Abstract: Disclosed herein is a battery pack including a battery cell, having an electrode assembly mounted in a pouch-shaped battery case made of a laminate sheet including a metal layer and a resin layer and is sealed by thermal welding, mounted in a pack case, wherein the pack case includes a frame member constructed in a structure in which a receiving part for receiving the battery cell is open, opposite side sealing portions of the battery cell are mounted to the frame member such that the opposite side sealing portions cover the opposite sides of the frame member, and a sheathing film is applied to the outer surface of the frame member, to which the battery cell is mounted.

Abstract: The present invention related to a method for surface treatment and a method for forming fine wiring and more particularly, to a method for surface treatment of a substrate, including: preparing a substrate on which a fine wiring is to be formed; and treating the surface of the substrate with a fluorine containing liquid having a low boiling point, and a method for forming fine wiring using the same method. According to the present invention, not only the spreading of ink droplets but also the deterioration of the interface adhesion is avoided.

Abstract: It discloses a hybrid supercapacitor including a carbon aerogel cathode and a transition metal oxide aerogel anode which is able to increase energy density and power density with increase of overall cell potential and at the same time lower internal resistance of the electrode and equivalent series resistance by using a monolithic electrode with no use of current collector and binder.

Abstract: It discloses a hybrid supercapacitor including a carbon aerogel cathode and a surface-oxidized transition metal nitride aerogel anode which is able to increase energy density and power density with increase of overall cell potential and at the same time lower internal resistance of the electrode and equivalent series resistance by using a monolithic electrode with no use of current collector and binder.

Abstract: The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

Abstract: The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

Abstract: Disclosed herein is a secondary battery constructed in a structure in which pluralities of electrode tabs, protruding from an electrode assembly, are connected to corresponding electrode leads, and the electrode assembly is mounted in a receiving part, wherein a battery case is multi-formed, such that the battery case presses the upper end of the electrode assembly by a predetermined width, thereby preventing the upward movement of the electrode assembly, mounted in the receiving part, at the upper end space region of the receiving part, where the electrode assembly is spaced apart from the upper end of the receiving part, for the connection between the electrode tabs and the corresponding electrode leads, during the repetitive charge and discharge of the battery.

Abstract: The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

Abstract: It relates to a method for treating the surface of a printed circuit board resin and a printed circuit board resin treated thereby. The method may allows forming fine circuit patterns and improving the adhesive strength between metal patterns and the printed circuit board resin as well.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The method, which includes providing a base substrate in which a thermoplastic resin layer is formed; forming a circuit pattern on the thermoplastic resin layer by discharging a conductive ink by an inkjet method; curing the circuit pattern through the heating at a temperature that is lower than a melting point of the thermoplastic resin layer; sintering the circuit pattern through the heating; and burying at least a part of the circuit pattern in the thermoplastic resin layer by heating the thermoplastic resin layer and compressing the circuit pattern toward the thermoplastic resin layer, can provide a printed circuit board and a method for manufacturing the same, in which a fine circuit pattern can be formed by an inkjet method and the adhesive force between the circuit pattern and the base substrate can be improved.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention can include: forming a circuit pattern by discharging conductive ink on a carrier through inkjet printing, heating and sintering the circuit pattern, and transferring the circuit pattern on an insulation layer by stacking the carrier on the insulation layer such that the circuit pattern is buried in the insulation layer. In accordance with an embodiment of the present invention, a minute, precise circuit pattern can be formed through inkjet printing, and adhesion between the circuit pattern and the insulation layer can be improved.

Abstract: Disclosed is a UPS isolation control high speed transfer switch for switching a power supply path of a UPS to a bypass line and a power supply system equipped with the high speed transfer switch. The switch is isolated from the UPS and detects the output power of UPS, and switches a power supply path from a normal power line to the bypass line, by turning off the transfer switch of the bypass line after turning off an output breaker of a normal power line when the output power is deviated from a preset normal range. Furthermore, the switch performs a switching to the bypass line only when the output breaker of the UPS is actually turned off, after confirming the turn-off of the output breaker when switching the power supply path to the bypass line.

Abstract: Disclosed are methods of forming a printed circuit pattern and forming a guide, and a guide-forming ink. The method of forming a printed circuit pattern in accordance with the present invention includes forming a guide by using guide-forming ink having a slip property, curing the formed guide by in-situ UV, and forming a printed circuit pattern on the inside of the cured guide by using metal ink.

Abstract: According to the present invention, provided is a watchdog system for Uninterruptible Power Supply (UPS), and auto recovery method using the same. In case the power supply path of UPS is switched from the normal power line to the bypass line, the UPS watchdog system of the present invention is firstly compulsively recovers again the power supply path to the normal power line for given times and, nevertheless, in case it is not recovered, the power is supplied through the bypass line. Accordingly, in case the power supply path is switched to the bypass line due to the temporary disorder of UPS, it can be rapidly recovered to the normal power path, so that the power supply by the UPS apparatus can be more stably performed.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method, which includes forming a base pattern over one side of a negative photoresist, exposing the one side, attaching an insulation layer on the one side, developing the negative photoresist such that the base pattern is uncovered, and forming a circuit pattern over the base pattern, can increase the thickness of the circuit pattern and strengthen the adhesion between the circuit pattern and the insulation layer.

Abstract: A supercapacitor and a manufacturing method thereof are disclosed. With manufacturing method of Supercapacitor including: arranging a plurality of filters to be spaced at a designated interval apart, forming a first plating layer connecting one end of the filter, forming a second plating layer lengthened along the filter from the first plating layer, polymerizing to form a conductive polymer layer between the second plating layer, and removing the filter, capacitance (C), power (kw) and energy (E) can be increased as the space for absorbing electrons is widened, by making the surface area of an electrode wider than the a general film.

Abstract: A process for fabricating a field emitter electrode includes: impregnating a cathode and anode in an electrolyte containing carbon nanotubes dispersed therein and applying a predetermined voltage to the cathode and anode so as to deposit carbon nanotubes on a substrate provided on the anode; recovering the substrate and applying a conductive polymer onto the surface of the substrate having carbon nanotubes deposited thereon; and heat treating the conductive polymer having carbon nanotubes deposited thereon, so as to completely cure it.

Abstract: The present invention relates to a method of location management on the road using RFID series. In particular, the present invention provides RFID series, where a number of RFID tags are concurrently installed without the need of installing RFID tags one by one and ID of each RFID tag is automatically computed, and therefore work can be completed with a little time and workforce without confusion even where a number of RFID tags are required in order to constitute an RFID system, and a method of location management on the road to specifically grasp the location where an optional thing on the road (e.g. a car) stops or moves using the RFID series.

Abstract: The present invention relates to a method for constructing location management system using RFID series. In particular, the present invention provides RFID series to complete work with a little time and workforce without confusion by concurrently installing a number of RFID tags, even where a number of RFID tags are required in order to constitute an RFID system, and a method for constructing a system to effectively manage the location of an objective space using RFID series, wherein additional drawings (or computerized drawings) for an objective space are nor required even where RFID tags are attached over a considerably wide space, but rather drawings for location management system of an objective space can be produce by attaching RFID tags.

Abstract: The present invention related to a method for surface treatment and a method for forming fine wiring and more particularly, to a method for surface treatment of a substrate, including: preparing a substrate on which a fine wiring is to be formed; and treating the surface of the substrate with a fluorine containing liquid having a low boiling point, and a method for forming fine wiring using the same method. According to the present invention, not only the spreading of ink droplets but also the deterioration of the interface adhesion is avoided.