Patents by Inventor Hyun-Joo Yun

Hyun-Joo Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7491118
    Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages the polishing head proximate the edge of the wafer provides less rigidity than a second portion of the polishing pad that engages a portion of the surface of the wafer. For example, the polishing pad and/or the platen may have a recess or other cushioning structure positioned proximate a locus of movement of a portion of the polishing head that supports the edge of the wafer.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: February 17, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun Joo Yun, Young Sam Lim, Jae Pil Boo
  • Patent number: 7090570
    Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages the polishing head proximate the edge of the wafer provides less rigidity than a second portion of the polishing pad that engages a portion of the surface of the wafer. For example, the polishing pad and/or the platen may have a recess or other cushioning structure positioned proximate a locus of movement of a portion of the polishing head that supports the edge of the wafer.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: August 15, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun Joo Yun, Young Sam Lim, Jae Pil Boo
  • Patent number: 7044833
    Abstract: The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: May 16, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Joo Yun, Sang-Seon Lee, Jong-Bok Kim, Kwang-Hee Lee, Min-Su Kim, Hyun-Sung Lee
  • Publication number: 20050164604
    Abstract: The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.
    Type: Application
    Filed: December 2, 2004
    Publication date: July 28, 2005
    Inventors: Hyun-Joo Yun, Sang-Seon Lee, Jong-Bok Kim, Kwang-Hee Lee, Min-Su Kim, Hyun-Sung Lee