Patents by Inventor Hyun A. Chun

Hyun A. Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof
    Patent number: 8956919
    Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: February 17, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Hyun A. Chun, Jae Bong Choi, Sung Won Lee, Sung Wuk Ryu, Hyuk Soo Lee, Sai Ran Eom
  • Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof
    Patent number: 8658471
    Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: February 25, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Hyun A. Chun, Jae Bong Choi, Sung Won Lee, Sung Wuk Ryu, Hyuk Soo Lee, Sai Ran Eom
  • Structure for Multi-Row Leadframe and Semiconductor Package Thereof and Manufacture Method Thereof
    Publication number: 20120038036
    Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.
    Type: Application
    Filed: December 23, 2009
    Publication date: February 16, 2012
    Applicant: LG Innotek Co., Ltd.
    Inventors: Hyun A. Chun, Jae Bong Choi, Sung Won Lee, Sung Wuk Ryu, Hyuk Soo Lee, Sai Ran Eom