Abstract: A system for differentiating quality of service (QoS) in inter-microservice communication according to an embodiment of the present disclosure includes a network control unit generating a QoS-aware path for guaranteeing QoS between microservices; a service registration unit registering information about the QoS-aware path between the microservices; and when it is necessary to guarantee the quality of service of messages received from a sending microservice, a communication processing unit identifying the QoS-aware path between the sending microservice and a receiving microservice from the information on the registered QoS-aware path, and processing the inter-microservice communication to allow the message to be transferred to the receiving microservice through the identified QoS path.

Abstract: A vehicle-to-everything (V2X) communication-based electronic toll collection system (ETCS) according to an embodiment of the present invention includes at least one roadside unit (RSU), a token issuer checking a de-identified token of a vehicle by communicating with an on-board unit (OBU) of the vehicle via the at least one roadside unit, and a clearing house communicating with the token issuer and charging a toll to a driver/owner of the vehicle. The token issuer generates toll information of the vehicle based on the de-identified token of the vehicle and location information of the at least one roadside unit involved in checking the de-identified token.

Abstract: A display device includes a display panel. The display panel includes sub-pixels. A driver converts first frame data corresponding to a first pixel arrangement of the sub-pixels into second frame data corresponding to a second pixel arrangement and provides data signals corresponding to second frame data to the sub-pixels having the second pixel arrangement. The driver includes a padding circuit and a rendering circuit. The padding circuit converts the first frame data into padding data by adding a padding value to at least one of a front end and a rear end of each line data of the first frame data. The rendering circuit generates the second frame data by applying a rendering filter to the padding data.

Abstract: The present disclosure relates to a thermosetting composition, an optical member formed therefrom, and a display device, the composition comprising a thermosetting resin, gas-containing particles and a monomer or an oligomer having two or more thermosetting functional groups, thereby having optical effects such as a low refractive index of 1.40 or less on light with a wavelength of 450 nm, high light transmittance, and low haze.

Abstract: An antenna substrate includes: a first insulating layer surrounding a cavity; a second insulating layer of which at least a portion is disposed in the cavity and containing an insulating material different from an insulating material of the first insulating layer; a first patch antenna having one surface facing the first insulating layer by an amount greater than half of an area of the first patch antenna; and a second patch antenna having one surface facing the cavity by an amount greater than half of an area of the second patch antenna.

Abstract: An antenna substrate includes a body in which a plurality of insulating layers are stacked, a first antenna layer including a plurality of first pattern layers disposed on the plurality of insulating layers and a plurality of first conductive via layer penetrating through the plurality of insulating layers to connect the plurality of first pattern layers in a stacking direction of the plurality of insulating layers and having a bar shape, and a second antenna layer extending from at least one of an uppermost portion or a lowermost portion of the first antenna layer on the insulating layer of the body.

Abstract: An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.

Abstract: The present invention can provide an apparatus and a method for non-contact measuring momentum, the apparatus and the method being capable of quantitatively measuring the dynamic activity and static activity of a subject by using a plurality of IR-UWB radars and, particularly, capable of measuring, in real time, some activities of the human body and general activity of the human body by distinguishing moving activity of the subject from non-moving activity. Therefore, the activity of a subject is non-contact measured so as to minimize user inconvenience, thereby facilitating performance of an ADHD test even for a subject in a young age group, and thus ADHD can be diagnosed early.

Abstract: An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.

Abstract: An antenna substrate includes a body including an insulating material, a plurality of wiring layers stacked with each other in a first vertical direction in the body, and a plurality of first antenna layers stacked with each other in a third horizontal direction in the body. Each of the plurality of first antenna layers includes a plurality of conductive structures, each having a length in a second horizontal direction greater than a length in the third horizontal direction perpendicular to the second horizontal direction, that are stacked in the first vertical direction.

Abstract: An antenna substrate includes a body including an insulating material, a plurality of wiring layers stacked with each other in a first vertical direction in the body, and a plurality of first antenna layers stacked with each other in a third horizontal direction in the body. Each of the plurality of first antenna layers includes a plurality of conductive structures, each having a length in a second horizontal direction greater than a length in the third horizontal direction perpendicular to the second horizontal direction, that are stacked in the first vertical direction.

Abstract: A risk analysis apparatus and method are provided. According to one embodiment of the present disclosure, the risk analysis apparatus includes: at least one processor configured to: a risk factor collector configured to collect risk factors related to one or more authentication processes for authentication of a user of a client device in an authentication system; a risk analyzer configured to calculate a current risk score for the user based on the collected risk factors and calculate a total risk score based on a risk score history of the user and the current risk score based on the one or more authentication processes being successful; and an additional authentication requester configured to determine whether additional authentication of the user is required based on the current risk score and the total risk score and, request the client device for the additional authentication of the user based on the additional authentication being required.

Abstract: A printed circuit board includes a core layer having a first surface and a second surface opposing the first surface; a first built-up structure disposed on the first surface of the core layer; a second built-up structure disposed on the second surface of the core layer; and a first penetration portion penetrating the first built-up structure and the core layer and penetrating a portion of the second built-up structure. The first penetration portion has a step portion on at least a portion of a wall of the first penetration portion in the region of the first penetration portion penetrating the second built-up structure, and a region including the first penetration portion on a plane is configured as a flexible region.

Abstract: A vehicle NVH pad includes an outer pad, a support pad connected to the outer pad, and one or more inner pads pivotally connected to opposite sides of the support pad. The one or more inner pads may include a first inner pad pivotally connected to one side of the support pad through a first hinge connection and a second inner pad pivotally connected to an opposite side of the support pad through a second hinge connection.

Abstract: Disclosed is a printed circuit board including an insulating layer, a circuit layer formed on a lower surface of the insulating layer, and a metal post contacting the circuit layer and extending from the lower surface to an upper surface of the insulating layer. The printed circuit board is able to prevent shorts while components are mounted by forming a metal post to have a secured height tolerance to connect with a die and to be in a caved shape into the board.

Abstract: A vehicle NVH pad includes an outer pad, a support pad connected to the outer pad, and one or more inner pads pivotally connected to opposite sides of the support pad. The one or more inner pads may include a first inner pad pivotally connected to one side of the support pad through a first hinge connection and a second inner pad pivotally connected to an opposite side of the support pad through a second hinge connection.

Abstract: A risk analysis apparatus and method are provided. According to one embodiment of the present disclosure, the risk analysis apparatus includes: at least one processor configured to: a risk factor collector configured to collect risk factors related to one or more authentication processes for authentication of a user of a client device in an authentication system; a risk analyzer configured to calculate a current risk score for the user based on the collected risk factors and calculate a total risk score based on a risk score history of the user and the current risk score based on the one or more authentication processes being successful; and an additional authentication requester configured to determine whether additional authentication of the user is required based on the current risk score and the total risk score and, request the client device for the additional authentication of the user based on the additional authentication being required.

Abstract: Disclosed is a printed circuit board including an insulating layer, a circuit layer formed on a lower surface of the insulating layer, and a metal post contacting the circuit layer and extending from the lower surface to an upper surface of the insulating layer. The printed circuit board is able to prevent shorts while components are mounted by forming a metal post to have a secured height tolerance to connect with a die and to be in a caved shape into the board.

Abstract: Disclosed herein is a semiconductor package capable of stably implementing an interlayer bonding of a stacked board, the semiconductor package includes: a lower package having a chip module mounted thereon so as to be connected to a circuit pattern; an upper package stacked on the lower package and having an electrical device mounted thereon; and a bump receiving a tip of a solder ball electrically connecting the lower package and the upper package and coupled to the solder ball.

Abstract: The present invention relates to an electronic component embedded printed circuit board and a method for manufacturing the same. An electronic component embedded printed circuit board of the present invention includes a core having a cavity; an electronic component inserted in the cavity and having a bonding coating layer on an outer peripheral surface; insulating layers laminated on and under the core and in contact with the bonding coating layer; and circuit patterns provided on the insulating layers.