Abstract: The present invention provides a metal paste for forming an electrically conductive layer comprising a metal solution in a reactive organic solvent having a heteroatom P, S, O, or N; metal powder; a binder; and a residual amount of a polar or non-polar viscosity modulating solvent. The metal paste composition according to the present invention has advantages in that it produces structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles. The metal paste also provides a silver paste, which can be economically prepared and has high adaptability to various surfaces.

Abstract: The present invention provides a silver paste for forming electrically conductive pattern comprising 0.1 to 60 wt % of a silver C0 to C12 aliphatic carboxylate; 1 to 80 wt % of silver powder; 0.1 to 15 wt % of a binder; and a residual organic solvent. The silver paste composition according to the present invention has advantages in that it produces micro-structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the electrically conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles.

Abstract: The present invention relates to solution type silver organo-sol ink for forming electrically conductive patterns. The present invention provides silver organo-sol ink of solution type for forming electrically conductive pattern comprising effective amount of silver aromatic carboxylate and a reactive organic solvents, which can form chelate or complex with silver, are, for example, organic solvents having keton, mercapto, carboxyl, aniline or sulfurous functional group, substituted or unsubstituted. By the present invention, silver organo-sol ink of solution type basically having higher content of silver is obtained. The solution type ink of the present invention can be used for forming conductive patterns in flat panel display such as plasma display panel(PDP) to reduce the numbers of steps for pattern forming drastically.

Abstract: The present invention relates to solution type silver organo-sol ink for forming electrically conductive patterns. The present invention provides silver organo-sol ink of solution type for forming electrically conductive pattern comprising effective amount of silver aromatic carboxylate and a reactive organic solvents, which can form chelate or complex with silver, are, for example, organic solvents having keton, mercapto, carboxyl, aniline or sulfurous functional group, substituted or unsubstituted. By the present invention, silver organo-sol ink of solution type basically having higher content of silver is obtained. The solution type ink of the present invention can be used for forming conductive patterns in flat panel display such as plasma display panel(PDP) to reduce the numbers of steps for pattern forming drastically.

Abstract: The present invention provides a silver paste for forming electrically conductive pattern comprising 0.1 to 60 wt % of a silver C0 to C12 aliphatic carboxylate; 1 to 80 wt % of silver powder; 0.1 to 15 wt % of a binder; and a residual organic solvent. The silver paste composition according to the present invention has advantages in that it produces micro-structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the electrically conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles.

Abstract: The present invention provides a metal paste for forming an electrically conductive layer comprising a metal solution in a reactive organic solvent having a heteroatom P, S, O, or N; metal powder; a binder; and a residual amount of a polar or non-polar viscosity modulating solvent. The metal paste composition according to the present invention has advantages in that it produces structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles. The metal paste also provides a silver paste, which can be economically prepared and has high adaptability to various surfaces.

Abstract: The present invention relates to solution type silver organo-sol ink for forming electrically conductive patterns. The present invention provides silver organo-sol ink of solution type for forming electrically conductive pattern comprising effective amount of silver CO to C16 aliphatic carboxylate saturated or unsaturated, linear or branched, unsubstituted or substituted with amino, nitro and/or hydroxy group(s) having 1 to 3 carboxyl groups or silver aromatic carboxylate; and organic solvent. By the present invention, silver organo-sol inks of solution type basically having higher content of silver for various reducing or metallizing temperatures are obtained. The solution type ink of the present invention can be used for forming conductive patterns in flat panel display such as plasma display panel(PDP) to reduce the numbers of steps for pattern forming.