Patents by Inventor Hyun-Jung Ahn

Hyun-Jung Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10647847
    Abstract: The present invention relates to a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same. More specifically, the present invention provides a thermoplastic resin composition having excellent mechanical properties, such as tensile strength and impact strength, and weather resistance while having low gloss characteristics, a method of preparing the same, and a molded part manufactured using the same. According to the present invention, the thermoplastic resin composition includes an ASA graft copolymer having a core-shell structure having an average particle diameter of 0.05 to 1 ?m, an aromatic vinyl compound-vinyl cyanide compound copolymer, and an epoxy group-containing copolymer having a weight average molecular weight of 2,000 to 8,000 g/mol in specific amounts.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: May 12, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Chun Ho Park, Yong Yeon Hwang, Hyun Taek Oh, Bong Keun Ahn, Min Jung Kim, Eun Soo Kang, Yong Hee An, Jang Won Park
  • Patent number: 10640638
    Abstract: A thermoplastic resin composition with low gloss and improved colorability, pencil hardness and wear resistance has (A) 5 to 35% by weight of a first graft copolymer having an average particle diameter of 50 to 150 nm and containing acrylate rubber as a core; (B) 10 to 40% by weight of a second graft copolymer having an average particle diameter of more than 150 nm and 800 nm or less and containing acrylate rubber as a core; (C) 5 to 15% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer having a weight average molecular weight of 70,000 to 130,000 g/mol; (D) 20 to 50% by weight of an aromatic vinyl compound-(meth)acrylate compound copolymer having a weight average molecular weight of 65,000 to 100,000 g/mol; and (E) 0.1 to 7% by weight of a syndiotactic polystyrene resin.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: May 5, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Yong Hee An, Yong Yeon Hwang, Hyun Taek Oh, Bong Keun Ahn, Min Jung Kim, Chun Ho Park, Eun Soo Kang, Jang Won Park
  • Patent number: 10640490
    Abstract: The present invention provides a diaminopyrimidine derivative or its pharmaceutically acceptable salt, a process for the preparation thereof, a pharmaceutical composition comprising the same, and a use thereof. The diaminopyrimidine derivative or its pharmaceutically acceptable salt functions as a 5-HT4 receptor agonist, and therefore can be usefully applied for preventing or treating dysfunction in gastrointestinal motility, one of the gastrointestinal diseases, such as gastroesophageal reflux disease (GERD), constipation, irritable bowel syndrome (IBS), dyspepsia, post-operative ileus, delayed gastric emptying, gastroparesis, intestinal pseudo-obstruction, drug-induced delayed transit, or diabetic gastric atony.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: May 5, 2020
    Assignee: Yuhan Corporation
    Inventors: Hyun-Joo Lee, Dong-Hoon Kim, Tae-Kyun Kim, Young-Ae Yoon, Jae-Young Sim, Myung-Hun Cha, Eun-Jung Jung, Kyoung-Kyu Ahn, Tai-Au Lee
  • Publication number: 20190382574
    Abstract: A thermoplastic resin composition with low gloss and improved colorability, pencil hardness and wear resistance has (A) 5 to 35% by weight of a first graft copolymer having an average particle diameter of 50 to 150 nm and containing acrylate rubber as a core; (B) 10 to 40% by weight of a second graft copolymer having an average particle diameter of more than 150 nm and 800 nm or less and containing acrylate rubber as a core; (C) 5 to 15% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer having a weight average molecular weight of 70,000 to 130,000 g/mol; (D) 20 to 50% by weight of an aromatic vinyl compound-(meth)acrylate compound copolymer having a weight average molecular weight of 65,000 to 100,000 g/mol; and (E) 0.1 to 7% by weight of a syndiotactic polystyrene resin.
    Type: Application
    Filed: November 1, 2017
    Publication date: December 19, 2019
    Inventors: Yong Hee AN, Yong Yeon HWANG, Hyun Taek OH, Bong Keun AHN, Min Jung KIM, Chun Ho PARK, Eun Soo KANG, Jang Won PARK
  • Patent number: 10487204
    Abstract: The present invention relates to a method of preparing an ASA graft copolymer, a method of preparing a thermoplastic ASA resin composition including the same, and a method of preparing an ASA molded part, and more particularly, to a method of preparing a multilayered ASA graft copolymer including a step of preparing seeds, cores, and shells. According to the method, since a multifunctional carboxylic acid having 20 or more carbon atoms or a salt thereof is introduced as an emulsifier, the content of the emulsifier remaining in a resin may be reduced, thereby providing an ASA resin having excellent thermal stability and appearance characteristics while the inherent physical properties thereof, such as impact resistance and weather resistance, are maintained.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: November 26, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Bong Keun Ahn, Yong Yeon Hwang, Hyun Taek Oh, Min Jung Kim, Chun Ho Park, Eun Soo Kang, Yong Hee An, Jang Won Park
  • Patent number: 8877877
    Abstract: A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: November 4, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Sang-Ran Koh, June-Ho Shin, Woo-Han Kim, Sung-Hwan Cha, Hyun-Jung Ahn
  • Patent number: 8512870
    Abstract: A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: August 20, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyun-Jung Ahn, Young-Eun Choi
  • Patent number: 8455605
    Abstract: A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: June 4, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Sang-Ran Koh, June-Ho Shin, Hyun-Jung Ahn, Sung-Hwan Cha, Young-Eun Choi, Doo-Young Jung, Sang-Kyun Kim, Jong-Seob Kim
  • Patent number: 8344075
    Abstract: A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: January 1, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Woo-Han Kim, June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyun-Jung Ahn
  • Publication number: 20120270998
    Abstract: A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
    Type: Application
    Filed: June 28, 2012
    Publication date: October 25, 2012
    Inventors: Sang-Ran KOH, June-Ho SHIN, Hyun-Jung AHN, Sung-Hwan CHA, Young-Eun CHOI, Doo-Young JUNG, Sang-Kyun KIM, Jong-Seob KIM
  • Publication number: 20120271006
    Abstract: A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:
    Type: Application
    Filed: June 28, 2012
    Publication date: October 25, 2012
    Inventors: June-Ho SHIN, Sang-Ran KOH, Sung-Hwan CHA, Hyun-Jung AHN, Young-Eun CHOI
  • Publication number: 20120046423
    Abstract: A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,
    Type: Application
    Filed: August 11, 2011
    Publication date: February 23, 2012
    Inventors: Sang-Ran KOH, June-Ho Shin, Woo-Han Kim, Sung-Hwan Cha, Hyun-Jung Ahn
  • Publication number: 20120029157
    Abstract: A modified siloxane polymer composition, an encapsulant, and an electronic device, the modified siloxane polymer including a modified siloxane polymer and a reticular siloxane polymer, the modified siloxane polymer including a cyclic siloxane moiety having at least two Si—O bonds with a cyclic structure, a substituted or unsubstituted linear siloxane moiety linked to Si of the cyclic siloxane moiety with a C2 to C10 alkylene group therebetween, and double bonds at its terminal ends.
    Type: Application
    Filed: July 28, 2011
    Publication date: February 2, 2012
    Inventors: Woo-Han KIM, June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyun-Jung Ahn