Patents by Inventor Hyuk Joo YOON

Hyuk Joo YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of manufacturing the same
    Patent number: 10269725
    Abstract: A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: April 23, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Woo Choi, Hyun Kook Cho, Hyuk Joo Yoon, Hyuk Ki Kwon
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180019211
    Abstract: A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.
    Type: Application
    Filed: June 27, 2017
    Publication date: January 18, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Woo CHOI, Hyun Kook CHO, Hyuk Joo YOON, Hyuk Ki KWON