Abstract: A detecting apparatus includes an image processor configured to detect a crack in a semiconductor chip through image processing of an input image of the semiconductor chip, and a result outputting unit configured to output results detected by the image processor. The image processor is configured to perform an image gradient analysis on the input image, to convert the input image into a binary image by image binarization, based on a result obtained by performing the image gradient, to fill a closed region in the binary image with the same color as a color representing an outline of a shape appearing in the binary image that forms the closed region, to extract a shape having a predetermined property from the binary image, and to detect the crack by removing a shape connected to an edge portion of the input image. The result outputting unit is configured to output a resulting image in which a crack portion is expressed in the input image.

Abstract: A detecting apparatus includes an image processor configured to detect a crack in a semiconductor chip through image processing of an input image of the semiconductor chip, and a result outputting unit configured to output results detected by the image processor. The image processor is configured to perform an image gradient analysis on the input image, to convert the input image into a binary image by image binarization, based on a result obtained by performing the image gradient, to fill a closed region in the binary image with the same color as a color representing an outline of a shape appearing in the binary image that forms the closed region, to extract a shape having a predetermined property from the binary image, and to detect the crack by removing a shape connected to an edge portion of the input image. The result outputting unit is configured to output a resulting image in which a crack portion is expressed in the input image.