Abstract: A package handler is disclosed, by which productivity and work efficiency can be enhanced in a manner of automatically performing a work of unloading a cut package from a cutting jig (5) and a work of loading a new uncut package on the cutting jig. The present invention includes a body (1), an on-loader part (10) provided to one side of the body (1) to have a jig (5) provided with a plurality of slots (5a) accommodating a plurality of cut packages therein, a cut tray part (20) in which an empty tray to accommodate a package unloaded from the jig (5) is loaded, an uncut tray part (30) in which a tray accommodating the package to be inserted in the jig (5) is loaded, and a package loading/unloading part unloading the cut package from jig (5) of the on-loader part (10), the package loading/unloading part loading the uncut package in the uncut tray part (30) in the jig (5).

Abstract: A semiconductor package transfer mechanism and a semiconductor package transfer method are disclosed. The semiconductor package transfer mechanism includes a plurality of pickup units, which are movable along a shaft extending in one direction and operated individually from each other, and a vision inspection apparatus installed across a moving route of the pickup unit in order to inspect defects of the semiconductor packages transferred thereto by means of the pickup units. The pickup units pick up a predetermined amount of semiconductor packages adapted for one-time photographing capacity of the vision inspection apparatus and instantly transfer the semiconductor packages to the vision inspection apparatus. Time delay and waiting time for the semiconductor packages are significantly reduced during the process of the handler system, thereby significantly improving the transfer efficiency and vision inspection efficiency.