Abstract: A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.

Abstract: An ultra-light polyurethane artificial leather composition comprises a one-component type blocked polyurethane high solid resin of 100 parts per weight, a capsule-type hollow microsphere of 1 to 10 parts per weight, a curing agent of 1 to 10 parts per weight, and a high solid type toner of 1 to 20 parts per weight.

Abstract: A method is provided for removing a volatile organic compound (VOC) contained in an artificial leather fabric and odor caused by the volatile organic compound by coating the artificial leather fabric with an adsorbent which reacts with a noxious substance containing the volatile organic compound (VOC); and immersing; washing; and drying the reacted artificial leather fabric. The method includes coating the adsorbent and immobilizing the volatile organic compound through a reaction, to prevent volatilization of the organic compound or reduce an amount thereof. Further, after the reaction between the artificial leather fabric and the adsorbent, the artificial leather fabric is washed, to remove the volatile organic compound immobilized on a surface of the fabric from the artificial leather.

Abstract: A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.

Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.

Abstract: A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

Abstract: A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.

Abstract: A terminal device for executing an application providing a search service is provided. The terminal device may include a touch sensing display, one or more processors, and a memory. The application is configured to be stored in the memory and implemented by the one or more processors, and includes a first interface providing a code to display a first search interface corresponding to a text-based search on the touch sensing display, and a second interface providing a code to display a second search interface on the touch sensing display, when a call interaction of the second search interface corresponding to a recognition search is sensed in response to a touch input on the touch sensing display while displaying the first search interface.

Abstract: A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.

Abstract: An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.

Abstract: A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.

Abstract: An adhesive composition includes an ethylene-vinyl acetate copolymer, a copolymer of an aliphatic heterocyclic compound and a monomer having an aromatic ring, a binder resin, a radical polymerizable material, and a radical initiator.