Patents by Inventor Hyun-Ju Jin

Hyun-Ju Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240114785
    Abstract: Provided are a compound capable of improving the light-emitting efficiency, stability, and lifespan of an element; an organic electronic element using same; and an electronic device thereof.
    Type: Application
    Filed: November 3, 2023
    Publication date: April 4, 2024
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Hyo Min JIN, Hyun Ju SONG, Junggeun LEE
  • Patent number: 7927517
    Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: April 19, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Hee Bae, Seung Hyun Kim, Yul Kyo Chung, Won Hoon Song, Sung Taek Lim, Hyun Ju Jin
  • Patent number: 7895188
    Abstract: The present invention relates to a processing method of data stream using Border Monitoring Query, and more particularly a monitoring method and a system for data streams which are a large volume of data and continuously generated such as financial ticker, GPS data or a ubiquitous sensor network (USN). The objectives of the present invention are to process a large number of BMQs over data streams in high-performance and scalable manner. For this purpose, the invention presents BMQ-Index, a scalable and high performance data stream monitoring framework. The main idea of BMQ-Index is shared and incremental processing. For shared processing, BMQ-Index adopts a query indexing approach, thereby achieving a high level of scalability. Once BMQ-Index is built on registered queries, only relevant queries are quickly searched for upon an incoming data. For incremental processing, BMQ-Index employs an incremental access method, i.e.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: February 22, 2011
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Jin Won Lee, Young Ki Lee, Seung Woo Kang, Sang Jeong Lee, Hyun Ju Jin, Byung Jip Kim, June Hwa Song
  • Patent number: 7887879
    Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: February 15, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Hee Bae, Seung Hyun Kim, Yul Kyo Chung, Won Hoon Song, Sung Taek Lim, Hyun Ju Jin
  • Patent number: 7736397
    Abstract: A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: June 15, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Eun Lee, Yul Kyo Chung, Hyung Dong Kang, Hyun Ju Jin
  • Publication number: 20090325105
    Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
    Type: Application
    Filed: June 25, 2009
    Publication date: December 31, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok-Kyu Lee, Byoung-Youl Min, Chang-Hyun Nam, Hyun-Ju Jin, Jang-Kyu Kang
  • Publication number: 20090219671
    Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
    Type: Application
    Filed: May 8, 2009
    Publication date: September 3, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hee BAE, Seung Hyun Kim, Yul Kyo Chung, Won Hoon Song, Sung Taek Lim, Hyun Ju Jin
  • Publication number: 20090214776
    Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
    Type: Application
    Filed: May 8, 2009
    Publication date: August 27, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hee BAE, Seung Hyun KIM, Yul Kyo CHUNG, Won Hoon SONG, Sung Taek LIM, Hyun Ju JIN
  • Patent number: 7570491
    Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: August 4, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok-Kyu Lee, Byoung-Youl Min, Chang-Hyun Nam, Hyun-Ju Jin, Jang-Kyu Kang
  • Patent number: 7540913
    Abstract: Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a ?-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: June 2, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Hee Bae, Seung Hyun Kim, Yul Kyo Chung, Won Hoon Song, Sung Taek Lim, Hyun Ju Jin
  • Publication number: 20080288441
    Abstract: The present invention relates to a processing method of data stream using Border Monitoring Query, and more particularly a monitoring method and a system for data streams which are a large volume of data and continuously generated such as financial ticker, GPS data or a ubiquitous sensor network (USN). The objectives of the present invention are to process a large number of BMQs over data streams in high-performance and scalable manner. For this purpose, the invention presents BMQ-Index, a scalable and high performance data stream monitoring framework. The main idea of BMQ-Index is shared and incremental processing. For shared processing, BMQ-Index adopts a query indexing approach, thereby achieving a high level of scalability. Once BMQ-Index is built on registered queries, only relevant queries are quickly searched for upon an incoming data. For incremental processing, BMQ-Index employs an incremental access method, i.e.
    Type: Application
    Filed: April 30, 2007
    Publication date: November 20, 2008
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: JIN WON LEE, YOUNG KI LEE, SEUNG WOO KANG, SANG JEONG LEE, HYUN JU JIN, BYUNG JIP KIM, JUNE HWA SONG
  • Patent number: 7326858
    Abstract: Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of B-stage.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: February 5, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok-Kyu Lee, Byoung-Youl Min, Hyun-Ju Jin, Jang-Kyu Kang
  • Patent number: 7293356
    Abstract: The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: November 13, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Hyun Sohn, Yul Kyo Chung, Hyun Ju Jin, Eun Tae Park
  • Publication number: 20070234539
    Abstract: A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.
    Type: Application
    Filed: April 5, 2007
    Publication date: October 11, 2007
    Inventors: Seung Eun Lee, Yul Kyo Chung, Hyung Dong Kang, Hyun Ju Jin
  • Patent number: 7092237
    Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: August 15, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok-Kyu Lee, Jang-Kyu Kang, Hyun-Ju Jin, Byoung-Youl Min
  • Publication number: 20050199681
    Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.
    Type: Application
    Filed: April 29, 2005
    Publication date: September 15, 2005
    Inventors: Seok-Kyu Lee, Jang-Kyu Kang, Hyun-Ju Jin, Byoung-Youl Min
  • Patent number: 6910266
    Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: June 28, 2005
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok-Kyu Lee, Jang-Kyu Kang, Hyun-Ju Jin, Byoung-Youl Min
  • Publication number: 20040121266
    Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
    Type: Application
    Filed: December 4, 2003
    Publication date: June 24, 2004
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok-Kyu Lee, Byoung-Youl Min, Chang-Hyun Nam, Hyun-Ju Jin, Jang-Kyu Kang
  • Publication number: 20040118602
    Abstract: Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of B-stage.
    Type: Application
    Filed: December 10, 2003
    Publication date: June 24, 2004
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok-Kyu Lee, Byoung-Youl Min, Hyun-Ju Jin, Jang-Kyu Kang
  • Publication number: 20040118600
    Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto.
    Type: Application
    Filed: July 1, 2003
    Publication date: June 24, 2004
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seok-Kyu Lee, Jang-Kyu Kang, Hyun-Ju Jin, Byoung-Youl Min