Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode wound around a winding axis to define a core and an outer circumferential surface, the first electrode including a first uncoated region in which an active material layer is not coated along a winding direction; a housing accommodating the electrode assembly through an open portion at a lower end thereof; a first current collector coupled to the first uncoated region and disposed in the housing; a cap to cover the open portion; and a spacer between the first current collector and the cap and having a height corresponding to a distance between the first current collector and the cap.

Abstract: The present invention relates to a device capable of wrapping the outer wall of a blood vessel, and a method for manufacturing the device. If the device for wrapping the outer wall of a blood vessel of the present invention is used, the outer wall of a blood vessel is wrapped, and, thereby, vortex generation can be significantly decreased by controlling abnormal expansion of the blood vessel which can occur due to the difference in the characteristics of blood vessels in a vein-artery graft model. The present invention saves a blood vessel from a low-oxygen state by promoting generation of new blood vessels on the outer wall of the blood vessel via a regenerative inflammatory response caused by the material of the device, and provides synergy effects such as prevention of vascular stenosis and reinforcement of an outer muscular layer by guiding venous muscular cells to the outside.

Abstract: A battery includes an electrode assembly including a first uncoated region and a second uncoated region; a battery housing accommodating the electrode assembly and electrically connected to the second uncoated region; a cap to cover an open portion on bottom of the battery housing; a first electrode terminal passing through a partially closed portion of the battery housing and being electrically isolated from the battery housing; and a first current collector coupled to the first uncoated region and connected to the first electrode terminal.

Abstract: A separator cutting apparatus includes: a fixing part configured to fix temporarily the electrode assembly; a cutter supporting part disposed above the fixing part; a cutter part disposed below the cutter supporting part, and configured to cut a separator among the electrode assembly temporarily fixed to the fixing part; and a spring part configured to connect elastically the cutter supporting part and the cutter part to each other, and return the cutter part to an initial position after cutting the separator; the spring part includes a spring bush coupled to a supporting shaft provided in the cutter supporting part and the cutter part, respectively, a spring holder integrally coupled to the spring bush, and a spring that expands and contracts according to the elevation of the cutter part by coupling both ends to the spring holder, and the spring holder and the spring bush are made of a non-metallic material.

Abstract: A resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity is provided. Also, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. A product comprising the curable composition or the cured body thereof is also provided.

Abstract: The present disclosure relates to a method for determining a relative position between arrays of a flexible array device. The flexible array device according to an embodiment includes a plurality of arrays arranged at a predetermined interval in a deformable substrate, and the method includes measuring the first capacitance between adjacent arrays, measuring the second capacitance between the adjacent arrays after deformation of the substrate, and determining a relative position between the adjacent arrays based on the first capacitance measurement value and the second capacitance measurement value. According to an embodiment, the relative position between the arrays may be determined by measuring the capacitance between the adjacent arrays of the plurality of arrays arranged in the deformable substrate and measuring a change in capacitance caused by the deformation (contraction, relaxation, bending) of the substrate.

Abstract: A display device, includes: a display panel including a pixel electrically coupled to a gate line and a data line; a gate driver configured to provide a gate signal to the gate line; and a data driver configured to provide a data signal to the data line, wherein the gate driver is configured to sequentially provide a first gate signal and a second gate signal to the gate line during a first frame period, wherein the data driver is configured to provide a first data signal to the data line in response to the first gate signal, and to provide a second data signal to the data line in response to the second gate signal, and wherein the second data signal is different from the first data signal and varies dependent on the first data signal.

Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved driving voltage, power efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.

Abstract: In some aspects, mutant or variant Fc domains are provided that exhibit increased binding to FcRn and increased half-life after administration in vivo. The Fc domain may be comprised in a glycosylated or aglycosylated antibody. Methods for using the mutant or variant Fc domains or polypeptides comprising the mutant or variant Fc domains are also provided.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Abstract: The present invention relates to a method for preparing a 3D biological bilayer membrane structure in a physiological buffer solution and a 3D biological bilayer membrane structure using the same, and more particularly, to a method for preparing a 3D biological bilayer membrane structure that is tightly sealed even under physiological ionic conditions by applying pressure during electroformation to improve a membrane fusion function, and a 3D biological bilayer membrane structure using the same.

Abstract: A method of manufacturing a semiconductor device includes: forming electrode holes by etching a mold structure including a mold layer and a support layer which are stacked on a substrate; forming lower electrode pillars filling the electrode holes; etching a portion of the support layer between the lower electrode pillars to form a support pattern having a through-hole exposing a portion of a top surface of the mold layer; removing the mold layer through the through-hole to expose sidewalls of the lower electrode pillars; and selectively forming lower electrode patterns on the sidewalls and top surfaces of the lower electrode pillars.

Abstract: A pixel including: a light emitting element; a first transistor connected between a first power source and a second node; a first capacitor connected to a first node or a second node and a third node; a second transistor between the third node and a data line, the second transistor turned on by a first scan signal; a third transistor between the first and second nodes, the third transistor turned on by a second scan signal; a fifth transistor between the first power source and the first transistor, the fifth transistor turned on by a first emission control signal; a sixth transistor between the second node and the light emitting element, the sixth transistor turned on by a second emission control signal; and an eighth transistor between the second node and a second emission control line, the eighth transistor turned on by a fourth scan signal.

Abstract: A glass stress test method includes breaking a glass, analyzing a shape of a crack of a broken portion of the glass in a plan view, finding a breakage origin of the glass based on the shape of the crack in the plan view, analyzing a cross-section of the breakage origin, and calculating a stress of the glass based on a cross-sectional analysis result of the breakage origin. The stress of the glass is calculated as a value proportional to a floor constant defined by a condition of a floor surface disposed when the glass is broken.

Abstract: The present invention relates to a method and system for providing language learning services. The method of providing language learning services, according to the present invention, the method may include: activating, in response to receiving an input for acquiring a learning target image through a user terminal, a camera of the user terminal; specifying at least a portion of an image taken by the camera as the learning target image; receiving language learning information for the learning target image from a server; providing the language learning information to the user terminal; and storing, based on a request for storing of the language learning information, the language learning information in association with the learning target image, such that the learning target image is used in conjunction with learning of the language learning information.

Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.

Abstract: A cylindrical battery cell includes a jelly-roll having a first electrode tab protruding upward and a second electrode tab protruding downward, a battery can configured to accommodate the jelly-roll through a top opening and electrically connected to the second electrode tab, a first current collecting plate coupled to the first electrode tab at an upper portion of the jelly-roll, an insulating shrink tube having a first cover portion for covering at least a part of the first current collecting plate and a second cover portion for covering a top end of an outer circumference of the jelly-roll, and a top cap electrically connected to the first current collecting plate and configured to cover the opening.

Abstract: The present disclosure relates to an organic electroluminescent compound, a plurality of host materials, and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure or by comprising a specific combination of compounds according to the present disclosure as a plurality of host materials, it is possible to produce an organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.

Abstract: A semiconductor device includes; a bottom electrode on a substrate, a supporting pattern between the bottom electrode and an adjacent bottom electrode, a top electrode covering the bottom electrode and the supporting pattern, and a dielectric layer between the bottom electrode and the top electrode and between the supporting pattern and the top electrode. The bottom electrode may include a first portion including a seam and a second portion on the first portion, a top end of the second portion may be disposed at a height lower than an upper surface of the supporting pattern, and a portion of a bottom end of the second portion may be exposed to the seam.

Abstract: A manufacturing method for a semiconductor device, includes: forming a first gate structure and a second gate structure on a substrate; forming a deep trench isolation (DTI) hard mask on the first and second gate structures; forming a deep trench isolation disposed between the first gate structure and the second gate structure; depositing a first undoped oxide layer in the deep trench isolation; performing a first etch-back process on the first undoped oxide layer to remove a portion of the undoped oxide layer; depositing a first deep trench isolation (DTI) gap-fill layer on a remaining portion of the undoped oxide layer, and performing a second etch-back process on the first DTI gap-fill layer; depositing a second DTI gap-fill layer to seal the deep trench isolation, and forming a planarized second DTI gap-fill layer by a planarization process; and depositing a second undoped layer on the planarized second DTI gap-fill layer.