housing including a reference medium inlet hole to apply a pressure of a reference medium to the first part, and including a target medium inlet hole to apply a pressure of a target medium to the second part, wherein the reference medium inlet hole is provided in a first surface of the housing, wherein the target medium inlet hole is provided in a second surface of the housing other than the first surface, and wherein the lead frame includes one or more insertion terminals configured to be inserted into and electrically connected to terminal holes of a wire connector.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: January 26, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Ja Guen Gu, Dong Hee Lee, Hyang Won Kang, Hyung Jin Lim, Yeong Seol Kwon
  • Publication number: 20210014976
    Abstract: A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.
    Type: Application
    Filed: June 22, 2020
    Publication date: January 14, 2021
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Young Seok KIM, Sang Hoon AHN, Jae Ku PARK, Sung Hee WANG, Eun Bin LEE
  • Patent number: 10845378
    Abstract: Provided are a multi-sensor device capable of implementing a pressure sensor function and an acceleration sensor function by using one housing, and a method of manufacturing the multi-sensor device. The multi-sensor device may include a lead frame, a pressure sensing element electrically connected to the lead frame and being capable of measuring a relative pressure between a first part and a second part thereof, an acceleration sensor module electrically connected to the lead frame and being capable of measuring acceleration applied to an ambient environment thereof, and a housing mounted to protect at least a part of the lead frame, the pressure sensing element, and the acceleration sensor module, including a reference medium inlet hole to apply a pressure of a reference medium to the first part, and including a target medium inlet hole to apply a pressure of a target medium to the second part.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: November 24, 2020
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Ja Guen Gu, Hyang Won Kang
  • Patent number: 10840564
    Abstract: According to an aspect of the present invention, there is provided a battery protection circuit module including a first positive terminal and a first negative terminal electrically connected to electrode terminals of a battery bare cell, a second positive terminal and a second negative terminal electrically connected to a charger or an electronic device, a first protection circuit unit including a first single field-effect transistor connected between at least one of the first positive and negative terminals and at least one of the second positive and negative terminals, and a first protection integrated circuit (P-IC) for controlling the first single field-effect transistor, and a second protection circuit unit including a second single field-effect transistor connected between at least one of the first positive and negative terminals and at least one of the second positive and negative terminals, and a second P-IC for controlling the second single field-effect transistor.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: November 17, 2020
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn
  • Patent number: 10756550
    Abstract: According to an aspect of the present invention, there is provided a battery protection circuit module including a first positive terminal and a first negative terminal electrically connected to electrode terminals of a battery bare cell, a second positive terminal and a second negative terminal electrically connected to a charger or an electronic device, a single field-effect transistor including a drain terminal, a source terminal, a gate terminal, and a well terminal, wherein the drain terminal is electrically connected to the first negative terminal and the source terminal is electrically connected to the second negative terminal, and a protection integrated circuit (P-IC) for controlling charging/discharging of the battery bare cell by controlling the gate terminal to control whether to switch on the single field-effect transistor and controlling a bias voltage of the well terminal by using an internal switch.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: August 25, 2020
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn
  • Patent number: 10648880
    Abstract: Provided are a pressure sensor device and a method of manufacturing the same. The pressure sensor device includes a housing including an air inlet and a fluid inlet provided in different directions, a substrate provided in an inner space of the housing and including a through-hole through which the air passes, and a pressure sensor chip mounted on the substrate to cover the through-hole in such a manner that a pressure of a fluid flowing in from the fluid inlet is applied to a top surface thereof and a bottom surface thereof is exposed to the air through the through-hole, in order to measure the pressure of the fluid relative to a pressure of the air, wherein the inner space is divided into an upper region and a lower region with respect to the substrate, and wherein the upper region is divided into a first inner region in which the pressure sensor chip is provided and a second inner region through which the air passes.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: May 12, 2020
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Ja Guen Gu, Hyang Won Kang
  • Patent number: D930588
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: September 14, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee
  • Patent number: D932436
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: October 5, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee
  • Patent number: D932437
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: October 5, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee
  • Patent number: D932438
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: October 5, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee