Patents by Inventor Hyun-Jong Kwon

Hyun-Jong Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180058078
    Abstract: The present invention relates to a flame-retardant decorative flooring material including a lower layer; a base layer; a printed layer; and a transparent layer sequentially from bottom to top, wherein at least any one of the layers includes a polyvinyl acetal resin.
    Type: Application
    Filed: March 30, 2015
    Publication date: March 1, 2018
    Inventors: Hyun Jong KWON, Suk Je SON, Jae Wan SUNG, Jong dae PARK, Kwang Sug Yang, Ung Kil KIM, Jun Young KIM
  • Patent number: 9623635
    Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: April 18, 2017
    Assignee: LG HAUSYS, LTD.
    Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
  • Patent number: 9517612
    Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: December 13, 2016
    Assignee: LG HAUSYS, LTD.
    Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
  • Patent number: 9422729
    Abstract: Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: August 23, 2016
    Assignee: LG HAUSYS, LTD.
    Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng-Zhe Huang
  • Publication number: 20130302577
    Abstract: Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.
    Type: Application
    Filed: June 13, 2011
    Publication date: November 14, 2013
    Applicant: LG Hausys, Ltd.
    Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng-Zhe Huang
  • Publication number: 20130078461
    Abstract: The present invention relates to a PLA flooring material having a fabric surface. The flooring material includes fabrics of a PLA material on the surface thereof, thereby achieving a fabric texture which cannot be obtained by printing in the art, environmental burden in disposal of petroleum resin products, and realizing an environmentally friendly flooring material through application of a PLA resin to a fabric layer, a rear layer and the like of the flooring material. The flooring material further includes a dimension stabilizing layer to improve dimensional stability.
    Type: Application
    Filed: June 3, 2011
    Publication date: March 28, 2013
    Applicant: LG HAUSYS, LTD.
    Inventors: Kyung-Tae Ha, Hyun-Jong Kwon, Jae-Wan Sung, Sung-Ha Park
  • Publication number: 20130004751
    Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.
    Type: Application
    Filed: March 15, 2011
    Publication date: January 3, 2013
    Applicant: LG HAUSYS, LTD.
    Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
  • Publication number: 20130004703
    Abstract: The present invention relates to a board complex having a polylactic acid (PLA) cover. The board complex includes: a cover member having at least one layer containing a PLA resin; and a board formed beneath the cover member, wherein the material for the board is selected from medium-density fiberboard (MDF), plywood, asbestos-free cellulose fiber reinforced cement board, magnesium board, glued laminated timber, high density fiberboard (HDF), particle board, ceramic tile, porcelain tile, ceramic board, and click-fastened board.
    Type: Application
    Filed: March 30, 2011
    Publication date: January 3, 2013
    Applicant: LG HAUSYS, LTD.
    Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng Zhe Huang
  • Publication number: 20120231256
    Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
    Type: Application
    Filed: March 7, 2011
    Publication date: September 13, 2012
    Applicant: LG HAUSYS, LTD.
    Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
  • Publication number: 20100323169
    Abstract: A custom mosaic flooring enabling customized construction of a flooring is disclosed. More specifically, according to the present invention, a sheet-type flooring printed with specific desired patterns or actual photograph printing images is constructed at a desired position in a partial mosaic form. According to the present invention, the custom mosaic flooring is constructed by printing various patterns including mosaic patterns, carpet patterns, pictures, and graphic patterns using a variety of printing methods including gravure printing, offset printing, transfer printing, dye diffusion thermal transfer printing, silkscreen printing, and actual photograph printing using a printer, thereby fabricating a sheet-type flooring, and fitting thus-fabricated flooring into a desired position. Therefore, construction of the flooring can be conveniently achieved.
    Type: Application
    Filed: December 13, 2007
    Publication date: December 23, 2010
    Inventors: Jong-Seok Son, Hyun-Jong Kwon