Abstract: An integrated circuit package system is provided including mounting a first integrated circuit device over a carrier, mounting a second integrated circuit device having an adhesive spacer over the first integrated circuit device in an offset configuration, connecting a first internal interconnect between the carrier and the first integrated circuit device with the first internal interconnect within the adhesive spacer, connecting a second internal interconnect between the carrier and the second integrated circuit device, and encapsulating the first integrated circuit device, the second integrated circuit device, the first internal interconnect and the second internal interconnect.

Abstract: A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts; attaching an integrated circuit to the top surface; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that are over and larger than the electrical contacts.

Abstract: A method and apparatus for driving an electro-luminescence display panel capable of preventing an initial blinking phenomenon occurring at a power application is disclosed. In the method, a first electrode of the EL cell and a ground voltage source are opened during a first period from a turn-on time of a power source to shut off a current path of the EL cells. Then, the first electrode of the pixel matrix and the ground voltage source is shorted during a second period to form a current path such that the EL cells are light-emitted in accordance with a data supplied to the pixel matrix.

Abstract: An electro-luminescence display device including red, green and blue reference gamma generators each having three digital analog converters or more in order to generate a reference gamma voltage of low gray level and a reference gamma voltage of high gray level, and at least one integrated circuit to generate a data signal in use of the reference gamma voltage of low gray level and the reference gamma voltage of high gray level. Each reference gamma generator includes a first digital analog converter to divide a voltage supplied to itself in order to generate i numbers of voltage levels, a second digital analog converter to divide a voltage supplied to itself in order to generate j numbers of voltage levels, and a third digital analog converter to receive two voltage levels from the second digital analog converter and to divides the two received voltage levels into j numbers of voltage levels.

Abstract: A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts; attaching an integrated circuit to the top surface; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that are over and larger than the electrical contacts.

Abstract: An integrated circuit package system including a substrate with a top surface and a bottom surface. Configuring the top surface to include electrical contacts formed between a perimeter of the substrate and a semiconductor die. Aligning over the top surface of the substrate a mold plate with a honeycomb meshwork of posts or a stepped honeycomb meshwork of posts and depositing a material to prevent warpage of the substrate between the top surface of the substrate and the mold plate. Removing the mold plate to reveal discrete hollow conduits formed within the material that align with the electrical contacts.

Abstract: An integrated circuit package-on-package system includes: providing a base substrate having a central opening; attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate; attaching a top die above the base substrate partially covering the central opening; attaching external conductive interconnections to a base bottom surface of the base substrate; and molding an encapsulant leaving the external conductive interconnections partially exposed.

Abstract: There is disclosed an electro-luminescence display device that is adaptive for preventing picture quality deterioration by operating a thin film transistor for an electro-luminescence cell drive at a non-saturation area to compensate a threshold voltage, and a driving method thereof.

Abstract: An integrated circuit package system includes providing a plurality of substrates; inserting a receptor in one of the substrates, the receptor held in and not extending through the one of the substrates; inserting a conductive post in another of the substrates; mounting the one of the substrates and the another of the substrates over one another with the conductive post engaging the receptor to thermally interlock without a separate bonding material; and mounting an integrated circuit mounted on the one of the substrates or the another of the substrates.

Abstract: A method and apparatus for driving an electro-luminescence display device capable of preventing a defect of signal lines caused by a relatively high scan voltage and current is disclosed. In the apparatus, a display panel has a scan line, a data line intersecting the scan line and supplied with a data, and a light-emitting device positioned at the intersection between the scan line and the data line. A data driver supplies a data to the data line. A scan driver applies a scanning pulse having a different current component to the scan line during a desired period.

Abstract: An integrated circuit package-on-package system includes: providing a base substrate having a central opening; attaching a bottom die below the base substrate partially covering the central opening, the bottom die connected through the central opening to a top surface of the base substrate; attaching a top die above the base substrate partially covering the central opening; attaching external conductive interconnections to a base bottom surface of the base substrate; and molding an encapsulant leaving the external conductive interconnections partially exposed.

Abstract: An electro-luminescence display device including red, green and blue reference gamma generators each having three digital analog converters or more in order to generate a reference gamma voltage of low gray level and a reference gamma voltage of high gray level, and at least one integrated circuit to generate a data signal in use of the reference gamma voltage of low gray level and the reference gamma voltage of high gray level. Each reference gamma generator includes a first digital analog converter to divide a voltage supplied to itself in order to generate i numbers of voltage levels, a second digital analog converter to divide a voltage supplied to itself in order to generate j numbers of voltage levels, and a third digital analog converter to receive two voltage levels from the second digital analog converter and to divides the two received voltage levels into j numbers of voltage levels.

Abstract: The present invention relates to an electro-luminescence display that is adaptive for reducing its manufacturing cost as well as reducing its process time. An electro-luminescence display device according to an embodiment of the present invention includes a gamma generator to output a reference gamma voltage corresponding to a control data supplied from the outside; and at least one data integrated circuit to receive a data from the outside and to generate a data signal corresponding to the bit number of the data in use of the reference gamma voltage.

Abstract: A stacked integrated circuit package system is provided connecting an interconnect between a first integrated circuit device and a substrate, the first integrated circuit device on the substrate, applying a protective dot on the first integrated circuit device, mounting a second integrated circuit device, having an adhesive, on the protective dot, with the adhesive on the first integrated circuit device, connecting the second integrated circuit device and the substrate, and encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.

Abstract: An integrated circuit package system includes providing a plurality of substrates; inserting a receptor in one of the substrates, the receptor held in and not extending through the one of the substrates; inserting a conductive post in another of the substrates; mounting the one of the substrates and the another of the substrates over one another with the conductive post engaging the receptor to thermally interlock without a separate bonding material; and mounting an integrated circuit mounted on the one of the substrates or the another of the substrates.

Abstract: An integrated circuit package system is provided including mounting a first integrated circuit device over a carrier, mounting a second integrated circuit device having an adhesive spacer over the first integrated circuit device in an offset configuration, connecting a first internal interconnect between the carrier and the first integrated circuit device with the first internal interconnect within the adhesive spacer, connecting a second internal interconnect between the carrier and the second integrated circuit device, and encapsulating the first integrated circuit device, the second integrated circuit device, the first internal interconnect and the second internal interconnect.

Abstract: A stacked integrated circuit package system is provided connecting an interconnect between a first integrated circuit device and a substrate, the first integrated circuit device on the substrate, applying a protective dot on the first integrated circuit device, mounting a second integrated circuit device, having an adhesive, on the protective dot, with the adhesive on the first integrated circuit device, connecting the second integrated circuit device and the substrate, and encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.

Abstract: An integrated circuit package system including a substrate with a top surface and a bottom surface. Configuring the top surface to include electrical contacts formed between a perimeter of the substrate and a semiconductor die. Aligning over the top surface of the substrate a mold plate with a honeycomb meshwork of posts or a stepped honeycomb meshwork of posts and depositing a material to prevent warpage of the substrate between the top surface of the substrate and the mold plate. Removing the mold plate to reveal discrete hollow conduits formed within the material that align with the electrical contacts.