Patents by Inventor Hyuk-jin CHO

Hyuk-jin CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package and method of manufacturing the same
    Patent number: 10971662
    Abstract: A light-emitting diode (LED) package includes a light-emitting structure, a transmissive material layer on the light-emitting structure, and a support structure covering at least a portion of a side surface of the transmissive material layer, a side surface of the light-emitting structure, and at least a portion of a bottom surface of the light-emitting structure.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyuk-jin Cho, Dong-hoon Lee
  • LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160372642
    Abstract: A light-emitting diode (LED) package includes a light-emitting structure, a transmissive material layer on the light-emitting structure, and a support structure covering at least a portion of a side surface of the transmissive material layer, a side surface of the light-emitting structure, and at least a portion of a bottom surface of the light-emitting structure.
    Type: Application
    Filed: May 4, 2016
    Publication date: December 22, 2016
    Inventors: Hyuk-jin CHO, Dong-hoon LEE
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE PACKAGE SUCH AS LIGHT-EMITTING DIODE PACKAGE
    Publication number: 20160284927
    Abstract: Provided is a method of manufacturing a light-emitting diode (LED) package. The method includes: preparing a support structure on which a plurality of LED chips, each of which includes a semiconductor stack structure, and a light-transmissive material layer covering the plurality of LED chips are formed; mounting the support structure, on which the LED chips and the light-transmissive material layer are formed, on a cutting stage; and cutting the light-transmissive material layer, the semiconductor stack structure, and the support structure between the plurality of LED chips, by using a cutting device having a pattern blade on the cutting stage to singulate each of the individual LED packages.
    Type: Application
    Filed: March 11, 2016
    Publication date: September 29, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyuk-jin CHO, Kyoung-jun KIM, Dong-hoon LEE