Patents by Inventor Hyun-Jun HWANG

Hyun-Jun HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20240203644
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer and external electrodes disposed on the body, wherein the internal electrodes include Ni and oxide including Al, and a content of Al is 3 at % or more and 5 at % or less compared to the Ni.
    Type: Application
    Filed: March 3, 2023
    Publication date: June 20, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gil Yong LEE, Su Ji KANG, Mun Seong JEONG, Jin Kyung PARK, Chang Soo JANG, Sun Il JEONG, Hyun Jun HWANG, Jung Min KIM
  • MULTILAYER ELECTRONIC COMPONENT
    Publication number: 20240161978
    Abstract: A multilayer electronic component including: a body including a dielectric layer and internal electrodes; and external electrodes disposed outside the body and connected to the internal electrodes, wherein 1.5?Hfs/Hfc?5.0 when the internal electrode includes hafnium (Hf), Hfc indicates an average Hf content (at %) in a center of the internal electrode, and Hfs indicates an average Hf content (at %) in the internal electrode, measured from the center of the internal electrode to an interface thereof in contact with the dielectric layer.
    Type: Application
    Filed: March 28, 2023
    Publication date: May 16, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Jun HWANG, Jin Kyung PARK, Sun Il JEONG, Gil Yong LEE, Su Ji KANG, Mun Seong JEONG, Won Seok JANG, Jung Min KIM
  • METHOD FOR MANUFACTURING PHOTO-SINTERING PARTICLE, METHOD FOR MANUFACTURING PHOTO-SINTERING TARGET, AND PHOTO-SINTERING METHOD
    Publication number: 20200061704
    Abstract: Provided is a method for manufacturing photonic sintering particles. According to an embodiment, the method includes: preparing nano particles; and forming oxide films having different thicknesses with reference to the thermal conductivity of a substrate, on which the nano particles are to be formed, on surfaces of the nano particles.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 27, 2020
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Hak-Sung KIM, Hyun-Jun HWANG, Gyung Hwan OH, Deok Joong KIM