Abstract: A composite polishing pad for chemical mechanical polishing (CMP) and a method for producing the composite CMP. The composite polishing pad for CMP contains a polymer substrate layer including a plurality of protrusions formed on the upper surface thereof; and a carbon nanotube layer including carbon nanotubes embedded in and fixed to the upper portion of the substrate layer.

Abstract: The present disclosure relates to a resin composition and relates to a resin composition having excellent heat resistance and impact resistance and accomplishing the high degree of blackness.

Abstract: The present invention provides a composite polishing pad for CMP, and a method for producing the same. The composite polishing pad for CMP comprises: a soft polymer substrate layer including a plurality of protrusions formed on the upper surface thereof; a carbon nanotube layer including carbon nanotubes embedded in and bound to the upper portion of the substrate layer; and a hard polymer coating layer having the carbon nanotubes protruding outwardly on the upper portion of the carbon nanotube layer embedded and bound thereto.

Abstract: The present disclosure provides a polishing pad and a method of manufacturing a semiconductor device using the same. The method includes disposing a target layer on a semiconductor substrate and performing a chemical mechanical polishing process on the target layer using a polishing pad including a plurality of polishing protrusions facing the target layer. Each of the polishing protrusions includes a protruding portion and a surface layer at least partially covering the protruding portion, wherein the protruding portion is more elastic than the surface layer, and wherein the surface layer is harder than the protruding portion.

Abstract: The present disclosure relates to a thermoplastic resin composition including a styrene-based copolymer comprising a (meth)acrylate-based monomer, an aromatic vinyl-based monomer, and a maleimide-based monomer; a first graft copolymer including an acrylic-based rubber polymer, an aromatic vinyl-based monomer, and a vinyl cyanide-based monomer; and a second graft copolymer comprising an acrylic-based rubber polymer, an aromatic vinyl-based monomer, and a vinyl cyanide-based monomer, wherein the styrene-based copolymer has a residual oligomer content of 0.37% by weight or less, and the acrylic-based rubber polymer of the first graft copolymer and the acrylic-based rubber polymer of the second graft copolymer have different average particle diameters. A method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition are also disclosed.

Abstract: Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded article manufactured using the same. The thermoplastic resin composition includes 3 to 22% by weight of a graft copolymer (A-1) including an acrylate-based rubber having an average particle diameter of 200 to 400 nm, an aromatic vinyl compound, and a vinyl cyanide compound; 17 to 40% by weight of a graft copolymer (A-2) including an acrylate-based rubber having an average particle diameter of 50 to 199 nm, an aromatic vinyl compound, and a vinyl cyanide compound; 30 to 57% by weight of a copolymer (B) including a (meth)acrylic acid alkyl ester compound, an ?-methyl styrene-based compound, and a vinyl cyanide compound; and 6 to 30% by weight of a polymethacrylate resin (C) (except for ?-methyl styrene), wherein an average multi-axial impact strength is 22 J/mm or more.

Abstract: The present disclosure relates to a thermoplastic resin composition and a molded article including the same. The present disclosure relates to a thermoplastic resin composition including two or more types of acrylic graft resins (A) having different average particle diameters; a first copolymer (B) including an alkyl-substituted styrene, a (meth)acrylate, and a vinyl cyanide compound; a second copolymer (C) including an alkyl-unsubstituted styrene, a (meth)acrylate, and a vinyl cyanide compound; and a (meth)acrylate polymer (D), wherein the (meth)acrylate is included in an amount of 40 to 59% by weight based on a total weight of the thermoplastic resin composition, and a molded article including the thermoplastic resin composition. The thermoplastic resin composition having these compositional features may have excellent impact resistance, fluidity, and heat resistance, and may provide an economic advantage by suppressing increase in processing cost.