Abstract: The present invention relates to a cooling module for a vehicle, and more particularly, to a cooling module for a vehicle including a condenser, a first radiator through which coolant for an engine flow, a second radiator through which coolant for electrical components flows, and an intercooler, and capable of evenly distributing air resistance of the front surface of the first radiator to secure an overall balance of an air volume distribution by disposing the condenser, the second radiator, and the first radiator in a flow direction of air or disposing the second radiator, the condenser, and the first radiator in this order, and disposing the intercooler on lower sides of the condenser and the second radiator, and capable of minimizing a gap of each heat exchange period by disposing the condenser C and the first radiator R to be in closely contact with the second radiator L.

Abstract: A low-temperature co-fired ceramics (LTCC) substrate includes a plurality of substrate units and at least one cutting pattern. The cutting pattern is disposed between neighboring two of the substrate units. A semiconductor package including the LTCC substrate is also disclosed.

Abstract: A low-temperature co-fired ceramics (LTCC) substrate includes a plurality of substrate units and at least one cutting pattern. The cutting pattern is disposed between neighboring two of the substrate units. A semiconductor package including the LTCC substrate is also disclosed.

Abstract: A method of manufacturing a low-temperature co-fired ceramics (LTCC) substrate includes the following steps of: preparing a plurality of ceramic sheets; forming a plurality of zones and at least one cutting pattern on each of the ceramic sheets, wherein the cutting pattern is formed between neighboring two of the zones; forming at least one conductive pattern on at least one of the ceramic sheets; and stacking the ceramic sheets.