Abstract: A display device including a display panel including a substrate, pixels provided on the substrate, and first lines connected to the pixels, the display device having a bending area where the display panel is bent. The display panel also includes a chip on film overlapping with a portion of the display panel and having second lines, an anisotropic conductive film provided between the chip on film and the display panel connecting the first lines and the second lines, and a coating layer covering the bending area and one end of the chip on film. In such a device, lines of the chip on film may be prevented from being corroded as they may be spaced apart from an edge of an insulating film.

Abstract: A display device includes a display panel including a bendable display panel including a substrate and a plurality of pad portions on the substrate. The substrate includes a cutout between adjacent pad portions of the plurality of pad portions.

Abstract: A display device including a display panel including a substrate, pixels provided on the substrate, and first lines connected to the pixels, the display device having a bending area where the display panel is bent. The display panel also includes a chip on film overlapping with a portion of the display panel and having second lines, an anisotropic conductive film provided between the chip on film and the display panel connecting the first lines and the second lines, and a coating layer covering the bending area and one end of the chip on film. In such a device, lines of the chip on film may be prevented from being corroded as they may be spaced apart from an edge of an insulating film.

Abstract: A display device including a display panel including a substrate, pixels provided on the substrate, and first lines connected to the pixels, the display device having a bending area where the display panel is bent. The display panel also includes a chip on film overlapping with a portion of the display panel and having second lines, an anisotropic conductive film provided between the chip on film and the display panel connecting the first lines and the second lines, and a coating layer covering the bending area and one end of the chip on film. In such a device, lines of the chip on film may be prevented from being corroded as they may be spaced apart from an edge of an insulating film.

Abstract: A display device includes a display panel including a substrate, pixels provided on the substrate, and first lines connected to the pixels, the display device having a bending area where the display panel is bent. The display panel also includes a chip on film overlapping with a portion of the display panel and having second lines, an anisotropic conductive film provided between the chip on film and the display panel connecting the first lines and the second lines, and a coating layer covering the bending area and one end of the chip on film. In such a device, lines of the chip on film may be prevented from being corroded as they may be spaced apart from an edge of an insulating film.

Abstract: A method of manufacturing iron powder configured for improving a recovery rate of chromium using ingot including chromium in a content suitably higher than a target content at the time of manufacturing iron powder including chromium, may include preparing ingot further including chromium (Cr) so that a content of chromium (Cr) in the ingot is 1 to 30% higher than a target content of chromium (Cr) in finally produced iron powder; dissolving the ingot to prepare molten steel; forming iron powder by performing water atomization on the molten steel; and adjusting a content of carbon (C) in the iron powder by performing reduction treatment on the iron powder.

Abstract: A display device includes a display panel including a substrate, pixels provided on the substrate, and first lines connected to the pixels, the display device having a bending area where the display panel is bent. The display panel also includes a chip on film overlapping with a portion of the display panel and having second lines, an anisotropic conductive film provided between the chip on film and the display panel connecting the first lines and the second lines, and a coating layer covering the bending area and one end of the chip on film. In such a device, lines of the chip on film may be prevented from being corroded as they may be spaced apart from an edge of an insulating film.

Abstract: A display device includes a display panel including a bendable display panel including a substrate and a plurality of pad portions on the substrate. The substrate includes a cutout between adjacent pad portions of the plurality of pad portions.

Abstract: Disclosed herein is a computer-executable method for managing customers within a group, which is performed by a customer management server connected to at least two terminals. The method includes creating a transaction group in which a seller and a purchaser participate and a commodity or service is traded through a group point dependent on a group, providing the purchaser with an evaluation participation opportunity by providing the purchaser with an evaluation point when the purchase of the commodity or service is completed, receiving evaluation for the commodity or service from the purchaser and requesting an evaluation response according to the evaluation from the seller, and returning the evaluation point to the seller when the evaluation response is received and providing the purchaser with a group point according to the evaluation under the control of the seller.

Abstract: A work object processing apparatus includes a memory unit configured to include a user memory region associated with user information, a message thread memory region accessible through the user information and associated with a message thread, and a work object memory region accessible through the message thread and associated with a work object, a message thread processing unit configured to receive a work object, including a work producer, a work processor, and work contents, through a chat room associated with a message thread and to process work object operation on the message thread, and a work object processing unit configured to process a work object state of the work object changed in a work processing diagram depending on a work interaction between the work producer and the work processor.

Abstract: The present invention relates to a camera module, which comprises a packaged image sensor, an IR filter, a lens and a holder for holding these components and has a reduced overall size and height. A camera module according to the present invention comprises an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package. At this time, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the connecting portion is formed with an inner stepped portion so as to be attached to a peripheral portion of a top surface and a lateral surface of the translucent substrate.

Abstract: Provided are a semiconductor package, a method of fabricating the same, and a semiconductor package module for an image sensor The semiconductor package includes a mounting portion on which a semiconductor chip is mounted; a semiconductor chip including a plurality of bonding pads disposed along an edge thereof, wherein the semiconductor chip adhered onto the mounting portion; a plurality of leads spaced apart from a sidewall of the semiconductor chip and having a greater height than the semiconductor chip; an encapsulant for fixing the mounting portion and the leads and encapsulating a bottom surface and a sidewall of the semiconductor package and exposing top and bottom surfaces of the leads; bonding wires for connecting the bonding pads of the semiconductor chip with the exposed top surfaces of the leads; and a transparent plate adhered onto the leads a predetermined space apart from the semiconductor chip.

Abstract: The present invention relates to a camera module, which comprises a packaged image sensor, an IR filter, a lens and a holder for holding these components and has a reduced overall size and height. A camera module according to the present invention comprises an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package. At this time, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the connecting portion is formed with an inner stepped portion so as to be attached to a peripheral portion of a top surface and a lateral surface of the translucent substrate.