Patents by Inventor Hyun Ki Seo

Hyun Ki Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package, buffer wafer for semiconductor package, and method of manufacturing semiconductor package
    Patent number: 11031307
    Abstract: A semiconductor package includes a buffer wafer including: a first surface; and a second surface opposite to the first surface, a stacked structure including a plurality of chips being stacked on the first surface of the buffer wafer; a first detection line formed around a periphery of the stacked structure on the first surface of the buffer wafer; and a mold layer covering the stacked structure, the first detection line and the first surface of the buffer wafer.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: June 8, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chan Hee Jeong, Hyun Ki Seo, Joo Hyung Lee, Jae Gil Lim
  • SEMICONDUCTOR PACKAGE, BUFFER WAFER FOR SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
    Publication number: 20200294869
    Abstract: A semiconductor package includes a buffer wafer including: a first surface; and a second surface opposite to the first surface, a stacked structure including a plurality of chips being stacked on the first surface of the buffer wafer; a first detection line formed around a periphery of the stacked structure on the first surface of the buffer wafer; and a mold layer covering the stacked structure, the first detection line and the first surface of the buffer wafer.
    Type: Application
    Filed: November 15, 2019
    Publication date: September 17, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chan Hee JEONG, Hyun Ki Seo, Joo Hyung Lee, Jae Gil Lim