Abstract: An overlay measurement device includes a transmission and receipt part and a processor connecting to the transmission and receipt part electrically. The processor obtains data transmitted from a user terminal through the transmission and receipt part, analyzes a recipe included in the data, and performs optimization of measurement options of a wafer, based on the recipe, after the recipe is analyzed.

Abstract: There are provided a computer-readable storage medium and an overlay measurement device therefor that records a data structure for storing data controlling an operation of an overlay measurement device. In a computer-readable storage medium that records a data structure for storing data controlling an operation of an overlay measurement device in one embodiment, the data includes information of a recipe that is input to allow the overlay measurement device to measure characteristics of a wafer through a manager program installed in a user terminal, and unique information of the overlay measurement device.

Abstract: An apparatus for manufacturing the electrode assembly, in which an electrode and a separator are alternately stacked on a stack table, and the separator is folded in a zigzag shape so that the electrode is disposed between the folded separators to manufacture the electrode assembly, has a separator supplier configured to supply the separator to the stack table, and a separator tension adjuster configured to constantly adjust tension of the separator supplied to the stack table. The separator supplier comprises a separator winding roll around which the separator is wound, and the separator tension adjuster adjusts a supply height of the separator winding roll to adjust the tension of the separator.

Abstract: The present disclosure relates to a gap prevention structure of a seat rail for a vehicle. The gap prevention structure includes: a lower rail configured to be fixed to a bottom of a vehicle body and to have a receiving space formed therein; an upper rail configured to have at least a portion thereof received in the receiving space and to slide in a longitudinal direction of the lower rail; a rolling bearing configured to be rotatably coupled to the upper rail and to roll and move in the receiving space in the longitudinal direction of the lower rail; and a gap prevention unit configured to limit rotation of the rolling bearing by pressing the rolling bearing while being inserted between the lower rail and the rolling bearing.

Abstract: An embodiment of the present invention relates to a cylindrical secondary battery in which a positive electrode terminal is adhered and fixed to a cylindrical can by an insulating sheet, and thus sealing between the cylindrical can and the positive electrode terminal can be facilitated due to an increased contact area.

Abstract: A cylindrical secondary battery includes: an electrode assembly including a first electrode plate and a second electrode plate; a cylindrical case having a disk-shaped top portion and a side portion extending from the top portion, the cylindrical case accommodating the electrode assembly; a cathode terminal extending through the top portion and insulated therefrom; a first current collector plate electrically connected to the first electrode plate and the cathode terminal; a second current collector plate electrically connected to the second electrode plate and the side portion of the cylindrical case; a cap plate coupled to the side portion and insulated therefrom; and an insulation tape between the top portion of the cylindrical case and the first current collector plate and covering the first current collector plate.

Abstract: An atomic layer etching method using a ligand exchange reaction may include a substrate providing step of putting a substrate with a thin film formed thereon into a reaction chamber, a halogenated thin film forming step of forming a halogenated thin film on a surface of the thin film by infusing a halogenated gas into the reaction chamber, and an etching step of etching the halogenated thin film by infusing a ligand without a metal or metal precursor into the reaction chamber with the substrate with the halogenated thin film.

Abstract: A manufacturing device for an electrode assembly includes an electrode supply unit that supplies an electrode, a separator supply unit that supplies a separator in first and second directions, and a guide roller that switches a direction in which the separator is supplied and presses the separator so that the separator and the electrode are adhered. One surface of the electrode supplied from the electrode supply unit is perpendicular to one surface of the separator supplied from the separator supply unit. The separator is bent by being pressed according to a movement of the electrode or a stacked body including the electrode. The bent separator covers one surface of the electrode.

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

Abstract: A method for bending an electrode tab is disclosed herein. The method may include: stacking an electrode and an separator to form an electrode assembly, connecting an electrode lead to an electrode tab protruding from the electrode assembly, primarily bending the electrode tab by moving a bending block disposed at one side of the electrode tab in a first direction directed toward the other side of the electrode tab, and secondarily bending the electrode tab by moving the bending block in a second direction different from the first direction.

Abstract: The present invention relates to a method of producing an acrylonitrile dimer, the method including: feeding an acrylonitrile monomer, a nonpolar solvent, an alcohol solvent, and a phosphorus-based catalyst to a dimerization reactor to perform a dimerization reaction and reaction product to a distillation column; feeding the acrylonitrile monomer, the nonpolar solvent, and the alcohol solvent from the distillation column to the dimerization reactor; feeding an acrylonitrile dimer and the phosphorus-based catalyst from the distillation column to an extraction device; oxidizing the phosphorus-based catalyst by feeding water including an acid component to the extraction device to inactivate the phosphorus-based catalyst; and separating the inactivated phosphorus-based catalyst and the acrylonitrile dimer.

Abstract: Provided is a method of preparing an acrylonitrile dimer including: supplying an acrylonitrile monomer, a phosphorus-based catalyst, and an alcohol solvent to a reactor to perform a dimerization reaction to produce dimerized reactants (S10); cooling the dimerized reactants to crystallize the phosphorus-based catalyst (S20); separating the crystallized phosphorus-based catalyst (S30); and supplying the dimerized reactants from which the phosphorus-based catalyst is separated to a distillation column to separate the acrylonitrile dimer (S40).

Abstract: An electrode for a secondary battery and a method for manufacturing the electrode are disclosed. According to an embodiment, a first cutting line and a second cutting line, along which an electrode sheet is cut, may cross each other to form a crossing area on the electrode sheet, and in the crossing area, the first cutting line may be formed as a straight line, and one end of the straight line may be connected to a curved line constituting a portion of the first cutting line, wherein the straight line may be connected to the curved line by a tangent line.

Abstract: Disclosed is a method for providing information for predicting a response to cancer treatment, the method including: obtaining information on a global DNA methylation level detected from a sample of a cancer patient; and evaluating a response to cancer treatment based on the information on the global DNA methylation level.

Abstract: Provided is a method of preparing an acrylonitrile dimer, the method including: supplying an acrylonitrile monomer, a phosphorus-based catalyst, an alcohol solvent, and an ionic liquid to a reactor to perform a dimerization reaction to prepare a single-phase dimerization reaction product (S10); supplying a reactor discharge stream including the dimerization reaction product to a first distillation column, separating the alcohol solvent and an unreacted acrylonitrile monomer from an upper discharge stream, and supplying a lower discharge stream including an acrylonitrile dimer, the ionic liquid, and the phosphorus-based catalyst to a second distillation column (S20); and separating an upper discharge stream including the acrylonitrile dimer and separating a lower discharge stream including the ionic liquid and the phosphorus-based catalyst, from the second distillation column (S30).

Abstract: An apparatus for manufacturing the electrode assembly, in which an electrode and a separator are alternately stacked on a stack table, and the separator is folded in a zigzag shape so that the electrode is disposed between the folded separators to manufacture the electrode assembly, has a separator supplier configured to supply the separator to the stack table, and a separator tension adjuster configured to constantly adjust tension of the separator supplied to the stack table. The separator supplier comprises a separator winding roll around which the separator is wound, and the separator tension adjuster adjusts a. supply height of the separator winding roll to adjust the tension of the separator.

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

Abstract: Systems and methods are provided for manufacturing a window from a transparent member. Forming the window may include forming of a groove by irradiating first laser light and removing a portion of a transparent member by irradiating second laser light focused at a depth of the groove. The first laser light may be emitted from a first laser generator and may be irradiated along an edge of a first area defined in a second surface of the transparent member. A second laser light may be focused to the depth of the groove, and thus a portion of the transparent member may be cut. The second laser light may be emitted by a second laser generator, and a focus of the second laser light may be located within the transparent member.

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.