Patents by Inventor Hyun-Ik Hwang

Hyun-Ik Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120013007
    Abstract: A Package-on-Package (POP) semiconductor package has a structure in which a second semiconductor package is stacked on a first semiconductor package. A plurality of spacers are disposed between a first substrate of the first semiconductor package and a second substrate of the second semiconductor package so as to maintain a gap between the first substrate and the second substrate. The plurality of spacers may project from a bottom surface of the second substrate toward the first substrate, or may project from a top surface of the first substrate toward the second substrate. When an upper molding layer is formed on the second substrate so as to cover a second semiconductor chip, the plurality of spacers may be connected to the upper molding layer via through holes that vertically pass through the second substrate.
    Type: Application
    Filed: June 16, 2011
    Publication date: January 19, 2012
    Inventors: Hyun-ik HWANG, Heui-seog KIM, Wha-su SIN, Jun-soo HAN
  • Patent number: 7989939
    Abstract: Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: August 2, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Ik Hwang, YongJin Jung, Kunho Song
  • Publication number: 20100052130
    Abstract: Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire.
    Type: Application
    Filed: August 27, 2009
    Publication date: March 4, 2010
    Inventors: HYUN-IK HWANG, YONG-JIN JUNG, KUNHO SONG
  • Publication number: 20090166879
    Abstract: A semiconductor package includes a semiconductor chip, a package substrate, a first attaching member, a second attaching member, a connecting member and a molding member. The package substrate has a central region and an edge region. The first attaching member attaches the semiconductor chip to the central region of the package substrate. The second attaching member is arranged in the edge region of the package substrate. The second attaching member includes first attaching patterns extending in a first direction, and second attaching patterns extending in a second direction. The connecting member electrically connects the semiconductor chip to the package substrate. The molding member is attached to the package substrate using the second attaching member to molding the semiconductor chip.
    Type: Application
    Filed: December 24, 2008
    Publication date: July 2, 2009
    Inventors: Kun-Ho Song, Yong-Jin Jung, Hyun-Ik Hwang
  • Patent number: 7405105
    Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: July 29, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Hyun-Ik Hwang
  • Publication number: 20080026507
    Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
    Type: Application
    Filed: September 28, 2007
    Publication date: January 31, 2008
    Inventors: Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Hyun-Ik Hwang
  • Patent number: 7291925
    Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: November 6, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Hyun-Ik Hwang
  • Patent number: 7288436
    Abstract: A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: October 30, 2007
    Assignee: Samsung Electronics, Co., Ltd.
    Inventors: Sang-Young Kim, Gil-Beag Kim, Yong-Jin Jung, Jun-Soo Han, Hyun-Ik Hwang
  • Publication number: 20060118831
    Abstract: A semiconductor package may include a substrate having a first major surface supporting a substrate pad and a bump pad electrically connected to the substrate pad. The substrate may have a second major surface with a concave part. A substrate window may extend through the substrate and open at the concave part. A semiconductor chip may be mounted on the substrate. The semiconductor chip may have a chip pad exposed through the substrate windows. Additionally, a method may involve forming a concave part in the substrate.
    Type: Application
    Filed: November 8, 2005
    Publication date: June 8, 2006
    Inventors: Hyun-Ik Hwang, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Jun-Soo Han
  • Publication number: 20060102996
    Abstract: Provided is a stack package using an anisotropic conductive film (ACF) for reducing thermal stresses exerted on chip scale packages (CSPs) during the initial manufacture of stack packages from a plurality of CSPs and for facilitating the repair and/or rework of stack packages incorporating CSPs while reducing the likelihood of damage to the CSPs. In the stack package including a plurality of CSPs stacked using an ACF, each CSP will typically include a circuit board, a semiconductor chip mounted on and electrically connected to the circuit board, and solder balls or other conductive structures arranged the semiconductor chip on the peripheral regions of the circuit board. Also provided are methods for the initial production of such stack packages and supplemental methods for the repair and rework of such stack packages.
    Type: Application
    Filed: May 20, 2005
    Publication date: May 18, 2006
    Inventors: Jun-Soo Han, Gil-Beag Kim, Sang-Young Kim, Yong-Jin Jung, Hyun-Ik Hwang