Abstract: Provided are a glass substrate protective film including an optically transparent adhesive layer; a polyimide-based shatter-proof layer formed on the optically transparent adhesive layer; and a hard coating layer formed on the polyimide-based shatter-proof layer. The hard coating layer and the optically transparent adhesive layer have a thickness of 5 to 20 ?m, the polyimide-based shatter-proof layer has a thickness of 20 to 50 ?m, the glass substrate protective film has an absolute value of a retardation in a thickness direction (Rth) of 2000 nm or less, and an adhesive strength when the optically transparent adhesive layer adheres to the glass substrate is 200 gf/in or more. A method for manufacturing the glass substrate laminate and a display panel including the glass substrate laminate are also provided.

Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages the polishing head proximate the edge of the wafer provides less rigidity than a second portion of the polishing pad that engages a portion of the surface of the wafer. For example, the polishing pad and/or the platen may have a recess or other cushioning structure positioned proximate a locus of movement of a portion of the polishing head that supports the edge of the wafer.

Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages the polishing head proximate the edge of the wafer provides less rigidity than a second portion of the polishing pad that engages a portion of the surface of the wafer. For example, the polishing pad and/or the platen may have a recess or other cushioning structure positioned proximate a locus of movement of a portion of the polishing head that supports the edge of the wafer.

Abstract: The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.

Abstract: The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.