Patents by Inventor HYUN-JONG MOON

HYUN-JONG MOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board including inductor
    Patent number: 9627126
    Abstract: A printed circuit board (PCB) includes an insulating substrate, a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate, an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate, a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate, and a single through hole penetrating the insulating substrate and the insulating adhesive sheets. The single through hole is disposed between the inductor and the grounding element.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: April 18, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-Jong Moon, Bok-Sik Myung, Seong-Ho Shin
  • PRINTED CIRCUIT BOARD INCLUDING INDUCTOR
    Publication number: 20140362551
    Abstract: A printed circuit board (PCB) includes an insulating substrate, a plurality of copper foil pattern layers and a plurality of insulating adhesive sheets sequentially stacked on an upper side of the insulating substrate and a lower side of the insulating substrate, an inductor included in the copper foil pattern layer disposed on the upper side of the insulating substrate, a grounding element included in the copper foil pattern layer disposed on the lower side of the insulating substrate, and a single through hole penetrating the insulating substrate and the insulating adhesive sheets. The single through hole is disposed between the inductor and the grounding element.
    Type: Application
    Filed: April 17, 2014
    Publication date: December 11, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: HYUN-JONG MOON, Bok-Sik Myung, Seong-Ho Shin