Patents by Inventor Hyun-seok Yang
Hyun-seok Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11959857Abstract: Provided is a Raman scattering measurement apparatus including a light source which emits light to smoke particles, a filter configured to block light which is incident to the smoke particles and passes through the particle and to allow Raman scattered light to pass therethrough, and a photodetector which detects the Raman scattered light passing through the filter in order to distinguish fire smoke generated due to a true fire from non-fire smoke generated due to daily life or industrial activity. The present invention also provides a fire determination apparatus including a unit which reads a Raman shift from Raman scattered light detected by the photodetector of the Raman scattering measurement apparatus, estimates a smoke component from the read Raman shift, and determines fire/non-fire from the estimated smoke component and a method thereof.Type: GrantFiled: September 17, 2021Date of Patent: April 16, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Hoe Sung Yang, Soo Cheol Kim, Hyun Seok Kim, Sang Hyun Mo, So Young Park, Kang Bok Lee, Kyu Won Han
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Patent number: 11937378Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.Type: GrantFiled: March 10, 2022Date of Patent: March 19, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Hyun Seok Yang
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Publication number: 20230337367Abstract: A method of manufacturing a printed circuit board includes: forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer; forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings; and removing the first and second resist films. The first and second openings have different widths in a cross-section.Type: ApplicationFiled: July 20, 2022Publication date: October 19, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Jeong JEON, Tae Hee YOO, Hyun Seok YANG, In Jae CHUNG
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Publication number: 20230092667Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.Type: ApplicationFiled: November 21, 2022Publication date: March 23, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Hyun Seok Yang
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Publication number: 20230086970Abstract: A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.Type: ApplicationFiled: March 10, 2022Publication date: March 23, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Hyun Seok Yang
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Publication number: 20220386473Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.Type: ApplicationFiled: March 1, 2022Publication date: December 1, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Jong Eun Park, Hyun Seok Yang, Sangik Cho, Hiroki Okada, Young Ook Cho, Mi Jeong Jeon, In Jae Chung
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Publication number: 20220217842Abstract: A printed circuit board includes a first insulating layer, a metal layer disposed on one surface of the first insulating layer, a first circuit layer disposed inside the first insulating layer and having one surface exposed to the one surface of the first insulating layer so as to be in contact with one surface of the metal layer, a second circuit layer in contact with the other surface of the metal layer, and a second insulating layer disposed on the one surface of the first insulating layer to cover the metal layer and the second circuit layer. The first and second circuit layers respectively include a metal different from the metal layer.Type: ApplicationFiled: October 14, 2021Publication date: July 7, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Jin Park, Young Ook Cho, Hyun Seok Yang, Ki Joo Sim, Won Seok Lee, Mi Jeong Jeon
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Patent number: 10655003Abstract: The present invention relates to a resin blend for a melting process, to a method for manufacturing a resin molding using same, and to a resin molding obtained thereby, the resin blend comprising a first resin and a second resin, wherein the second resin includes a polymer resin having at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic ring having 5 to 40 carbon atoms and an aromatic ring having 6 to 40 carbon atoms, and has, with the first resin, a melt viscosity difference of 0.1 to 3,000 Pa*s at a shear rate of 100 to 1,000 s?1 and a processing temperature of the resin mixture, and a glass transition temperature (Tg) difference of 10° C. to 150° C.Type: GrantFiled: October 14, 2011Date of Patent: May 19, 2020Assignee: LG CHEM, LTD.Inventors: Houng Sik Yoo, Jin Young Ryu, Hak Shin Kim, Eun Joo Choi, Young Jun Hong, Hyun Seok Yang
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Patent number: 10655002Abstract: Provided are a resin blend for forming a layer-separated structure, a pellet, a method of preparing a resin article using the same and a resin article. The resin blend may include a first resin, and a second resin that comprises a resin to which at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic group having 5 to 40 carbon atoms and an aromatic group having 6 to 40 carbon atoms is introduced, that has a difference in melt viscosity from the first resin of 0.1 to 3000 pa*s at a shear rate of 100 to 1000 s?1 and a processing temperature of the resin blend, and that has a difference in glass transition temperature from the first resin of 10° C. to 150° C. The resin blend can improve mechanical and surface characteristics of a resin article.Type: GrantFiled: April 12, 2013Date of Patent: May 19, 2020Assignee: LG CHEM, LTD.Inventors: Houng Sik Yoo, Jin Young Ryu, Hak Shin Kim, Eun Joo Choi, Young Jun Hong, Hyun Seok Yang
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Patent number: 9540179Abstract: A mobile robot for a cable includes a first gripper unit including a first main body, a first driving wheel unit disposed over the first main body and configured to have its wheels changed up and down, and a first support wheel unit disposed under the first main body; a second gripper unit including a second main body, a second driving wheel unit disposed over the second main body and configured to have its wheels changed up and down, and a second support wheel unit disposed under the second main body; and a link unit including first links fixed to the first gripper unit, second links fixed to the second gripper unit, and a link driving unit configured to control the angle of the first links and the second links that are fixed together by a main hinge unit so that they rotate at an angle.Type: GrantFiled: August 8, 2014Date of Patent: January 10, 2017Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITYInventors: Hyun Seok Yang, E Noch Oh
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Patent number: 9315658Abstract: Disclosed are an alkyl(meth)acrylate-based thermoplastic resin composition and a thermoplastic resin with modified scratch resistance and yellowness. The alkyl(meth)acrylate-based thermoplastic resin composition provides improved scratch resistance and low yellowness index while maintaining transparency, flowability, and impact strength, even when the total content of the vinyl cyan-based monomer contained in the resin composition is reduced to a level unattainable by conventional techniques, and the content of the alkyl(meth)acrylate-based monomer is increased.Type: GrantFiled: July 27, 2012Date of Patent: April 19, 2016Assignee: LG CHEM, LTD.Inventors: Hyun Seok Yang, Dae Woo Lee, Han Jong You, Chang Hun Han, Seong Lyong Kim
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Patent number: 9021900Abstract: Provided is an in-pipe inspection robot which moves along a path in a pipe to inspect suspected areas such as cracks in the pipe. An in-pipe inspection robot in accordance with an exemplary embodiment of the present invention has a configuration in which two or more operating units having a plurality of arms, which move forward and backward in a radial direction of a pipe, are connected to each other to move in a straight direction or to be bent relative to each other by means of a flexible link mechanism.Type: GrantFiled: September 6, 2012Date of Patent: May 5, 2015Assignee: Industry-Academic Cooperation Foundation Yonsei UniversityInventors: Hyun Seok Yang, Woong Sun Jeon
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Publication number: 20150044009Abstract: A mobile robot for a cable includes a first gripper unit including a first main body, a first driving wheel unit disposed over the first main body and configured to have its wheels changed up and down, and a first support wheel unit disposed under the first main body; a second gripper unit including a second main body, a second driving wheel unit disposed over the second main body and configured to have its wheels changed up and down, and a second support wheel unit disposed under the second main body; and a link unit including first links fixed to the first gripper unit, second links fixed to the second gripper unit, and a link driving unit configured to control the angle of the first links and the second links that are fixed together by a main hinge unit so that they rotate at an angle.Type: ApplicationFiled: August 8, 2014Publication date: February 12, 2015Inventors: Hyun Seok YANG, E Noch OH
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Publication number: 20140039104Abstract: Disclosed are an alkyl(meth)acrylate-based thermoplastic resin composition and a thermoplastic resin with modified scratch resistance and yellowness. The alkyl(meth)acrylate-based thermoplastic resin composition provides improved scratch resistance and low yellowness index while maintaining transparency, flowability, and impact strength, even when the total content of the vinyl cyan-based monomer contained in the resin composition is reduced to a level unattainable by conventional techniques, and the content of the alkyl(meth)acrylate-based monomer is increased.Type: ApplicationFiled: July 27, 2012Publication date: February 6, 2014Applicant: LG CHEM, LTD.Inventors: Hyun Seok Yang, Dae Woo Lee, Han Jong You, Chang Hun Han, Seong Lyong Kim
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Publication number: 20130330558Abstract: The present invention relates to a resin blend for a melting process, to a method for manufacturing a resin molding using same, and to a resin molding obtained thereby, the resin blend comprising a first resin and a second resin, wherein the second resin includes a polymer resin having at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic ring having 5 to 40 carbon atoms and an aromatic ring having 6 to 40 carbon atoms, and has, with the first resin, a melt viscosity difference of 0.1 to 3,000 Pa*s at a shear rate of 100 to 1,000 s?1 and a processing temperature of the resin mixture, and a glass transition temperature (Tg) difference of 10° C. to 150° C. The resin blend allows a resin molding to have enhanced mechanical properties and surface features, and exhibits the effects of reducing a processing time, and reducing production costs by eliminating an additional surface coating step.Type: ApplicationFiled: October 14, 2011Publication date: December 12, 2013Applicant: LG CHEM, LTD.Inventors: Houng Sik Yoo, Jin Young Ryu, Hak Shin Kim, Eun Joo Choi, Young Jun Hong, Hyun Seok Yang
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Publication number: 20130295397Abstract: Provided are a resin blend for forming a layer-separated structure, a pellet, a method of preparing a resin article using the same and a resin article. The resin blend may include a first resin, and a second resin that comprises a resin to which at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic group having 5 to 40 carbon atoms and an aromatic group having 6 to 40 carbon atoms is introduced, that has a difference in melt viscosity from the first resin of 0.1 to 3000 pa*s at a shear rate of 100 to 1000 s?1 and a processing temperature of the resin blend, and that has a difference in glass transition temperature from the first resin of 10° C. to 150° C. The resin blend can improve mechanical and surface characteristics of a resin article. Further, since coating or plating is not required for manufacturing a resin article, a manufacturing time and/or cost can be reduced, and productivity can be increased.Type: ApplicationFiled: April 12, 2013Publication date: November 7, 2013Inventors: Houng Sik YOO, Jin Young RYU, Hak Shin KIM, Eun Joo CHOI, Young Jun HONG, Hyun Seok YANG
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Publication number: 20130286325Abstract: Disclosed herein is a multi-layered light diffusion plate, in which the multi-layered light diffusion plate is manufactured by coextruding a transparent layer comprising an amorphous transparent thermoplastic resin and a light diffusion layer comprising an amorphous transparent thermoplastic resin and transparent particles, so that the manufacturing process thereof is simple and efficient, and which has excellent light transmissivity and light diffusivity, high brightness, and high brightness uniformity, thereby improving viewing angle characteristics, and to a liquid crystal display device comprising the same.Type: ApplicationFiled: June 24, 2013Publication date: October 31, 2013Inventors: Hyun-Seok Yang, Bong-keun Lee, Seo-Hwa Kim, Jae-Chan Park, Ju-Hwa Lee
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Patent number: 8508850Abstract: Disclosed herein is a multi-layered light diffusion plate, in which the multi-layered light diffusion plate is manufactured by coextruding a transparent layer comprising an amorphous transparent thermoplastic resin and a light diffusion layer comprising an amorphous transparent thermoplastic resin and transparent particles, so that the manufacturing process thereof is simple and efficient, and which has excellent light transmissivity and light diffusivity, high brightness, and high brightness uniformity, thereby improving viewing angle characteristics, and to a liquid crystal display device comprising the same.Type: GrantFiled: April 13, 2007Date of Patent: August 13, 2013Assignee: LG Chem, Ltd.Inventors: Hyun-Seok Yang, Bong-Keun Lee, Seo-Hwa Kim, Jae-Chan Park, Ju-Hwa Lee
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Publication number: 20130104676Abstract: Provided is an in-pipe inspection robot which moves along a path in a pipe to inspect suspected areas such as cracks in the pipe. An in-pipe inspection robot in accordance with an exemplary embodiment of the present invention has a configuration in which two or more operating units having a plurality of arms, which move forward and backward in a radial direction of a pipe, are connected to each other to move in a straight direction or to be bent relative to each other by means of a flexible link mechanism.Type: ApplicationFiled: September 6, 2012Publication date: May 2, 2013Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION YONSEI UNIVERSITYInventors: Hyun Seok YANG, Woong Sun JEON
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Patent number: 8235827Abstract: Disclosed is a compliant joint achieving passive compliance. The compliant joint includes a housing and a rotating member mutually rotatably provided; and a cam provided between the housing and the rotating member, and connected to the housing and the rotating member respectively. The cam is connected to the rotating member to rotate together with the rotation of the rotating member, or be independent of the rotating member so as to move in the axial direction of the rotating member separately from the rotating member. The cam is connected to the housing such that the cam can maintain the connection with the housing when external force below a designated value is applied to the rotating member, and release the connection with the housing in the case that external force more than the designated value is applied to the rotating member.Type: GrantFiled: January 23, 2009Date of Patent: August 7, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Young Bo Shim, Ja Woo Lee, Youn Baek Lee, Jeong Hun Kim, Yeon Taek Oh, Soo Sang Yang, Hyun Seok Yang, Dong Jun Hyun