Abstract: Processes for rapidly and accurately measuring the coefficient of moisture expansion for materials, such as adhesives, are disclosed. A replication technique may be used to manufacture highly flat and smooth adhesive samples. Moisture is introduced in a controlled humidity atmosphere, distortion is monitored with an accurate laser interferometer (e.g., ˜1 nanometer (nm) accuracy), and measurements are correlated with moisture content change. Such processes decrease sample size by three orders of magnitude as compared with conventional techniques and have a smaller adhesive mass requirement, which enables measurement of expensive microelectronic adhesives that were previously cost-prohibitive to measure. Also, thinner films allow CME measurements of ultraviolet (UV) cured adhesives that would otherwise have depth of penetration issues. Furthermore, saturation occurs quickly, allowing pre-stabilization at room temperature, which enabled parametric studies as a function of processing or cure state.

Abstract: An assembly comprises an exposure chamber configured to receive a structure and identify at least one portion of the structure for further processing. The exposure chamber is further configured to expose the at least one portion of the structure to radiation such that a high cure state and a low residual stress are achieved for the structure. A dosage level of the radiation is determined based, at least in part, on the composition of the structure.

Abstract: Processes for rapidly and accurately measuring the coefficient of moisture expansion for materials, such as adhesives, are disclosed. A replication technique may be used to manufacture highly flat and smooth adhesive samples. Moisture is introduced in a controlled humidity atmosphere, distortion is monitored with an accurate laser interferometer (e.g., ˜1 nanometer (nm) accuracy), and measurements are correlated with moisture content change. Such processes decrease sample size by three orders of magnitude as compared with conventional techniques and have a smaller adhesive mass requirement, which enables measurement of expensive microelectronic adhesives that were previously cost-prohibitive to measure. Also, thinner films allow CME measurements of ultraviolet (UV) cured adhesives that would otherwise have depth of penetration issues. Furthermore, saturation occurs quickly, allowing pre-stabilization at room temperature, which enabled parametric studies as a function of processing or cure state.

Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.

Abstract: A method of modifying a 3D-printed polymer structure is provided. The method can include providing an initial 3D-printed polymer structure having at least one exposed surface; treating the exposed surface of the initial 3D-printed polymer structure with plasma to obtain a treated 3D-printed polymer structure having a treated surface; administering an adhesive to the treated surface of the treated 3D-printed polymer structure; and contacting a complementary 3D-printed polymer structure with the treated surface of the treated 3D-printed polymer structure to obtain a modified 3D-printed polymer structure.

Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.

Abstract: An assembly comprises an exposure chamber configured to receive a structure and identify at least one portion of the structure for further processing. The exposure chamber is further configured to expose the at least one portion of the structure to radiation such that a high cure state and a low residual stress are achieved for the structure. A dosage level of the radiation is determined based, at least in part, on the composition of the structure.

Abstract: A method of accelerating the reduction of residual stress in a bonded structure is provided. The method can include: providing a bonded structure having at least two substructures, wherein the substructures are bonded together with an adhesive; and submitting the bonded structure to a high-humidity environment having a relative humidity of at least 75%. The method can also include a step of submitting the bonded structure to an low-humidity environment having a relative humidity of at most 20%. According to the method, the bonded structure can have a first residual stress at a first time and a second residual stress at a second time, wherein an absolute value of the first residual stress is greater than an absolute value of the second residual stress. According to the method, the residual stress at the second time can be about zero.

Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.

Abstract: A method of modifying a 3D-printed polymer structure is provided. The method can include providing an initial 3D-printed polymer structure having at least one exposed surface; treating the exposed surface of the initial 3D-printed polymer structure with plasma to obtain a treated 3D-printed polymer structure having a treated surface; administering an adhesive to the treated surface of the treated 3D-printed polymer structure; and contacting a complementary 3D-printed polymer structure with the treated surface of the treated 3D-printed polymer structure to obtain a modified 3D-printed polymer structure.

Abstract: A method of accelerating the reduction of residual stress in a bonded structure is provided. The method can include: providing a bonded structure having at least two substructures, wherein the substructures are bonded together with an adhesive; and submitting the bonded structure to a high-humidity environment having a relative humidity of at least 75%. The method can also include a step of submitting the bonded structure to an low-humidity environment having a relative humidity of at most 20%. According to the method, the bonded structure can have a first residual stress at a first time and a second residual stress at a second time, wherein an absolute value of the first residual stress is greater than an absolute value of the second residual stress. According to the method, the residual stress at the second time can be about zero.

Abstract: A deposition assembly generally comprises a first deposition apparatus that is configured to receive a substrate, such as a glass mandrel. The first deposition apparatus is further configured to deposit a plurality of first monolayer molecules onto at least a surface of the substrate to generate a first coating structure on the substrate. A second deposition apparatus is coupled to the first deposition apparatus, and wherein the second deposition apparatus is configured to deposit a plurality of second monolayer molecules onto at least the surface of the substrate such that the second monolayer molecules are diffused through the first coating structure and at least one aperture is filled by at least one of the second monolayer molecules to generate at least one mold release layer on at least the surface of the substrate.

Abstract: A system includes a curing assembly for low temperature curing and residual stress relief of material substrates. The curing assembly includes a first exposure chamber configured to expose the material substrate to UV radiation, and a second exposure chamber configured to expose the material substrate to Gamma radiation. In some embodiments, a mixing apparatus may mix nano-filler particles into the material substrate prior to exposure to Gamma radiation. The cure assembly may also include a control system for determining exposure dosages and exposure times based at least in part, on the material properties of the material substrate.

Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.

Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.

Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.

Abstract: A fabrication assembly comprises an apparatus that receives a composite substrate and a glass substrate having a surface with a release coating layer. A resin layer is deposited between the composite and glass substrates such that a first portion of the resin layer is positioned adjacent to a surface of the composite substrate and a second portion of the resin layer is positioned adjacent to the surface with the release coating layer to prevent aperture(s) from forming. A curing of the resin layer is conducted using electromagnetic radiation. A post-processing chamber receives the resin layer positioned between the composite substrate and the glass substrate and conducts another curing of the resin layer. The resin layer and the composite substrate are released from the glass substrate. Another deposition apparatus receives the resin layer and the composite substrate. A metallic coating is deposited to form a composite mirror object.

Abstract: A deposition assembly generally comprises a first deposition apparatus that is configured to receive a substrate, such as a glass mandrel. The first deposition apparatus is further configured to deposit a plurality of first monolayer molecules onto at least a surface of the substrate to generate a first coating structure on the substrate. A second deposition apparatus is coupled to the first deposition apparatus, and wherein the second deposition apparatus is configured to deposit a plurality of second monolayer molecules onto at least the surface of the substrate such that the second monolayer molecules are diffused through the first coating structure and at least one aperture is filled by at least one of the second monolayer molecules to generate at least one mold release layer on at least the surface of the substrate.

Abstract: A method and composition wherein carbonaceous nano-scaled filler material is subjected to atmospheric plasma treatment using carbon monoxide as the active gas. The treatment with carbon monoxide plasma has been found to significantly increase the incorporation of oxygen groups on the surface of the filler material without degrading the surface and thus serves to increase wettability and dispersion throughout the matrix. The composite that incorporates the treated filler material has enhanced mechanical and electrical properties.

Abstract: A method and composition wherein carbonaceous nano-scaled filler material is subjected to atmospheric plasma treatment using carbon monoxide as the active gas. The treatment with carbon monoxide plasma has been found to significantly increase the incorporation of oxygen groups on the surface of the filler material without degrading the surface and thus serves to increase wettability and dispersion throughout the matrix. The composite that incorporates the treated filler material has enhanced mechanical and electrical properties.