Patents by Inventor Hyun-Ki Kim

Hyun-Ki Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11450614
    Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 20, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Joo Kim, Sun Chul Kim, Min Keun Kwak, Hyun Ki Kim, Hyung Gil Baek, Yong Kwan Lee
  • Publication number: 20220178010
    Abstract: A heat treatment method of a component for a vehicle includes: heating an inner space of a heat treatment furnace in which a component for a vehicle is disposed in the inner space; stabilizing hydrogen (H2) by injecting the H2 into the inner space; and performing nitrification heat treatment for the component by injecting only ammonia (NH3) into the inner space after the stabilizing. The heat treatment method may adjust the degree of vacuum and the flow rate instead of a Kn without additionally injecting the H2 gas into an NH3 gas, thereby implementing the nitrification heat treatment of a quality similar to that of a conventional nitrification heat treatment for a short time.
    Type: Application
    Filed: February 12, 2021
    Publication date: June 9, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Dong-Hwi Kim, Soon-Woo Kwon, Chung-An Lee, Hyun-Ki Kim, Seung-Hyun Hong, Min-Woo Kang
  • Publication number: 20220108076
    Abstract: The present invention relates to an apparatus and method for automatically generating machine reading comprehension training data, and more particularly, to an apparatus and method for automatically generating and managing machine reading comprehension training data based on text semantic analysis. The apparatus for automatically generating machine reading comprehension training data according to the present invention includes a domain selection text collection unit configured to collect pieces of text data according to domains and subjects, a paragraph selection unit configured to select a paragraph using the pieces of collected text data and determine whether questions and correct answers are generatable, and a question and correct answer generation unit configured to generate questions and correct answers from the selected paragraph.
    Type: Application
    Filed: October 7, 2021
    Publication date: April 7, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Jin BAE, Joon Ho LIM, Min Ho KIM, Hyun KIM, Hyun Ki KIM, Ji Hee RYU, Kyung Man BAE, Hyung Jik LEE, Soo Jong LIM, Myung Gil JANG, Mi Ran CHOI, Jeong HEO
  • Publication number: 20220090253
    Abstract: A carburizing steel includes, based on a total wt % of the carburizing steel: 0.1 wt % or more and 0.3 wt % or less of C (carbon); 2.0 wt % or more and 2.7 wt % or less of Cr (chrome); 0.4 wt % or more of Si (silicon); 0.3 wt % or more and 0.7 wt % or less of Mo (molybdenum); less than 0.7 wt % of Mn (manganese); and 0.6 wt % or more and 1.5 wt % or less of Ni (nickel).
    Type: Application
    Filed: January 14, 2021
    Publication date: March 24, 2022
    Inventors: Min-Woo Kang, Soon-Woo Kwon, Min-Woo Kang, Hyun-Ki Kim, Dong-Hwi Kim, In-Beom Lee, Chung-An Lee, Seung-Hyun Hong
  • Publication number: 20220079397
    Abstract: A drying apparatus includes a main body composed of a front end frame and a rear end frame. A fan receiving part may be disposed on the upper end of the front end frame and protruding forward therefrom, and a fan assembly may be located in the fan receiving part. The open part may be disposed at the lower part of the fan receiving part of the front end frame, and the outlets may be located along the upper end edge and opposite edges of the open part. Air may be delivered to the outlets through the duct disposed at the main body.
    Type: Application
    Filed: January 19, 2021
    Publication date: March 17, 2022
    Inventors: Seong Woo An, Yeon A Jo, Gi seop Kwon, Hyun Ki Kim, Dae woong Kim, Ji hye Lee, Min Kyu Oh
  • Publication number: 20220061606
    Abstract: A filter assembly and a drying apparatus having the filter assembly are proposed. The filter assembly (180) may purify air introduced into the main body (100) of the drying apparatus. The filter assembly (180) may be protruded by a predetermined distance to a side surface of the main body (100) by the moving plate (190). The filter frame (182) protruded by the moving plate (190) may be removed from the moving plate (190) to perform maintenance of filters (184, 186, 188).
    Type: Application
    Filed: January 19, 2021
    Publication date: March 3, 2022
    Inventors: Seong Woo AN, Seung Yup LEE, Min Kyu OH, Hyun Ki KIM, Dae woong KIM, Yang hwan NO, Sang Yoon LEE, Byung Soo OH, Yeon A JO, Gi seop KWON
  • Publication number: 20220061603
    Abstract: A main body (100) may constitute the frame of a drying apparatus, and a moving bar (230) may be mounted to the main body (100) to move up and down along the front surface thereof. The moving bar (230) may be moved up and down by being driven by the drive assembly (210). Most of the drive assembly (210) may be installed at a position corresponding to the installation space (150) of a duct (130) formed in the main body (100).
    Type: Application
    Filed: January 19, 2021
    Publication date: March 3, 2022
    Inventors: Seong Woo An, Seung Yup Lee, Min Kyu Oh, Hyun Ki Kim, Dae Woong Kim, Yang Hwan No, Sang Yoon Lee, Byung Soo Oh, Yeon A Jo, Gi Seop Kwon
  • Publication number: 20220061601
    Abstract: A drying apparatus is proposed. When at least one drying condition of a discharge position, a temperature, air volume, and the drying area of air is selected, the drying apparatus may discharge air according to the selected drying condition. The discharge of the air may be performed from the main body (10) and a moving bar (230) moving up and down along the front surface of the main body (100). The drying condition may be automatically or manually selected. The drying area may include entire body and partial body. The moving bar (230) may discharge air while moving up and down within a height range corresponding to the selected drying area, and may improve the effect of drying a user's body in cooperation with air discharged from the main body (100).
    Type: Application
    Filed: January 19, 2021
    Publication date: March 3, 2022
    Inventors: Hyun Ki KIM, Seung Yup LEE, Min Kyu OH, Yeon A JO, Gi seop KWON, Dae Woong KIM, Seong Woo AN, Ji hye LEE, Yang hwan NO, Sang Yoon LEE, Buyng Soo OH
  • Publication number: 20220061602
    Abstract: A drying apparatus is proposed. A main body (100) may constitute the frame of the drying apparatus. A front end frame (102) and a rear end frame (106) may constitute the exterior of the main body (100). A moving bar (230) may discharge air while moving up and down along the front surface of the main body (100). A duct (130) may be installed in the main body (100), and air flown by a fan assembly (160) may be separated in the duct and be discharged to a user through the edges of the front surface of the main body to dry the user. A drive assembly (210) moving the moving bar (230) up and down may be installed in the installation space (150) defined in the duct (130).
    Type: Application
    Filed: January 19, 2021
    Publication date: March 3, 2022
    Inventors: Seong Woo AN, Seung Yup LEE, Min Kyu OH, Hyun Ki KIM, Dae woong KIM, Yang hwan NO, Sang Yoon LEE, Byung Soo OH, Yeon A JO, Gi seop KWON
  • Publication number: 20220061605
    Abstract: A drying apparatus is proposed. A moving bar (230) may be mounted to a main body (100) of the drying apparatus to move relative thereto. The inlet (248) may be formed in a side of a lower surface of the moving bar (230), the inlet allowing air to be introduced into the moving bar (230). The bar fan assembly (250) may be provided in the moving bar (230). The nozzle slot (245?) may be formed in the moving bar (230), the nozzle slot allowing the air to be discharged slantingly toward a front lower part of the main body (100). A bar casing (232) having an open lower part and a bar cover (242) covering the open lower part may constitute the exterior of the moving bar (230).
    Type: Application
    Filed: January 19, 2021
    Publication date: March 3, 2022
    Inventors: Dae woong KIM, Seung Yup Lee, Min Kyu Oh, Hyun Ki Kim, Seong Woo An, Yang hwan No, Sang Yoon Lee, Byung Soo Oh, Yeon A Jo, Gi seop Kwon
  • Publication number: 20220061604
    Abstract: A drying apparatus is proposed. The main body (100) may constitute the frame of the drying apparatus. The fan receiving part (104) may be provided in an upper part of the main body (100), and the fan assembly (160) may be installed in the fan receiving part (104). In the fan receiving part (104), the fan of the fan assembly (160) may be relatively located at a side of a rear end of the main body (100), and a fan motor (170) may be relatively located at a side of the front end of the main body (100). Accordingly, outside air may be introduced through the side edges of the rear end of the main body (100); may flow through a filter assembly (180) directly to the fan housing (162); and may flow through the air exit (169) of the fan housing (162) directly to the duct (130).
    Type: Application
    Filed: January 19, 2021
    Publication date: March 3, 2022
    Inventors: Dae woong Kim, Seung Yup Lee, Min Kyu Oh, Hyun Ki Kim, Seong Woo An, Yang hwan No, Sang Yoon Lee, Byung Soo Oh, Yeon A Jo, Gi seop Kwon, Byung Soo Oh
  • Patent number: 11244541
    Abstract: Disclosed is an online crane game apparatus. The crane game apparatus includes: a body accommodated therein with prizes; a camera for photographing an inside of the body to generate a game play image; a screen unit provided on at least one surface of the body and having a single color; a communication unit for synthesizing a background video or image to an area corresponding to the screen unit in the game play image to transmit the synthesized background video or image to an outside; and a control unit for controlling the communication unit. Accordingly, the user plays the game while watching the game play image that is more exciting, so that a dynamic and realistic game is implemented.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: February 8, 2022
    Inventor: Hyun Ki Kim
  • Patent number: 11238706
    Abstract: Disclosed is a crane game machine, which includes at least: a camera unit which images an inside of a main body in which prizes are accommodated, and generates an internal image; a prize moving unit which picks up a prize and then moves the prize to a first score point inside the main body; a sensor unit which is installed at the first score point and senses the passing of the prize through the first score point; a communication unit which transmits the internal image and the sensing result to an external device, and receives a prize moving unit control signal from the external device; and a control unit which controls the movement of the prize moving unit according to the prize moving unit control signal.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: February 1, 2022
    Inventor: Hyun Ki Kim
  • Publication number: 20210407094
    Abstract: An apparatus and a method for segmenting a steel microstructure phase are provided. The apparatus includes a storage configured for storing a machine learning algorithm and a processing device that segments a microstructure phase using the machine learning algorithm. The processing device is configured to receive label data, to learn a machine learning model by use of the label data as learning data for the machine learning model, and to segment a phase of a steel microstructure image by use of the learned machine learning model.
    Type: Application
    Filed: April 14, 2021
    Publication date: December 30, 2021
    Inventors: Min Woo KANG, Soon Woo KWON, Chung An LEE, Hyun Ki KIM, Seung Hyun HONG, Jun Yun KANG
  • Publication number: 20210395862
    Abstract: A copper alloy for valve seats, and more particularly a copper alloy for valve seats with improved wear resistance, contains 12 to 24% by weight of Ni, 2 to 4% by weight of Si, 7 to 13% by weight of Cr, 20 to 35% by weight of Fe, and a balance of Cu and other impurities.
    Type: Application
    Filed: October 20, 2020
    Publication date: December 23, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Min Woo Kang, Soon Woo Kwon, Hyun Ki Kim, Chung An Lee, Seung Hyun Hong, Young Nam Kim
  • Publication number: 20210366834
    Abstract: A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.
    Type: Application
    Filed: December 28, 2020
    Publication date: November 25, 2021
    Inventors: Sun Chul Kim, Sang Soo Kim, Yong Kwan Lee, Hyun Ki Kim, Seok Geun Ahn, Jun Young Oh
  • Publication number: 20210320067
    Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.
    Type: Application
    Filed: September 28, 2020
    Publication date: October 14, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jung Joo KIM, Sun Chul KIM, Min Keun KWAK, Hyun Ki KIM, Hyung Gil BAEK, Yong Kwan LEE
  • Publication number: 20210320043
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-young OH, Hyun-ki KIM, Sang-soo KIM, Seung-hwan KIM, Yong-kwan LEE
  • Patent number: 11111377
    Abstract: The present invention relates to a resin composition including (1) 80 wt % to 99.8 wt % of a butadiene-based graft copolymer mixture; (2) 0.1 wt % to 10 wt % of a graft copolymer including a derived unit from a polyolefin-based polymer, a derived unit from a vinyl cyanide compound and a derived unit from an aromatic vinyl-based compound; and (3) 0.1 wt % to 10 wt % of an alpha olefin-based copolymer.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: September 7, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Seung Cheol Ryoo, Sung Hwan Yoon, Hyun Ki Kim, Seong Lyong Kim, Jin Oh Nam
  • Patent number: 11069588
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: July 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-young Oh, Hyun-ki Kim, Sang-soo Kim, Seung-hwan Kim, Yong-kwan Lee