Patents by Inventor Hyun II JANG

Hyun II JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250114900
    Abstract: Disclosed are window-mounted polishing pad. Since thermal fusion method and vibration fusion method are not applied while window is inserted into and attached to polishing pad, polishing pad is not deformed and polishing slurry does not leak through a gap between window and the polishing pad. A method of manufacturing the window-mounted polishing pad is also disclosed. The window-mounted polishing pad includes: polishing layer in which first punched hole is formed in thickness direction; window that is inserted into and fixed to the first punched hole of polishing layer; lower support layer; adhesive layer that mediates bonding of polishing layer and lower support layer; a sealing adhesive member positioned between the window and adhesive layer.
    Type: Application
    Filed: August 11, 2022
    Publication date: April 10, 2025
    Applicant: KPX CHEMICAL CO., LTD.
    Inventors: Byung Ju MIN, Seok Ji HONG, Hak Su KANG, Dae Han JUNG, GiYoung PARK, Hyun II JANG
  • Publication number: 20240367356
    Abstract: A method for manufacturing a window for a polishing pad is disclosed. The method includes: a) mixing a curing agent with a polyurethane prepolymer having a temperature of 50° C. or higher to less than 100° C. to prepare a mixture; b) injecting the mixture into a mold heated to a temperature of 30° C. or higher to less than 100° C. to a thickness of 5 mm or less; c) demolding a polyurethane cured product from the mold; and d) processing the polyurethane cured product to a thickness of the window of the polishing pad. A polishing pad including the window is also disclosed.
    Type: Application
    Filed: August 24, 2022
    Publication date: November 7, 2024
    Applicant: KPX CHEMICAL CO., LTD.
    Inventors: Byung Ju MIN, Seok Ji HONG, Hak Su KANG, Dae Han JUNG, Gi Young PARK, Hyun II JANG