Abstract: Provided is a method comprising form a primary processed glass including a bottom surface and a side wall extending in a direction crossing from the bottom surface and having a curvature by applying heat and pressure to a preliminary glass, seating the primary processed glass on a first part of a jig, and the jig including a first part, a second part protruding from the first part and in contact with a portion of the side wall, and a third part which rotates the first part, fixing a laser at a second position spaced apart from a first position where a jig assembly including a jig on which the primary processed glass is seated is positioned, moving the jig assembly to the second position, and forming a cover glass by the laser to ablate some portions of the side wall of the primary processed glass at the second position.

Abstract: An electrode for a secondary battery and a method for manufacturing the electrode are disclosed. According to an embodiment, a first cutting line and a second cutting line, along which an electrode sheet is cut, may cross each other to form a crossing area on the electrode sheet, and in the crossing area, the first cutting line may be formed as a straight line, and one end of the straight line may be connected to a curved line constituting a portion of the first cutting line, wherein the straight line may be connected to the curved line by a tangent line.

Abstract: An electrode for a secondary battery and a method for manufacturing the electrode are disclosed. According to an embodiment, a first cutting line and a second cutting line, along which an electrode sheet is cut, may cross each other to form a crossing area on the electrode sheet, and in the crossing area, the first cutting line may be formed as a straight line, and one end of the straight line may be connected to a curved line constituting a portion of the first cutting line, wherein the straight line may be connected to the curved line by a tangent line.

Abstract: The present disclosure relates to a battery cell for a secondary battery in which an electrode assembly including a cathode, an anode, and a separator interposed between the cathode and the anode is incorporated in a battery case. The cathode has a cathode tab extending from a cathode current collector formed on one side, and the anode has an anode tab extending from an anode current collector formed on one side. At a top area of the electrode assembly where the cathode tab and the anode tab protrude, the cathode tab and the anode tab each have a first bent portion and a second bent portion that are bent in a v shape. A protective tape is attached to the first bent portion, the second bent portion, and top areas of the electrode assembly adjacent to the first and second bent portions so as to cover them, and upper parts at both ends of the protective tape are chamfered.

Abstract: Systems and methods are provided for manufacturing a window from a transparent member. Forming the window may include forming of a groove by irradiating first laser light and removing a portion of a transparent member by irradiating second laser light focused at a depth of the groove. The first laser light may be emitted from a first laser generator and may be irradiated along an edge of a first area defined in a second surface of the transparent member. A second laser light may be focused to the depth of the groove, and thus a portion of the transparent member may be cut. The second laser light may be emitted by a second laser generator, and a focus of the second laser light may be located within the transparent member.

Abstract: An apparatus for manufacturing the electrode assembly, in which an electrode and a separator are alternately stacked on a stack table, and the separator is folded in a zigzag shape so that the electrode is disposed between the folded separators to manufacture the electrode assembly, has a separator supplier configured to supply the separator to the stack table, and a separator tension adjuster configured to constantly adjust tension of the separator supplied to the stack table. The separator supplier comprises a separator winding roll around which the separator is wound, and the separator tension adjuster adjusts a supply height of the separator winding roll to adjust the tension of the separator.

Abstract: A manufacturing device for an electrode assembly includes an electrode supply unit that supplies an electrode, a separator supply unit that supplies a separator in first and second directions, and a guide roller that switches a direction in which the separator is supplied and presses the separator so that the separator and the electrode are adhered. One surface of the electrode supplied from the electrode supply unit is perpendicular to one surface of the separator supplied from the separator supply unit. The separator is bent by being pressed according to a movement of the electrode or a stacked body including the electrode. The bent separator covers one surface of the electrode.

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

Abstract: A method for bending an electrode tab is disclosed herein. The method may include: stacking an electrode and an separator to form an electrode assembly, connecting an electrode lead to an electrode tab protruding from the electrode assembly, primarily bending the electrode tab by moving a bending block disposed at one side of the electrode tab in a first direction directed toward the other side of the electrode tab, and secondarily bending the electrode tab by moving the bending block in a second direction different from the first direction.

Abstract: The present invention relates to a method of producing an acrylonitrile dimer, the method including: feeding an acrylonitrile monomer, a nonpolar solvent, an alcohol solvent, and a phosphorus-based catalyst to a dimerization reactor to perform a dimerization reaction and reaction product to a distillation column; feeding the acrylonitrile monomer, the nonpolar solvent, and the alcohol solvent from the distillation column to the dimerization reactor; feeding an acrylonitrile dimer and the phosphorus-based catalyst from the distillation column to an extraction device; oxidizing the phosphorus-based catalyst by feeding water including an acid component to the extraction device to inactivate the phosphorus-based catalyst; and separating the inactivated phosphorus-based catalyst and the acrylonitrile dimer.

Abstract: Provided is a method of preparing an acrylonitrile dimer including: supplying an acrylonitrile monomer, a phosphorus-based catalyst, and an alcohol solvent to a reactor to perform a dimerization reaction to produce dimerized reactants (S10); cooling the dimerized reactants to crystallize the phosphorus-based catalyst (S20); separating the crystallized phosphorus-based catalyst (S30); and supplying the dimerized reactants from which the phosphorus-based catalyst is separated to a distillation column to separate the acrylonitrile dimer (S40).

Abstract: An electrode for a secondary battery and a method for manufacturing the electrode are disclosed. According to an embodiment, a first cutting line and a second cutting line, along which an electrode sheet is cut, may cross each other to form a crossing area on the electrode sheet, and in the crossing area, the first cutting line may be formed as a straight line, and one end of the straight line may be connected to a curved line constituting a portion of the first cutting line, wherein the straight line may be connected to the curved line by a tangent line.

Abstract: Disclosed is a method for providing information for predicting a response to cancer treatment, the method including: obtaining information on a global DNA methylation level detected from a sample of a cancer patient; and evaluating a response to cancer treatment based on the information on the global DNA methylation level.

Abstract: Provided is a method of preparing an acrylonitrile dimer, the method including: supplying an acrylonitrile monomer, a phosphorus-based catalyst, an alcohol solvent, and an ionic liquid to a reactor to perform a dimerization reaction to prepare a single-phase dimerization reaction product (S10); supplying a reactor discharge stream including the dimerization reaction product to a first distillation column, separating the alcohol solvent and an unreacted acrylonitrile monomer from an upper discharge stream, and supplying a lower discharge stream including an acrylonitrile dimer, the ionic liquid, and the phosphorus-based catalyst to a second distillation column (S20); and separating an upper discharge stream including the acrylonitrile dimer and separating a lower discharge stream including the ionic liquid and the phosphorus-based catalyst, from the second distillation column (S30).

Abstract: An apparatus for manufacturing the electrode assembly, in which an electrode and a separator are alternately stacked on a stack table, and the separator is folded in a zigzag shape so that the electrode is disposed between the folded separators to manufacture the electrode assembly, has a separator supplier configured to supply the separator to the stack table, and a separator tension adjuster configured to constantly adjust tension of the separator supplied to the stack table. The separator supplier comprises a separator winding roll around which the separator is wound, and the separator tension adjuster adjusts a. supply height of the separator winding roll to adjust the tension of the separator.

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

Abstract: Systems and methods are provided for manufacturing a window from a transparent member. Forming the window may include forming of a groove by irradiating first laser light and removing a portion of a transparent member by irradiating second laser light focused at a depth of the groove. The first laser light may be emitted from a first laser generator and may be irradiated along an edge of a first area defined in a second surface of the transparent member. A second laser light may be focused to the depth of the groove, and thus a portion of the transparent member may be cut. The second laser light may be emitted by a second laser generator, and a focus of the second laser light may be located within the transparent member.

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

Abstract: A fan-out semiconductor package includes a first connection member having a through-hole first and second semiconductor chips disposed in the through-hole, an encapsulant encapsulating the first and second semiconductor chips, a second connection member disposed on at least one side of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second semiconductor chips, and an insulating via in which at least a portion of the first connection member is removed in a thickness direction and is filled with an insulating material.