Abstract: The present specification relates to a compound of Chemical Formula 1, a coating composition including the same, a method for preparing the compound, and an electronic device.

Abstract: The present application relates to a method for manufacturing a foldable backplate film, and according to one aspect of the present invention, a method for manufacturing a foldable backplate film that the foldable backplate film is manufactured by a method of cutting it in a direction from the release film to the protective film upon half-cutting, and then release-changing the release film, whereby by improving a half-cutting process, the foldable backplate does not fall off upon the release film peeling, is provided.

Abstract: The present disclosure relates to a surface protective film and a method for manufacturing an organic light emitting electronic device.

Abstract: Disclosed relates to a surface protective film including: a base layer; and an adhesive layer provided on one surface of the base layer, where the adhesive layer comprises a cured product of an adhesive composition, comprising: a urethane polymer; an acrylic polymer; and a curing agent, where the acrylic polymer comprises a monomer unit derived from an alkyl(meth)acrylate monomer having 10 or more carbon atoms, where a peel strength of the adhesive layer is 2 gf/in or more and 30 gf/in or less when a surface of the adhesive layer, opposite to a surface on which the base layer is provided, is peeled off from glass at a peel speed of 30 m/min and a peel angle of 180°, and where, in the adhesive composition, the acrylic polymer is comprised in an amount of 1 part by weight to 15 parts by weight based on 100 parts by weight of the urethane polymer.

Abstract: The present disclosure provides a surface protective film which is used in a process of fabricating an encapsulation layer for an organic light-emitting diode, and makes it possible to prevent bubbles from being generated in the protective film or the surface smoothness of the protective film from being degraded, due to solvent volatilization from the protective film. Specifically, the present disclosure provides a surface protective film including an adhesive layer provided on one surface of a substrate layer, wherein the adhesive layer includes a cured product of an adhesive composition including: a urethane-based resin having a photoreactive group at the end or side chain thereof; a monofunctional (meth)acrylate monomer; a crosslinking agent having two or more photoreactive groups at the end thereof; a photoinitiator; and a photoreactive siloxane additive, the adhesive composition being solvent-free.

Abstract: Provided are a polyorganosiloxane comprising a siloxane unit of Formula 1 and a siloxane unit of Formula 2, a release composition that can form a release layer capable of securing solvent resistance by maximizing a bonding force between a base film and the release layer, having an appropriate peel force even under room temperature and high temperature conditions, having a little change in the peel force even under high temperature and ultraviolet irradiation conditions, and securing an excellent residual adhesion rate, and a release film and a pressure-sensitive adhesive film comprising the release layer, (R1mR2nSiO(4-m-n/2)??[Formula 1] (R3pR4qSiO(4-p-q)/2)??[Formula 2] wherein all the variables are described herein.

Abstract: A curable composition is provided. The curable composition comprises a polyorganosiloxane component and a redox catalyst, and is capable of curing a pressure-sensitive adhesive composition without a curing process by heat or energy rays so as to form a pressure-sensitive adhesive layer having appropriate release peel force and residual bond ratio.

Abstract: A method and a device for transmitting and obtaining dynamic 3-dimensional (3D) avatar data are provided. The method for transmitting dynamic 3D avatar data may include generating a plurality of data elements configuring the dynamic 3D avatar data; performing first encoding and transmission for a first data element of the plurality of data elements; and performing second encoding and transmission for a second data element of the plurality of data elements. Each of at least one of the first data element or the second data element may be divided into a plurality of sub-data elements.

Abstract: The present specification relates to a compound, a method for preparing the same, and a single molecule, an oligomer and a polymer derived from the compound.

Abstract: The present application provides a pressure-sensitive adhesive layer comprising at least first and second regions having different physical properties, wherein the difference in physical properties, such as an elastic modulus or creep strain rate is maintained relatively large for each region, and the difference in physical properties, such as a peel force or recovery rate is maintained relatively small for each region.

Abstract: A method of encoding a dynamic mesh includes creating a base mesh through mesh decimation, subdividing the base mesh, extracting displacement information for the subdivided mesh, and encoding the base mesh and the displacement information. In this instance, mesh subdivision information for subdivision of the base mesh is encoded and signaled.

Abstract: The present specification relates to a compound of Chemical Formula 1, a method for preparing the same, and a single molecule and an oligomer derived from the compound.

Abstract: The present invention relates to a monomer composition for synthesizing recycled plastic which comprises an aromatic diol compound, wherein a ratio of aromatic diol compound derivative impurity according to Equation 1 is 0.5% or less, wherein the aromatic diol compound has a purity of 99.25% or more, and the monomer composition for synthesizing recycled plastic is recovered from a polycarbonate-based resin, a preparation method thereof, and a recycled plastic, and molded product using the same.

Abstract: The present disclosure relates to a surface protective film and a method for manufacturing an organic light emitting electronic device using the surface protective film.

Abstract: An image sensor includes a photoelectric converter configured to convert received light into charges in response to the received light and provide the charges to a first node, a transfer transistor configured to provide a voltage of the first node to a floating diffusion node, a reset transistor configured to reset a voltage of the floating diffusion node to a driving voltage based on a reset signal, a source follower transistor configured to provide a unit pixel output based on the voltage of the floating diffusion node, a select transistor connected to the source follower transistor and gated with a selection signal to output the unit pixel output to the outside, and a ferroelectric capacitor connected to the floating diffusion node, wherein the ferroelectric capacitor is configured to adjust a conversion gain of the floating diffusion node based on a conversion gain mode of the ferroelectric capacitor, the conversion gain mode being a first conversion gain mode, a second conversion gain mode, or a third co

Abstract: A semiconductor memory device having improved electrical characteristics is provided. The semiconductor memory device comprises a first semiconductor pattern separated from a substrate in a first direction, a first gate structure extending in the first direction and penetrating the first semiconductor pattern, a first conductive connecting line connected to the first semiconductor pattern and extending in a second direction different from the first direction, and a second conductive connecting line connected to the first semiconductor pattern. The first gate structure is between the first conductive connecting line and the second conductive connecting line, the first gate structure includes a first gate electrode and a first gate insulating film, and the first gate insulating film includes a first charge holding film contacting with the first semiconductor pattern.

Abstract: A pressure-sensitive adhesive, which is applied to a flexible device, thereby effectively responding to repeated deformation and recovery, causing no defects (for example, observation of deformation traces and the like) before and after deformation, having excellent cuttability and workability, and causing no lifting, delamination, and/or bubble generation, and a use thereof are provided.

Abstract: The present application provides a pressure-sensitive adhesive layer comprising at least first and second regions having different physical properties, wherein the difference in physical properties, such as an elastic modulus or creep strain rate is maintained relatively large for each region, and the difference in physical properties, such as a peel force or recovery rate is maintained relatively small for each region.

Abstract: A semiconductor memory device having improved electrical characteristics is provided. The semiconductor memory device comprises a first semiconductor pattern separated from a substrate in a first direction, a first gate structure extending in the first direction and penetrating the first semiconductor pattern, a first conductive connecting line connected to the first semiconductor pattern and extending in a second direction different from the first direction, and a second conductive connecting line connected to the first semiconductor pattern. The first gate structure is between the first conductive connecting line and the second conductive connecting line, the first gate structure includes a first gate electrode and a first gate insulating film, and the first gate insulating film includes a first charge holding film contacting with the first semiconductor pattern.

Abstract: Provided are an adhesive composition, an adhesive layer comprising the same and a foldable display comprising the same.