Patents by Inventor Hyun Duck LIM

Hyun Duck LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method of manufacturing the same
    Patent number: 9900989
    Abstract: The object of the present invention is to provide a printed circuit board formed with a cavity to mount a semiconductor chip.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: February 20, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Jik Lee, Jung Kyung Sung, Bong Wan Koo, Hyun Duck Lim
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160037646
    Abstract: The object of the present invention is to provide a printed circuit board formed with a cavity to mount a semiconductor chip.
    Type: Application
    Filed: August 4, 2015
    Publication date: February 4, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Jik LEE, Jung Kyung SUNG, Bong Wan KOO, Hyun Duck LIM