Abstract: Provided is a structure of a pouch which may be used in a high-capacity battery having high capacity and high stiffness, wherein the pouch may include an upper housing module which includes a metallic base plate having a concave-shaped accommodation space and polymer layers formed on one surface or both surfaces of the base plate, and a lower pouch sheet which is combined with a lower surface of the upper housing module to seal the accommodation space.

Abstract: Provided are a pouch for a secondary battery including a first sheet and a second sheet, and a frame unit which is sealed by the first sheet and the second sheet and includes an accommodating part for accommodating an electrode assembly including electrode tabs therein, and a secondary battery including the pouch. According to the present invention, since a structure of a pouch for a secondary battery may include a frame unit capable of accommodating a large electrode assembly, a high-capacity and large-area secondary battery having high capacity and high stiffness may be realized.

Abstract: A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.

Abstract: Disclosed is a technology for preventing electrodes in a secondary battery from being short-circuited with each other. An electrode assembly includes a cathode and anode of which a cathode collector and anode collector are coated with a cathode active material and anode active material, respectively, and a separator disposed between the cathode and the anode. An insulation layer is disposed on a tab part of the cathode collector constituting the cathode. Thus, an insulation layer may be disposed on an end (a tab part) of the cathode collector that is used as a tab of the cathode electrode in the structure of the electrode assembly to prevent the cathode from being physically short-circuited with the anode in the sequentially stacked structure of cathode/separator/anode.

Abstract: Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.

Abstract: Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.

Abstract: An impeller mixer of electrode slurry includes a container (100) filled with raw materials of electrode slurry, impellers (110) have different shapes from each other and are multi-layered, the impellers being rotatably provided in the container (100) and configured to mix the raw materials of electrode slurry, and a driving part (120) disposed on a bottom portion of the container (100) and coupled to the impellers (110) through a coupling shaft to rotate the impeller, wherein the coupling shaft is disposed above the driving part. Therefore, multi-layered impellers (11) rotating at a high speed efficiently disperse raw materials of electrode slurry in a short time and also allow the raw materials to be uniformly mixed, resulting in an increase in work efficiency.

Abstract: A fabricating method of a unit structure for accomplishing an electrode assembly formed by a stacking method, and an electrochemical cell including the same are disclosed. The fabricating method of the electrode assembly is characterized with fabricating the unit structure by conducting a first process of laminating and forming a bicell having a first electrode/separator/second electrode/separator/first electrode structure, and conducting a second process of laminating first separator/second electrode/second separator one by one on one of the first electrode among two of the first electrodes.

Abstract: Provided is a method of manufacturing an electrode assembly which is different from a stack folding method and a stack method. The method includes forming a unit structure, which comprises a stacked structure formed by sequentially stacking a first electrode, a first separator, a second electrode, and a second separator, or a structure formed by repeatedly forming the stacked structure a plurality of times (operation S10), forming the electrode assembly by repeatedly stacking the unit structure into a plurality of layers (operation S20), and discharging gas interposed between the layers by pressing the electrode assembly (operation S30).

Abstract: Disclosed is a technology for preventing electrodes in a secondary battery from being short-circuited with each other. An electrode assembly includes a cathode and anode of which a cathode collector and anode collector are coated with a cathode active material and anode active material, respectively, and a separator disposed between the cathode and the anode. An insulation layer is disposed on a tab part of the cathode collector constituting the cathode. Thus, an insulation layer may be disposed on an end (a tab part) of the cathode collector that is used as a tab of the cathode electrode in the structure of the electrode assembly to prevent the cathode from being physically short-circuited with the anode in the sequentially stacked structure of cathode/separator/anode.

Abstract: Provided is a structure of a pouch which may be used in a high-capacity battery having high capacity and high stiffness, wherein the pouch may include an upper housing module which includes a metallic base plate having a concave-shaped accommodation space and polymer layers formed on one surface or both surfaces of the base plate, and a lower pouch sheet which is combined with a lower surface of the upper housing module to seal the accommodation space.

Abstract: Provided are a pouch for a secondary battery including a first sheet and a second sheet, and a frame unit which is sealed by the first sheet and the second sheet and includes an accommodating part for accommodating an electrode assembly including electrode tabs therein, and a secondary battery including the pouch. According to the present invention, since a structure of a pouch for a secondary battery may include a frame unit capable of accommodating a large electrode assembly, a high-capacity and large-area secondary battery having high capacity and high stiffness may be realized.

Abstract: An electrode assembly according to the present disclosure includes an electrode stack part formed by stacking at least one radical unit having a four-layered structure of a first electrode, a separator, a second electrode and a separator, and an electrode fixing part for wrapping and fixing the electrode stack part. The electrode assembly according to the present disclosure may be fabricated by means of a stacking process other than a folding process, and may accomplish accurate alignment and stable fixing.

Abstract: Provided is a cathode including a cathode current collector, a cathode tab protruding from the cathode current collector, and an insulation layer coated with an insulating material on the cathode tab, and a secondary battery including the cathode. Since the cathode of the present invention includes an insulation layer on a cathode tab, the present invention may prevent an internal short circuit which may occur due to cell deformation or sharp edges of electrodes, which are formed during cutting of the electrodes in a preparation process of the battery, when the electrodes are stacked, or may prevent a physical short circuit between the cathode and the anode due to shrinkage of a separator in a high-temperature atmosphere. In a case where the cathode is used in a lithium secondary battery, safety and reliability in battery performance may be significantly improved.

Abstract: A fabricating method of a unit structure for accomplishing an electrode assembly formed by a stacking method, and an electrochemical cell including the same are disclosed. The fabricating method of the electrode assembly is characterized with fabricating the unit structure by conducting a first process of laminating and forming a bicell having a first electrode/separator/second electrode/separator/first electrode structure, conducting a second process of laminating a first separator on one of the first electrode among two of the first electrodes, and conducting a third process of laminating second separator/second electrode one by one on the other first electrode among the two of the first electrodes.

Abstract: A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.

Abstract: A fabricating method of a unit structure for accomplishing an electrode assembly formed by a stacking method, and an electrochemical cell including the same are disclosed. The fabricating method of the electrode assembly is characterized with fabricating the unit structure by conducting a first process of laminating and forming a bicell having a first electrode/separator/second electrode/separator/first electrode structure, and conducting a second process of laminating first separator/second electrode/second separator one by one on one of the first electrode among two of the first electrodes.

Abstract: A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.

Abstract: A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.