Patents by Inventor Hyuk-Jeen Suh

Hyuk-Jeen Suh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7667686
    Abstract: The use of motion sensing to perform sophisticated command control and data input into a portable device is disclosed. A motion sensor is embedded or fixedly attached to a portable device to measure movement, motion or tilt of the device in one-, two- or three-dimensions when the portable device is used to air-write or make gestures. The use of full motion information such as rate of change of motion or tilt angle to perform functions and commands is also disclosed. In addition, the use of air-writing to input search criteria and filter schemes for portable devices to manage, search, and sort through various data, files, and information is disclosed.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: February 23, 2010
    Assignee: MEMSIC, Inc.
    Inventor: Hyuk-Jeen Suh
  • Publication number: 20070176898
    Abstract: The use of motion sensing to perform sophisticated command control and data input into a portable device is disclosed. A motion sensor is embedded or fixedly attached to a portable device to measure movement, motion or tilt of the device in one-, two- or three-dimensions when the portable device is used to air-write or make gestures. The use of full motion information such as rate of change of motion or tilt angle to perform functions and commands is also disclosed. In addition, the use of air-writing to input search criteria and filter schemes for portable devices to manage, search, and sort through various data, files, and information is disclosed.
    Type: Application
    Filed: July 14, 2006
    Publication date: August 2, 2007
    Inventor: Hyuk-Jeen Suh
  • Patent number: 6248668
    Abstract: A micro-scale gap fabrication process using a dry releasable dendritic material sacrificial layer. The fabrication process produces micro-scale gaps, such as those required between a suspended microstructure and an opposing surface in MEMS. The dendritic sacrificial layer is releasable by heating the dendritic material past its decomposition point after forming the microstructure. The sacrificial layer may be applied to a wafer, for example, by spin coating a solution including the dissolved dendritic material. The sacrificial layer, after being formed, may be patterned and prepared for accepting structural material for the microstructure. After a desired microstructure or microstructures are formed around the sacrificial layer, the layer is dry releasable by heating.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: June 19, 2001
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: David Beebe, Hyuk-Jeen Suh, Jeffrey S. Moore, Pamidighantam Bharathi