Patents by Inventor Hyun Hang PARK

Hyun Hang PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package substrate
    Patent number: 10026683
    Abstract: The present invention relates to an integrated circuit package substrate and, more specifically, to an integrated circuit package substrate, which exhibits excellent conductivity and reliability through the improvement of an adhesive force between a metal line for electrically connecting an upper part and a lower part of the integrated circuit package substrate and glass formed inside the integrated circuit package substrate.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: July 17, 2018
    Assignee: CORNING PRECISION MATERIALS CO., LTD.
    Inventors: Hyun Hang Park, Bo Gyeong Kim, Hyun Bin Kim, Sung Hoon Lee
  • INTEGRATED CIRCUIT PACKAGE SUBSTRATE
    Publication number: 20180114746
    Abstract: The present invention relates to an integrated circuit package substrate and, more specifically, to an integrated circuit package substrate, which exhibits excellent conductivity and reliability through the improvement of an adhesive force between a metal line for electrically connecting an upper part and a lower part of the integrated circuit package substrate and glass formed inside the integrated circuit package substrate.
    Type: Application
    Filed: April 6, 2016
    Publication date: April 26, 2018
    Inventors: Hyun Hang PARK, Bo Gyeong KIM, Hyun Bin KIM, Sung Hoon LEE