Abstract: Disclosed are an artificial crown with a structure capable of providing a mechanical bonding ability during a process of bonding a cement on an inner surface and a method of manufacturing the same. The artificial crown is fitted and bonded on a prepared tooth, comprises a prosthesis with retention groove in which the prepared tooth is inserted; and a plurality of pattern sections formed to a predetermined depth on an inner surface of the prosthesis and allowing an adhesive to be received in order to bond the prosthesis on the prepared tooth.

Abstract: A semiconductor wafer including a main body including first and second surfaces opposite each other, a notch including a recess on an outer periphery, a first bevel region formed along the outer periphery of the main body, including a first slope connecting the first and second surfaces and having a first height with respect to a straight line extending from a first point where the first surface and the first slope meet to a second point where the second surface and the first slope meet, and a second bevel region in contact with the recess or opening, including a second slope connecting the first and second surfaces and having a second height, different from the first height, with respect to a straight line extending from a third point where the first surface and the second slope meet to a fourth point where the second surface and the second slope meet.

Abstract: The present invention relates to a hybrid wind power tower including: a DSCT structure part having an inner steel tube and an outer steel tube that concentrically stand on a foundation, wherein a space between the inner steel tube and the outer steel tube is filled with concrete; and a steel structure part provided on the DSCT structure part. The hybrid wind power tower having a steel tower and a DSCT tower combined is configured in such a manner that a plastic hinge that is required to bear huge loads is provided with the DSCT tower structure having high strength, and the economical steel tower structure is provided on the plastic hinge, thereby maximizing safety and cost efficiency of a wind power tower.

Abstract: A semiconductor wafer including a main body including first and second surfaces opposite each other, a notch including a recess on an outer periphery, a first bevel region formed along the outer periphery of the main body, including a first slope connecting the first and second surfaces and having a first height with respect to a straight line extending from a first point where the first surface and the first slope meet to a second point where the second surface and the first slope meet, and a second bevel region in contact with the recess or opening, including a second slope connecting the first and second surfaces and having a second height, different from the first height, with respect to a straight line extending from a third point where the first surface and the second slope meet to a fourth point where the second surface and the second slope meet.