Patents by Inventor Hyun Gue Shim

Hyun Gue Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three dimensional semiconductor device
    Patent number: 8410597
    Abstract: A 3D semiconductor device includes a conductive plate defining four sides and four recesses formed in the four sides, respectively. The conductive plate has first and second surfaces opposite to each other. A plurality of conductive leads are located in the recesses, respectively, and the conductive leads have first and second surfaces opposite to each other. A semiconductor die is attached onto the central area of the conductive plate. A plurality of conductive wires electrically connects the semiconductor die to the conductive leads. An encapsulant encloses, as in a capsule, the conductive plate, the conductive leads, the semiconductor die, and the conductive wires in such a manner that the first and second surfaces of the conductive plate and the first and second surfaces of the conductive leads are exposed to the outside.
    Type: Grant
    Filed: October 22, 2009
    Date of Patent: April 2, 2013
    Assignee: Hana Micron Inc.
    Inventors: Hyun Gue Shim, Hee Bong Lee, Jin Wook Jeong
  • Three Dimensional Semiconductor Device
    Publication number: 20100148338
    Abstract: A 3D semiconductor device includes a conductive plate defining four sides and four recesses formed in the four sides, respectively. The conductive plate has first and second surfaces opposite to each other. A plurality of conductive leads are located in the recesses, respectively, and the conductive leads have first and second surfaces opposite to each other. A semiconductor die is attached onto the central area of the conductive plate. A plurality of conductive wires electrically connects the semiconductor die to the conductive leads. An encapsulant encloses, as in a capsule, the conductive plate, the conductive leads, the semiconductor die, and the conductive wires in such a manner that the first and second surfaces of the conductive plate and the first and second surfaces of the conductive leads are exposed to the outside.
    Type: Application
    Filed: October 22, 2009
    Publication date: June 17, 2010
    Applicant: HANA MICRON CO., LTD.
    Inventors: Hyun Gue Shim, Hee Bong Lee, Jin Wook Jeong