Abstract: Disclosed is an ultrasonic cleaning apparatus, which generates uniform sound pressure across a wide area of a piezoelectric element without the sound pressure being concentrated into the middle of the piezoelectric element to thereby increase cleaning efficiency without damage of an object to be cleaned.

Abstract: Disclosed herein is a cleaning apparatus using ultrasonic waves. The cleaning apparatus to separate contaminations from a wafer includes a housing receiving an oscillator therein, and a rod coupled to a surface of the oscillator to transmit ultrasonic waves produced from the oscillator to a cleaning solution applied onto an upper surface of the wafer. The oscillator includes a piezoelectric device bonded to a diffusive layer consisting of a near-field region and a far-field region. The rod has a diameter-reduced portion to amplify the ultrasonic waves produced from the oscillator, thereby enabling the efficient removal of the contaminations on the wafer to be cleaned.

Abstract: Disclosed herein is a megasonic cleaning module. The megasonic cleaning module includes a vibrator having a piezoelectric element mounted therein for generating ultrasonic waves by the vibration of the piezoelectric element, a first vibratory rod having a diameter gradually decreased to concentrate the longitudinal ultrasonic waves generated from the vibrator, and a second vibratory rod for progressing the longitudinal ultrasonic waves, generated from the first vibratory rod, in the transverse direction. The size of the second vibratory rod at one side thereof where the second vibratory rod is coupled to the first vibratory rod is less than that of the second vibratory rod at the other side thereof, with the result that the longitudinal ultrasonic waves are not prevented from affecting the wafer.

Abstract: Disclosed herein is a megasonic cleaning module. The megasonic cleaning module includes a vibrator having a piezoelectric element mounted therein for generating ultrasonic waves by the vibration of the piezoelectric element, a first vibratory rod having a diameter gradually decreased to concentrate the longitudinal ultrasonic waves generated from the vibrator, and a second vibratory rod for progressing the longitudinal ultrasonic waves, generated from the first vibratory rod, in the transverse direction. The size of the second vibratory rod at one side thereof where the second vibratory rod is coupled to the first vibratory rod is less than that of the second vibratory rod at the other side thereof, with the result that the longitudinal ultrasonic waves are not prevented from affecting the wafer.

Abstract: Disclosed herein is a cleaning apparatus using ultrasonic waves. The cleaning apparatus to separate contaminations from a wafer includes a housing receiving an oscillator therein, and a rod coupled to a surface of the oscillator to transmit ultrasonic waves produced from the oscillator to a cleaning solution applied onto an upper surface of the wafer. The oscillator includes a piezo-electric device bonded to a diffusive layer consisting of a near-field region and a far-field region. The rod has a diameter-reduced portion to amplify the ultrasonic waves produced from the oscillator, thereby enabling the efficient removal of the contaminations on the wafer to be cleaned.

Abstract: The present invention relates to a micro-compressor equipped with plurality of compression means comprising a vibrating plate forming the outer wall of the pressure chamber, inlet valve and outlet valve attached to the vibrating plate. The compression means are operated by a certain number of piezo-actuators that are attached to the vibrating plate, inlet valve and outlet valve and perform the function of indraft, compression and exhaustion of working fluid. The piezo-actuators enable the swift operation and precise control in the micro-refrigerator with the size of semiconductor chip. The compression means do not alter the flowing direction of working fluid and the openings for the indraft and exhaustion of working fluid can be aligned in a straight line. As a result, plurality of compression means can be arranged in parallel to maximize the compression capacity.

Abstract: The present invention relates to an active micro cooler comprising: an evaporator which, directly attached to a heat source, vaporizes refrigerant; a compressor which inhales and compresses vaporized refrigerant gas; a condenser which condenses compressed refrigerant gas for condensed refrigerant to release heat; a conduit which directs condensed refrigerant to the evaporator; and a expansion valve which, mounted on the conduit, expands condensed refrigerant. The evaporator and the condenser each comprises a heat transfer enhancement device which is mounted on a plate element having walls on the circumference of the element and several channel connectors for transmitting refrigerant.