Patents by Inventor Hyun-Joon Song

Hyun-Joon Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICE AND METHOD FOR INTERLOCKING DISPLAY DEVICE
    Publication number: 20240100952
    Abstract: Disclosed herein is a device for interlocking a display device with a vehicle, the device including a mount disposed in the vehicle, the display device being attached to and detached from the mount, a first sliding member disposed on a front surface of the mount and capable of moving forward or backward in a direction perpendicular to a rear surface of the display device, and a connector provided to the first sliding member, wherein the connector may transmit and receive electrical signals to and from the display device. The vehicle may be controlled by coupling a display device to the interlocking device disposed in the vehicle. Even when the display device is not coupled to the vehicle, the vehicle may be controlled by pairing through wireless communication between the vehicle and the display device.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 28, 2024
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Shin Jik LEE, Sung Joon AHN, Ji Soo SHIN, Jun LEE, Hyun Jun AN, Seung Ho SONG
  • Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticles
    Patent number: 8496873
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: July 30, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES
    Publication number: 20120272790
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Application
    Filed: June 13, 2012
    Publication date: November 1, 2012
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES
    Publication number: 20100031848
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Application
    Filed: May 8, 2009
    Publication date: February 11, 2010
    Inventors: Kwi-Jong LEE, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim