Patents by Inventor Hyun Ju Yi

Hyun Ju Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered chip capacitor and multilayer chip capacitor array
    Patent number: 7035079
    Abstract: The present invention provides an MLCC and an MLCC array. The MLCC has desirably low ESL properties by forming the first and second internal electrodes to be spaced apart from each other on the same dielectric layer while overlapping with other first and second internal electrodes on the neighboring dielectric layers, and connecting the first and second internal electrodes to the external terminals provided on the top surface or the bottom surface of the capacitor body through conductive via holes formed in the capacitor body in a stacking direction of the capacitor body.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: April 25, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Soo Park, Dong Seok Park, Byoung Hwa Lee, Min Cheol Park, Hyun Ju Yi, Min Kyoung Kwon, Hae Suk Chung, Chang Hoon Shim, Seung Heon Han