Abstract: A fastening device for different components is proposed. The device may include a first member having a through passage formed at a connecting end, and a second member including an insertion groove, into which a connecting end of a first member is introduced, and an inlet hole and an outlet hole, which are formed on the opposite side of the insertion groove to communicate with each other through the through passage. The device may also include a connector for fastening or releasing according to a rotational operation position while being inserted to reach the inlet hole, the through passage, and the outlet hole; and a damper positioned on one side of the connector and configured as a single elastic pressing body that prevents rotation of the connector and maintains a fixed state of the connector by contracting or restoring its original shape according to a rotational operation of the connector.

Abstract: A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.

Abstract: A method of manufacturing a display device includes disposing a polarizing layer on one surface of a display panel including a thin film transistor and a pixel electrode; cutting the polarizing layer using a cutting laser beam such that a side of the polarizing layer and a side of the display panel correspond to each other; applying a conductive paste on the side of the display panel; and patterning the conductive paste using a patterning laser beam.

Abstract: A display device includes a display area; a pad area including a first pad for supplying a data signal to the display area, second pads for transmitting a DC signal, and a dummy pad, wherein each of the first pad, the second pads, and the dummy pad has a surface as a top face thereof, wherein each of the surface of the first pad, the surface of the second pads, and the surface of the dummy pad has a corresponding vertical level in a thickness direction of the display device, wherein the vertical level of the surface of each of the second pads is higher than the vertical level of the surface of the first pad, wherein the vertical level of the surface of the dummy pad is lower than or equal to the vertical level of the surface of the first pad.

Abstract: The display device comprises a first base portion including display and non-display areas and a pad area, and a printed circuit film attached to the pad area of the first base portion, wherein pad electrodes on the first base portion and a first panel alignment mark on one side of the plurality of pad electrodes are disposed in the pad area, a first protective layer is on the pad electrodes, and a first open portion that exposes a portion of an upper surface of each pad electrode is defined in the protective layer, the printed circuit film includes a third base portion and lead electrodes on a lower surface of the third base portion and connected to the pad electrodes, and the first panel alignment mark includes a first panel alignment metal portion and a second open portion and surrounded by the first panel alignment metal portion on a plane.

Abstract: A display device includes: a display panel including a display area and a non-display area; a flexible printed circuit board overlapping and attached to the display panel; a pair of first alignment indicia disposed in the non-display area; a pair of second alignment indicia adjacent to the first alignment indicia; a pair of third alignment indicia disposed on the flexible printed circuit board.

Abstract: A bonding apparatus includes: an anisotropic conductive film (“ACF”) attachment unit which attaches a first ACF and a second ACF onto a display panel assembly; a compression unit which compresses a first chip-on-film (“COF”) on the first ACF and compresses a second COF on the second ACF; and a buffer unit which rotates the display panel assembly, on which the first ACF and the second COF are compressed, on a plane.

Abstract: A method of manufacturing a display device includes disposing a polarizing layer on one surface of a display panel including a thin film transistor and a pixel electrode; cutting the polarizing layer using a cutting laser beam such that a side of the polarizing layer and a side of the display panel correspond to each other; applying a conductive paste on the side of the display panel; and patterning the conductive paste using a patterning laser beam.

Abstract: A single source precursor for depositing ternary I-III-VI2 chalcopyrite materials useful as semiconductors. The single source precursor has the I-III-VI2 stoichiometry “built into” a single precursor molecular structure which degrades on heating or pyrolysis to yield the desired I-III-VI2 ternary chalcopyrite. The single source precursors effectively degrade to yield the ternary chalcopyrite at low temperature, e.g. below 500° C., and are useful to deposit thin film ternary chalcopyrite layers via a spray CVD technique. The ternary single source precursors according to the invention can be used to provide nanocrystallite structures useful as quantum dots. A method of making the ternary single source precursors is also provided.