Patents by Inventor Hyun Mog YOU

Hyun Mog YOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
    Publication number: 20230142370
    Abstract: A semiconductor package manufacturing method is provided. The semiconductor package manufacturing method which uses a semiconductor package manufacturing apparatus including a chuck, a solder device configured to attach solder balls to a substrate provided on the chuck, and a scanning device configured to provide information about a shape of the substrate to the chuck, wherein the chuck comprises an adsorbing portion comprising a plurality of divided regions, each of which is configured to adsorb the substrate, and a driver configured to drive each of the plurality of divided regions, the semiconductor package manufacturing method comprising driving each of the plurality of divided regions to correspond to the shape of the substrate based on the information using the driver.
    Type: Application
    Filed: October 4, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwang Hyeon JEONG, Young Joo LEE, Young Bum KIM, Hyun Mog YOU, Dong Joon LEE, Chae Mook LIM, Woo Jung JUNG