Abstract: An apparatus for controlling a flow rate of fluid passing through a duct (10) includes a wedge (12) to produce a resistance against a flow of the fluid; pressure sensors (20-1, 20-2), to detect an inflow pressure and an outflow pressure at the upstream and the downstream of the duct (10), respectively, a flow rate controller (22) for measuring a flow rate corresponding to a differential pressure between the inflow and the outflow pressures, comparing the measured flow rate with a predetermined flow rate to regulate an opening angle at an outflow side of the duct (10) using a calculated opening angle, wherein the calculated opening angle being corresponded to a deviation of flow rate between the measured flow rate and the predetermined flow rate; and an error detector (28) for detecting an improper increase of the differential pressure to correctly adjust the opening angle regulated by the flow rate controller.

Abstract: A method for manufacturing a semiconductor and an apparatus for measuring slurry quality. The apparatus includes a plurality of slurry supply devices, a plurality of semiconductor processing devices, and an in-line monitoring system. The slurry supply devices have slurry supply lines. The semiconductor processing devices receive slurry from each of the slurry supply devices through the slurry supplying lines to perform semiconductor processing. The in-line monitoring system includes a plurality of sampling lines diverging from the plurality of slurry supplying lines. The particle sizes of the slurry are measured through each of the sampling lines. The monitoring system maintains the slurry quality in real time to increase yield from CMP (chemical-mechanical polishing).