Patents by Inventor Hyun Ahn

Hyun Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153831
    Abstract: An apparatus and method for measuring air currents on the surface of a substrate, which can accurately measure the magnitude and direction of air currents on the surface of a wafer with wafer-type air current measurement sensors, are provided. The apparatus includes: a first air current measurement module measuring a magnitude of air currents on a surface of a first substrate, which is processed in accordance with a semiconductor manufacturing process; a second air current measurement module measuring a movement direction of the air currents; and a power module supplying power to the first and second air current measurement modules, wherein the first air current measurement module, the second air current measurement module, and the power module are mounted on a second substrate, which has the same shape as the first substrate.
    Type: Application
    Filed: October 19, 2023
    Publication date: May 9, 2024
    Inventors: Yong Jun SEO, Su Jin CHAE, Sang Hyun SON, Sang Min HA, Young Sik BANG, Jeong Mo HWANG, Dong Ok AHN
  • Patent number: 11978602
    Abstract: A switch apparatus, includes: a base module including a base case, and a moving magnet movably mounted in the base case; and a manipulation module including a manipulation case, and a first magnet fixedly mounted in the manipulation case, wherein the moving magnet moves between a hold position and a releasable position, the hold position refers to a position in which the manipulation module is held onto the base module as an attractive force acts between the moving magnet and the first magnet, and the releasable position refers to a position in which the manipulation module is releasable from the base module as a repulsive force acts between the moving magnet and the first magnet.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: May 7, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, NOVATECH CO., LTD, ALPS ELECTRIC KOREA CO., LTD.
    Inventors: Sang Hoon Shin, Hoo Sang Lee, Jong Hyun Choi, Dae Woo Park, Youn Tak Kim, Nam I Jo, Choon Teak Oh, Hong Jun Choi, Kon Hee Chang, Woo Joo Ahn
  • Publication number: 20240147845
    Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.
    Type: Application
    Filed: December 6, 2023
    Publication date: May 2, 2024
    Inventors: Kyoung-Jin PARK, Tae-Jin LEE, Jae-Hoon SHIM, Yoo Jin DOH, Hee-Choon AHN, Young-Kwang KIM, Doo-Hyeon MOON, Jeong-Eun YANG, Su-Hyun LEE, Chi-Sik KIM, Ji-Song JUN
  • Patent number: 11972371
    Abstract: The present invention can provide a hotel reservation system that searches for vacant rooms at lower prices even after making a reservation. A method of hotel reservation that is performed by a server, comprises steps of: obtaining identification information corresponding to vacant rooms of hotels from external servers; obtaining reservation information of a vacant room from a user terminal; transmitting to the user terminal whether a reservation is confirmed; searching for a first vacant room available within a predetermined period from a check-in date until before the check-in date; and providing a reservation change notification through the user terminal if determining the vacant room with the lower price than that of the reserved vacant room by comparing a price of the reserved vacant room and a price of the first vacant room that is available within the predetermined period.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: April 30, 2024
    Inventor: So Hyun Ahn
  • Publication number: 20240136290
    Abstract: A semiconductor device having simplicity in design and improved performance and methods for fabricating the same are provided. The semiconductor device includes a substrate including a frontside and a backside opposite the frontside, an electronic device on the frontside of the substrate, an interlayer insulating layer covering the electronic device, a frontside wiring structure on the interlayer insulating layer, a backside wiring structure on the backside of the substrate, and at least one unit chain connecting the electronic device with the backside wiring structure, the unit chain including a through plug passing through the substrate, a connection contact on the interlayer insulating layer, a first chain plug passing through the interlayer insulating layer to connect the through plug with the connection contact, and a second chain plug passing through the interlayer insulating layer to be connected to the through plug.
    Type: Application
    Filed: May 23, 2023
    Publication date: April 25, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jee Woong KIM, Jin Kyu KIM, Ho Jun KIM, Jae Hyun AHN, So Ra YOU
  • Publication number: 20240131576
    Abstract: Proposed are a highly reliable metal molded article manufactured using a combination of a mold made of an anodic aluminum oxide film and a patternable mold, and a method for manufacturing the same.
    Type: Application
    Filed: February 21, 2022
    Publication date: April 25, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240138018
    Abstract: A user equipment assistance information (UAI) negotiation method, for a user equipment (UE) of mobile communication includes receiving a first OtherConfig element of an RRC reconfiguration message comprising a plurality of configuration parameters with SETUP values from a network terminal; sending a first UAI including a first value of a first configuration parameter of the configuration parameters to the network terminal; and receiving a first RRC reconfiguration message corresponding to the first UAI from the network terminal.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 25, 2024
    Applicant: MediaTek Singapore Pte. Ltd.
    Inventors: Hung-Yueh Chen, Yu-Lun Chang, Byeng Hyun Kim, JUNG SHUP SHIN, Hung-Yuan Yang, Jun-Jie Su, Kyung Hyun Ahn
  • Patent number: 11964250
    Abstract: Methods and systems for synthesizing multicompartment capsules are disclosed, as well as multicompartment polymer capsules formed in accordance with disclosed techniques. At least one plurality of polymer capsules are formed via a capsule-forming process. A feed solution and a reservoir solution are provided, each comprising a biopolymer. The feed solution biopolymer and the reservoir solution biopolymer have opposite charges. Droplets of the feed solution are introduced into the reservoir solution, thereby forming via electrostatic complexation a plurality of polymer capsules. At least a portion of the resulting polymer capsules are then encapsulated in a larger polymer capsule via a similar process, wherein the feed solution utilized for the encapsulation process also comprises the formed smaller capsules.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: April 23, 2024
    Inventors: Hyuntaek Oh, Srinivasa R. Raghavan, William E. Bentley, Xi Lu, Jessica Lynn Terrell, So Hyun Ahn
  • Patent number: 11961742
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 16, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Song, Wang Gu Lee, Eun Young Lee, Seo Yeon Ahn, Pil Je Sung
  • Publication number: 20240118337
    Abstract: Proposed are a guide plate and a test device including the guide plate capable of being insulated from electrically conductive contact pins and capable of blocking signal interference between the electrically conductive contact pins.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 11, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240120196
    Abstract: A method of manufacturing a semiconductor device includes: forming electrode holes by etching a mold structure including a mold layer and a support layer which are stacked on a substrate; forming lower electrode pillars filling the electrode holes; etching a portion of the support layer between the lower electrode pillars to form a support pattern having a through-hole exposing a portion of a top surface of the mold layer; removing the mold layer through the through-hole to expose sidewalls of the lower electrode pillars; and selectively forming lower electrode patterns on the sidewalls and top surfaces of the lower electrode pillars.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 11, 2024
    Inventors: Hyun-Suk Lee, Jungoo Kang, Gihee Cho, Sanghyuck Ahn
  • Publication number: 20240118762
    Abstract: The present disclosure relates to a touch system and a method for selectively operating firmware. In particular, it relates to a touch system and a method for selectively operating touch firmware in a touch device by storing a number of pieces of touch firmware supporting a number of host operating systems (OS) respectively in different storing areas of a nonvolatile memory, identifying a host OS installed in the host through communication with the host, and selectively operating the touch firmware supporting the identified host OS.
    Type: Application
    Filed: November 10, 2023
    Publication date: April 11, 2024
    Applicant: SILICON WORKS CO., LTD.
    Inventor: Su Hyun AHN
  • Publication number: 20240115515
    Abstract: The present invention relates to a liver-specific drug delivery carrier comprising a nucleic acid nanoparticle and cholesterol; a liver-specific complex; a pharmaceutical composition for prevention or treatment of liver disease using the same; and a method for preventing or treating liver disease.
    Type: Application
    Filed: February 9, 2023
    Publication date: April 11, 2024
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Dae-Ro AHN, Kyoung-Ran KIM, Junghyun KIM, Ji Eun LEE, Ji hyun BACK
  • Publication number: 20240113122
    Abstract: A semiconductor device includes; a bottom electrode on a substrate, a supporting pattern between the bottom electrode and an adjacent bottom electrode, a top electrode covering the bottom electrode and the supporting pattern, and a dielectric layer between the bottom electrode and the top electrode and between the supporting pattern and the top electrode. The bottom electrode may include a first portion including a seam and a second portion on the first portion, a top end of the second portion may be disposed at a height lower than an upper surface of the supporting pattern, and a portion of a bottom end of the second portion may be exposed to the seam.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Inventors: Gihee Cho, Sanghyuck Ahn, Hyun-Suk Lee, Jungoo Kang, Jin-Su Lee, Hongsik Chae
  • Publication number: 20240112968
    Abstract: Proposed are an anodic aluminum oxide film-based interposer for electrical connection and a manufacturing method therefor, a semiconductor package and a manufacturing method therefor, a multi-stacked semiconductor device and a manufacturing method therefor, and a display and a manufacturing method therefor that can cope with a narrow pitch between terminals and prevent an increase in current density and thermal energy density in a bump connection part. To this end, proposed is an interposer for electrical connection, in which a through-hole is provided in a body made of anodic aluminum oxide film and a first bonding material, an electrically conductive material, and a second bonding material are formed in the through-hole by electroplating. Here, fine trenches having repeated peaks and valleys in the circumferential direction are provided in an outer circumferential surface of a micro-bump.
    Type: Application
    Filed: March 23, 2022
    Publication date: April 4, 2024
    Applicant: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN
  • Publication number: 20240107002
    Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Se Yoon JEONG, Hui Yong KIM, Sung Chang LIM, Jin Ho LEE, Ha Hyun LEE, Jong Ho KIM, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Gwang Hoon PARK, Kyung Yong KIM, Tae Ryong KIM, Han Soo LEE
  • Patent number: 11939240
    Abstract: A sterilizing device includes a pipe having an inlet and an outlet and allowing fluid to move therethrough and a light source provided on one side of the pipe and providing light to the fluid. At least a portion of the pipe is provided in a spiral shape and the inlet and/or the outlet are arranged in a light emitting region.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: March 26, 2024
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jae Young Choi, Shi Hyun Ahn, Ki Yon Park, Woong Ki Jeong, Kyu Won Han
  • Publication number: 20240090707
    Abstract: A vacuum blender having a foreign body catching member mounted thereon, the foreign body catching member disposed outside a container cover such that one end is communicatably coupled to a discharge hole formed in the container cover, and the other end is communicatably coupled to a communication path enabling a vacuum pump to communicate with the container cover. When the vacuum pump is operated in a state where the two ends of the foreign body catching member are communicating with the discharge hole and the communication path, respectively, air inside a crushing container is discharged to the outside by passing through the vacuum pump via the discharge hole, the foreign body catching member, and the communication path, and, by means of moving relative to the container cover, the foreign body catching member disposed outside the container cover has the one end communicate with or be blocked from the discharge hole.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 21, 2024
    Inventors: Joung Geun Ahn, Byung Hyun An, Se Hee An, Kyung Soon Kim
  • Publication number: 20240093347
    Abstract: An embodiment provides a deposition device including a magnet part that includes magnets; and a substrate support that faces the magnet part and that supports a substrate, the substrate support includes a support plate and patterns formed on a first surface of the support plate, and each of the patterns corresponds to a space between neighboring magnets among the magnets or corresponds to the magnets.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Jung Hyun AHN, JAESUK MOON, Seung Jin LEE
  • Publication number: 20240090328
    Abstract: The present invention relates to a multi-component host material and an organic electroluminescent device comprising the same. By comprising a specific combination of the multi-component host compounds, the organic electroluminescent device according to the present invention can provide high luminous efficiency and excellent lifespan characteristics.
    Type: Application
    Filed: October 26, 2023
    Publication date: March 14, 2024
    Inventors: Hee-Choon AHN, Young-Kwang KIM, Su-Hyun LEE, Ji-Song JUN, Seon-Woo LEE, Chi-Sik KIM, Kyoung-Jin PARK, Nam-Kyun KIM, Kyung-Hoon CHOI, Jae-Hoon SHIM, Young-Jun CHO, Kyung-Joo LEE