Abstract: A coil electronic component may include a magnetic body including first and second surfaces facing each other in a first direction, third and fourth surfaces facing each other in a second direction and connecting the first surface and the second surface, and fifth and sixth surfaces facing each other in a third direction and connecting the first surface and the second surface, a coil embedded in the magnetic body, a first external electrode disposed on the sixth surface and extending onto a portion of the first surface and connected to the coil, a second external electrode disposed on the sixth surface and extending onto a portion of the second surface and connected to the coil, a first insulation layer covering the first external electrode on the first surface of the magnetic body, and a second insulation layer covering the second external electrode on the second surface of the magnetic body.

Abstract: A coil component includes a body including one surface and a plurality of side surfaces respectively connected to the one surface, a coil portion disposed within the body, and a lead-out portion disposed within the body and connected to the coil portion. The body includes a groove portion disposed in a corner where two adjacent side surfaces of the plurality of side surfaces of the body are in contact with each other. The groove portion has a width narrower than a width of the body, and extends from a portion of the lead-out portion.

Abstract: The present invention relates to a magnesium-based alloy, and to a method for producing same. The method comprises the steps of: melting a magnesium alloy into a liquid state; adding a silicon compound to said molten magnesium alloy; exhausting the silicon compound through a full reaction between said molten magnesium alloy and said added silicon compound such that the silicon compound does not substantially remain in the magnesium alloy; and exhausting the silicon produced as a result of said exhaustion in the precious step such that the silicon may not substantially remain in said magnesium alloy.

Abstract: The present invention relates to a magnesium-based alloy, and to a method for producing same. The method comprises the steps of: melting a magnesium alloy into a liquid state; adding a silicon compound to said molten magnesium alloy; exhausting the silicon compound through a full reaction between said molten magnesium alloy and said added silicon compound such that the silicon compound does not substantially remain in the magnesium alloy; and exhausting the silicon produced as a result of said exhaustion in the precious step such that the silicon may not substantially remain in said magnesium alloy.

Abstract: Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.

Abstract: Disclosed herein are a stacked chip device including: a stacked body in which a plurality of sheets having an internal electrode made of a conductive material are stacked; external electrodes provided at both sides of the stacked body; and connection electrodes extending from the internal electrode and electrically connecting the internal electrode with the external electrodes, wherein the connection electrodes include: a plating solution permeation preventing section extending from the internal electrode, however, extending with a thickness smaller than the thickness of the internal electrode; and a contact reinforcement section extending from the plating solution permeation preventing section, however, extending in the form in which the thickness thereof is gradually extended toward the external electrode, and a manufacturing method thereof.